using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached

Industry

CPC
H05K13/0482

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0482using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting device for mounting electronic compon...
- Patent number 12,089,340
- Issue date Sep 10, 2024
- HALLYS CORPORATION
- Hiroshi Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing a setup kit for a placement machine
- Patent number 10,750,651
- Issue date Aug 18, 2020
- Sick AG
- Danny Wernet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pick and place apparatus
- Patent number 8,038,191
- Issue date Oct 18, 2011
- Techwing Co., Ltd.
- Jae Gyun Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for fabricating a circuit board with a three d...
- Patent number 7,337,522
- Issue date Mar 4, 2008
- Legacy Electronics, Inc.
- Jason Engle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling integral type electronic component and integr...
- Patent number 6,825,055
- Issue date Nov 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring a plurality of integrated circuit devices i...
- Patent number 6,665,929
- Issue date Dec 23, 2003
- Cypress Semiconductor Corp.
- Larry N. Bright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component placement apparatus
- Patent number 6,557,247
- Issue date May 6, 2003
- Technology Development Associate Operations Limited
- John Michael Lowe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component alignment casing system
- Patent number 6,462,955
- Issue date Oct 8, 2002
- Miraco, Inc.
- Jonathan F. Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for transferring a plurality of integrated circuit device...
- Patent number 6,305,076
- Issue date Oct 23, 2001
- Cypress Semiconductor Corp.
- Larry N. Bright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Part mounting device, part mounting method, and storage medium stor...
- Patent number 6,085,408
- Issue date Jul 11, 2000
- Yamagata Casio Co., Ltd.
- Michishi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive alignment of components with micromachined tool
- Patent number 5,964,397
- Issue date Oct 12, 1999
- American Telephone and Telegraph Co.
- Mindaugas Fernand Dautartas
- G02 - OPTICS
Information Patent Grant
Method and apparatus for orienting miniature components
- Patent number 5,785,484
- Issue date Jul 28, 1998
- Electro Scientific Industries, Inc.
- Douglas J. Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device transfer apparatus
- Patent number 5,639,203
- Issue date Jun 17, 1997
- Lg Semicon Co., Ltd.
- Duk Hee Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for pushing chip components into holding plate
- Patent number 5,540,535
- Issue date Jul 30, 1996
- Murata Manufacturing Co., Ltd.
- Mitsuro Hamuro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for equipping printed circuited boards
- Patent number 5,495,661
- Issue date Mar 5, 1996
- Siemens Aktiengesellschaft
- Kurt Gromer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable pin carrier
- Patent number 5,373,626
- Issue date Dec 20, 1994
- Elco Corporation
- Frank C. Youngfleish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the assembly of microfabricated devices
- Patent number 5,355,577
- Issue date Oct 18, 1994
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device including a conductor truck foil
- Patent number 5,345,040
- Issue date Sep 6, 1994
- Robert Bosch GmbH
- Horst Stade
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Apparatus for joining a conductor track foil to an electrical compo...
- Patent number 5,289,629
- Issue date Mar 1, 1994
- Robert Bosch GmbH
- Horst Stade
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Press with pin detection for interference connectors
- Patent number 5,235,740
- Issue date Aug 17, 1993
- International Business Machines Corporation
- Elmer L. B. Kroeker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for joining a conductor track foil to an electrical component
- Patent number 5,193,270
- Issue date Mar 16, 1993
- Robert Bosch GmbH
- Horst Stade
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Modular system and method for populating circuit boards
- Patent number 5,117,555
- Issue date Jun 2, 1992
- International Business Machines Corporation
- Ronald E. Hunt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-spindle pick and place method and apparatus
- Patent number 5,040,291
- Issue date Aug 20, 1991
- Universal Instruments Corporation
- Stanley W. Janisiewicz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for applying surface-mounted electronic components to pri...
- Patent number 4,965,927
- Issue date Oct 30, 1990
- Eli Holzman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-dedicated pallet assembly for wave soldering packaged integrate...
- Patent number 4,964,560
- Issue date Oct 23, 1990
- Charles R. Wharff
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip mounting apparatus
- Patent number 4,914,809
- Issue date Apr 10, 1990
- Taiyo Yuden Co., Ltd.
- Kikuji Fukai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for inserting chip parts into a holding plate
- Patent number 4,903,393
- Issue date Feb 27, 1990
- Murata Manufacturing Co., Ltd.
- Hirokazu Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip alignment method
- Patent number 4,893,403
- Issue date Jan 16, 1990
- Hewlett-Packard Company
- Bruce Heflinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-dedicated pallet assembly for wave soldering packaged integrate...
- Patent number 4,871,106
- Issue date Oct 3, 1989
- Charles R. Wharff
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for mounting chips
- Patent number 4,868,979
- Issue date Sep 26, 1989
- Taiyo Yuden Co., Ltd.
- Hiroshi Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE, METHOD FOR MANUFACTURING ELEC...
- Publication number 20220232745
- Publication date Jul 21, 2022
- HALLYS CORPORATION
- Hiroshi AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A SETUP KIT FOR A PLACEMENT MACHINE
- Publication number 20190124808
- Publication date Apr 25, 2019
- SICK AG
- Danny WERNET
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL DEVICE OF ELECTRONIC COMPONENT MOUNTING MACHINE AND DATA IN...
- Publication number 20170325371
- Publication date Nov 9, 2017
- FUJI MACHINE MFG. CO., LTD.
- Shigeto OYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PICK AND PLACE APPARATUS
- Publication number 20080213078
- Publication date Sep 4, 2008
- TECHWING CO., LTD.
- Jae Gyun SHIM
- G01 - MEASURING TESTING
Information Patent Application
Multi-orifice collet for a pick-and-place machine
- Publication number 20070235496
- Publication date Oct 11, 2007
- Sundar A/L Natarajan Yoganandan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for fabricating a circuit board with a three d...
- Publication number 20060107524
- Publication date May 25, 2006
- Jason Engle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for selectively displacing holding devices and fitting head...
- Publication number 20050019146
- Publication date Jan 27, 2005
- Siemens Aktiengesellschaft
- Stefan Burger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for assembling integral type electronic device, and integral...
- Publication number 20050001315
- Publication date Jan 6, 2005
- Kazushi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for assembling integral type electronic component and integr...
- Publication number 20020028595
- Publication date Mar 7, 2002
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS BLOCK
- Publication number 20010047583
- Publication date Dec 6, 2001
- CORNELIS G.J. VAN DEN AKER
- H01 - BASIC ELECTRIC ELEMENTS

using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component mounting device for mounting electronic compon...

Method of preparing a setup kit for a placement machine

Pick and place apparatus

Method and apparatus for fabricating a circuit board with a three d...

Method for assembling integral type electronic component and integr...

Method for transferring a plurality of integrated circuit devices i...

Component placement apparatus

Component alignment casing system

Apparatus for transferring a plurality of integrated circuit device...

Part mounting device, part mounting method, and storage medium stor...

Passive alignment of components with micromachined tool

Method and apparatus for orienting miniature components

Semiconductor device transfer apparatus

Apparatus for pushing chip components into holding plate

Apparatus for equipping printed circuited boards

Removable pin carrier

Method and apparatus for the assembly of microfabricated devices

Device including a conductor truck foil

Apparatus for joining a conductor track foil to an electrical compo...

Press with pin detection for interference connectors

Method for joining a conductor track foil to an electrical component

Modular system and method for populating circuit boards

Multi-spindle pick and place method and apparatus

Apparatus for applying surface-mounted electronic components to pri...

Non-dedicated pallet assembly for wave soldering packaged integrate...

Chip mounting apparatus

Method for inserting chip parts into a holding plate

Chip alignment method

Non-dedicated pallet assembly for wave soldering packaged integrate...

Method of and apparatus for mounting chips

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT MOUNTING DEVICE, METHOD FOR MANUFACTURING ELEC...

METHOD OF PREPARING A SETUP KIT FOR A PLACEMENT MACHINE

CONTROL DEVICE OF ELECTRONIC COMPONENT MOUNTING MACHINE AND DATA IN...

PICK AND PLACE APPARATUS

Multi-orifice collet for a pick-and-place machine

Method and apparatus for fabricating a circuit board with a three d...

Device for selectively displacing holding devices and fitting head...

Method for assembling integral type electronic device, and integral...

Method for assembling integral type electronic component and integr...

PRESS BLOCK