Using vibration during delaminating

Industry

CPC
Y10T156/1121

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1121Using vibration during delaminating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Separation/recovery method for laminated film
- Patent number 11,987,036
- Issue date May 21, 2024
- DIC Corporation
- Shin-ichi Ohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 11,538,710
- Issue date Dec 27, 2022
- Disco Corporation
- Takatoshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing carrier plate
- Patent number 11,222,808
- Issue date Jan 11, 2022
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 10,933,618
- Issue date Mar 2, 2021
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Removal method of carrier plate
- Patent number 10,926,524
- Issue date Feb 23, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating multilayer systems
- Patent number 10,618,268
- Issue date Apr 14, 2020
- Saperatec GmbH
- Sebastian Kernbaum
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Peeling apparatus
- Patent number 10,507,637
- Issue date Dec 17, 2019
- Disco Corporation
- Kazuyuki Hinohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,470,317
- Issue date Nov 5, 2019
- Unimicron Technology Corp.
- Hsiang-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to extract an object from a base surface using...
- Patent number 10,384,433
- Issue date Aug 20, 2019
- Suma Consulting and Investments, Inc.
- Mauricio Ricardo Rodriguez
- E04 - BUILDING
Information Patent Grant
Support supply apparatus and method for supplying support
- Patent number 10,065,808
- Issue date Sep 4, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,984,927
- Issue date May 29, 2018
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene platelet fabrication method and graphene platelet fabricat...
- Patent number 9,944,530
- Issue date Apr 17, 2018
- RITEDIA CORPORATION
- I-Chiao Lin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
System and method for inducing vibration on a stack of non-ferrous...
- Patent number 9,856,097
- Issue date Jan 2, 2018
- GM Global Technology Operations LLC
- Nikolas I. Williams
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of sticking together and un-sticking two parts by means of a...
- Patent number 9,802,380
- Issue date Oct 31, 2017
- SNECMA
- Emmanuel Chichery
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lift-off method
- Patent number 9,531,154
- Issue date Dec 27, 2016
- Disco Corporation
- Tasuku Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming semiconductor
- Patent number 9,523,158
- Issue date Dec 20, 2016
- Applied Materials, Inc.
- Takao Yonehara
- C30 - CRYSTAL GROWTH
Information Patent Grant
Thermoplastic coating and removal using bonding interface with cata...
- Patent number 9,481,160
- Issue date Nov 1, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Device for stripping a product substrate from a carrier substrate
- Patent number 9,381,732
- Issue date Jul 5, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,196,535
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Mathias Vaupel
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for stripping a product substrate from a carrier substrate
- Patent number 9,186,877
- Issue date Nov 17, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for separating laminations
- Patent number 8,702,904
- Issue date Apr 22, 2014
- Branson Ultrasonics Corporation
- Guillermo Coto
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Thermoplastic coating and removal using bonding interface with cata...
- Patent number 8,580,337
- Issue date Nov 12, 2013
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and machine for separating liquid crystal panel and liner pad
- Patent number 8,470,129
- Issue date Jun 25, 2013
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Xingang Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semi-automated reworkability process for de-bonding a display
- Patent number 8,419,896
- Issue date Apr 16, 2013
- E. I. Du Pont de Nemours and Company
- Michael N. Ciliberti
- G02 - OPTICS
Information Patent Grant
Method and apparatus of removing weft of cord fabric for topping sheet
- Patent number 8,397,786
- Issue date Mar 19, 2013
- Toyo Tires & Rubber Co., Ltd.
- Tetsuo Tatara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stripping device and stripping method
- Patent number 8,377,256
- Issue date Feb 19, 2013
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and assembly for validating bond line
- Patent number 8,349,104
- Issue date Jan 8, 2013
- United Technologies Corporation
- John H. Vontell, Sr.
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stripping device and stripping method
- Patent number 8,302,651
- Issue date Nov 6, 2012
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus of removing weft of cord fabric for topping sheet
- Patent number 8,128,777
- Issue date Mar 6, 2012
- Toyo Tire & Rubber Co., Ltd.
- Tetsuo Tatara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interlayer film separation method
- Patent number 8,118,971
- Issue date Feb 21, 2012
- Nippon Sheet Glass Company, Limited
- Masahiro Hori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
FACILITY FOR SEPARATING LAYERS IN MULTILAYER SYSTEMS
- Publication number 20200238679
- Publication date Jul 30, 2020
- SAPERATEC GMBH
- Sebastian Kernbaum
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM AND METHOD FOR INDUCING VIBRATION ON A STACK OF NON-FERROUS...
- Publication number 20170355537
- Publication date Dec 14, 2017
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Nikolas I. WILLIAMS
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
- Publication number 20140367015
- Publication date Dec 18, 2014
- Mathias VAUPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING AN ATOMICALLY THIN MATERIAL FROM A SUBSTRATE
- Publication number 20140261999
- Publication date Sep 18, 2014
- John B. Stetson
- B32 - LAYERED PRODUCTS
Information Patent Application
Method For Separating Disks
- Publication number 20140144592
- Publication date May 29, 2014
- Branson Ultrasonics Corporation
- Guillermo Coto
- B32 - LAYERED PRODUCTS
Information Patent Application
GRAPHENE PLATELET FABRICATION METHOD AND GRAPHENE PLATELET FABRICAT...
- Publication number 20140106153
- Publication date Apr 17, 2014
- RITEDIA CORPORATION
- I-Chiao LIN
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHODS AND SYSTEM FOR PRODUCING ON-DEMAND REDUCTION IN COUPLING ST...
- Publication number 20140034246
- Publication date Feb 6, 2014
- Siband LLC
- George B. Kenney
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...
- Publication number 20140034247
- Publication date Feb 6, 2014
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele SJONG
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF STICKING TOGETHER AND UN-STICKING TWO PARTS BY MEANS OF A...
- Publication number 20140030108
- Publication date Jan 30, 2014
- SNECMA
- Emmanuel CHICHERY
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...
- Publication number 20130340947
- Publication date Dec 26, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
Ultrathin Wafer Debonding Systems
- Publication number 20130105090
- Publication date May 2, 2013
- Masahiro Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING LAMINATIONS
- Publication number 20130032297
- Publication date Feb 7, 2013
- Branson Ultrasonics Corporation
- Guillermo Coto
- B32 - LAYERED PRODUCTS
Information Patent Application
STRIPPING DEVICE AND STRIPPING METHOD
- Publication number 20130000852
- Publication date Jan 3, 2013
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE
- Publication number 20120152465
- Publication date Jun 21, 2012
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
STRIPPING DEVICE AND STRIPPING METHOD
- Publication number 20110259527
- Publication date Oct 27, 2011
- Tokyo Ohka Kogyo Co., Ltd.
- Kimihiro Nakada
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS OF REMOVING WEFT OF CORD FABRIC FOR TOPPING SHEET
- Publication number 20110225783
- Publication date Sep 22, 2011
- Toyo Tire & Rubber Co., Ltd.
- Tetsuo Tatara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMI-AUTOMATED REWORKABILITY PROCESS FOR DE-BONDING A DISPLAY
- Publication number 20110180218
- Publication date Jul 28, 2011
- E.I. du Pont de Nemours and Company
- Michael N. Ciliberti
- G02 - OPTICS
Information Patent Application
THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...
- Publication number 20110114260
- Publication date May 19, 2011
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE F...
- Publication number 20110048641
- Publication date Mar 3, 2011
- Nitto Denko Corporation
- Toshimasa SUGIMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
Interlayer Film Separation Solution and Interlayer Film Separation...
- Publication number 20100206005
- Publication date Aug 19, 2010
- Nippon Sheet Glass Company, Limited
- Masahiro Hori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and assembly for validating bond line
- Publication number 20100015455
- Publication date Jan 21, 2010
- United Technologies Corporation
- John H. Vontell
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Auxiliary fixture for debonding sliders and method for manufacturin...
- Publication number 20090277591
- Publication date Nov 12, 2009
- SAE MAGNETICS (H. K) LTD.
- ShiXing Zhao
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD AND APPARATUS OF REMOVING WEFT OF CORD FABRIC FOR TOPPING SHEET
- Publication number 20090249597
- Publication date Oct 8, 2009
- Toyo Tire & Rubber Co., Ltd.
- Tetsuo Tatara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
VIBRATION-INDUCED DIE DETACHMENT SYSTEM
- Publication number 20090032186
- Publication date Feb 5, 2009
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING APPARATUS, SEPARATING/TAKING-OUT APPARATUS, PROCESSING A...
- Publication number 20080223520
- Publication date Sep 18, 2008
- Kabushiki Kaisha Toshiba
- Kiminori Toya
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PROCESS FOR FORMING A PATTERNED THIN FILM STRUCTURE ON A SUBSTRATE
- Publication number 20080075839
- Publication date Mar 27, 2008
- Jeanne E. Haubrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for detaching a semiconductor chip from a foil and device fo...
- Publication number 20070228539
- Publication date Oct 4, 2007
- Unaxis International Trading Ltd., a Swiss Corporation
- Jonathan Medding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of separating adhesive-bonded body
- Publication number 20070062643
- Publication date Mar 22, 2007
- Yoshihiko Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for the production of a partially metallized carrier substrate
- Publication number 20070044912
- Publication date Mar 1, 2007
- Stephan Trassl
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
Method for detaching a semiconductor chip from a foil and apparatus...
- Publication number 20050224965
- Publication date Oct 13, 2005
- Unaxis International Trading Ltd
- Jonathan Medding
- H01 - BASIC ELECTRIC ELEMENTS

Using vibration during delaminating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Separation/recovery method for laminated film

Carrier plate removing method

Method of removing carrier plate

Carrier plate removing method

Removal method of carrier plate

Method for separating multilayer systems

Peeling apparatus

Method for manufacturing circuit board

Apparatus and method to extract an object from a base surface using...

Support supply apparatus and method for supplying support

Method and apparatus for separating semiconductor devices from a wafer

Graphene platelet fabrication method and graphene platelet fabricat...

System and method for inducing vibration on a stack of non-ferrous...

Method of sticking together and un-sticking two parts by means of a...

Lift-off method

Methods and apparatus for forming semiconductor

Thermoplastic coating and removal using bonding interface with cata...

Device for stripping a product substrate from a carrier substrate

Method and apparatus for separating semiconductor devices from a wafer

Method for stripping a product substrate from a carrier substrate

Method and apparatus for separating laminations

Thermoplastic coating and removal using bonding interface with cata...

Method and machine for separating liquid crystal panel and liner pad

Semi-automated reworkability process for de-bonding a display

Method and apparatus of removing weft of cord fabric for topping sheet

Stripping device and stripping method

Method and assembly for validating bond line

Stripping device and stripping method

Method and apparatus of removing weft of cord fabric for topping sheet

Interlayer film separation method

Patents Applicationslast 30 patents

FACILITY FOR SEPARATING LAYERS IN MULTILAYER SYSTEMS

SYSTEM AND METHOD FOR INDUCING VIBRATION ON A STACK OF NON-FERROUS...

METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER

METHOD OF SEPARATING AN ATOMICALLY THIN MATERIAL FROM A SUBSTRATE

Method For Separating Disks

GRAPHENE PLATELET FABRICATION METHOD AND GRAPHENE PLATELET FABRICAT...

METHODS AND SYSTEM FOR PRODUCING ON-DEMAND REDUCTION IN COUPLING ST...

THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...

METHOD OF STICKING TOGETHER AND UN-STICKING TWO PARTS BY MEANS OF A...

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...

Ultrathin Wafer Debonding Systems

METHOD AND APPARATUS FOR SEPARATING LAMINATIONS

STRIPPING DEVICE AND STRIPPING METHOD

DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE

STRIPPING DEVICE AND STRIPPING METHOD

METHOD AND APPARATUS OF REMOVING WEFT OF CORD FABRIC FOR TOPPING SHEET

SEMI-AUTOMATED REWORKABILITY PROCESS FOR DE-BONDING A DISPLAY

THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...

METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE F...

Interlayer Film Separation Solution and Interlayer Film Separation...

Method and assembly for validating bond line

Auxiliary fixture for debonding sliders and method for manufacturin...

METHOD AND APPARATUS OF REMOVING WEFT OF CORD FABRIC FOR TOPPING SHEET

VIBRATION-INDUCED DIE DETACHMENT SYSTEM

SEPARATING APPARATUS, SEPARATING/TAKING-OUT APPARATUS, PROCESSING A...

PROCESS FOR FORMING A PATTERNED THIN FILM STRUCTURE ON A SUBSTRATE

Method for detaching a semiconductor chip from a foil and device fo...

Method of separating adhesive-bonded body

Method for the production of a partially metallized carrier substrate

Method for detaching a semiconductor chip from a foil and apparatus...