Vacuum delaminating means [e.g., vacuum chamber, etc.]

Industry

CPC
Y10T156/1944

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1944Vacuum delaminating means [e.g., vacuum chamber, etc.]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing apparatus of semiconductor device
- Patent number 12,131,921
- Issue date Oct 29, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for removing a backing from a ply of composite...
- Patent number 11,964,459
- Issue date Apr 23, 2024
- The Boeing Company
- Travis R. Adams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,901,201
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Shunichi Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,894,246
- Issue date Feb 6, 2024
- Tokyo Electron Limited
- Norio Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy removal device and method of driving the same
- Patent number 11,780,217
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Seoin Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detaching a die from an adhesive tape by air ejection
- Patent number 11,764,098
- Issue date Sep 19, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ngai Tat Man
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disassembling device
- Patent number 11,712,882
- Issue date Aug 1, 2023
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Feng Cen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Film peeling device and method of peeling film
- Patent number 11,660,805
- Issue date May 30, 2023
- Samsung Display Co., Ltd.
- Myunggil Choi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Processing apparatus
- Patent number 11,651,988
- Issue date May 16, 2023
- Disco Corporation
- Yoshinobu Saito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Systems and methods of automated film removal
- Patent number 11,648,738
- Issue date May 16, 2023
- General Electric Company
- Wendy Wenling Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Suction holder and holding mechanism for ring frame
- Patent number 11,538,712
- Issue date Dec 27, 2022
- Disco Corporation
- Masahiro Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for supporting debonding and debonding method using the same
- Patent number 11,479,030
- Issue date Oct 25, 2022
- Corning Incorporated
- Bokyung Kong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Film peeling device and method of peeling film
- Patent number 11,465,333
- Issue date Oct 11, 2022
- Samsung Display Co., Ltd.
- Myunggil Choi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Peeling apparatus
- Patent number 11,417,547
- Issue date Aug 16, 2022
- Disco Corporation
- Gentaro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 11,398,400
- Issue date Jul 26, 2022
- Disco Corporation
- Kohei Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device
- Patent number 11,335,586
- Issue date May 17, 2022
- Tokyo Electron Limited
- Takehiro Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separable electronic device and process method therefor
- Patent number 11,325,213
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Minjae Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film material, and peeling device and method for film material
- Patent number 11,318,729
- Issue date May 3, 2022
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Fei Qi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Transfer apparatus
- Patent number 11,322,386
- Issue date May 3, 2022
- Disco Corporation
- Bin Go
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Methods for processing a substrate
- Patent number 11,260,646
- Issue date Mar 1, 2022
- Corning Incorporated
- Christina Sue Bennett
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg debacker and method of layup
- Patent number 11,155,070
- Issue date Oct 26, 2021
- 7260297 Manitoba Ltd.
- Braden Pierce
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for peeling a liner away from a substrate
- Patent number 11,130,329
- Issue date Sep 28, 2021
- The Boeing Company
- Carl R. McIver
- B32 - LAYERED PRODUCTS
Information Patent Grant
Peel-off device
- Patent number 11,001,044
- Issue date May 11, 2021
- Nikkiso Co., Ltd.
- Toru Makino
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus of separating flexible panel from glass substrate and met...
- Patent number 10,868,282
- Issue date Dec 15, 2020
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Huan Xu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conduit and method of forming
- Patent number 10,828,456
- Issue date Nov 10, 2020
- Fisher & Paykel Heathcare Limited
- Daniel John Smith
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Methods for enhancing the specific uptake of botulinum neurotoxins...
- Patent number 10,725,025
- Issue date Jul 28, 2020
- Merz Pharma GmbH & Co. KGAA
- Claudia Jatzke
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Label applicator with label peeling function, robot, and label peel...
- Patent number 10,717,559
- Issue date Jul 21, 2020
- FANUC CORPORATION
- Yoshio Motowaki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus for manufacturing display module
- Patent number 10,677,784
- Issue date Jun 9, 2020
- LG Chem, Ltd.
- San Park
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Substrate separation system and method
- Patent number 10,622,332
- Issue date Apr 14, 2020
- Princo Corp.
- Chun-Hsiung Chou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Receiving system for components
- Patent number 10,529,601
- Issue date Jan 7, 2020
- Muehlbauer GmbH & Co. KG
- Konstantin Koch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM PEELING DEVICE AND METHOD OF PEELING FILM
- Publication number 20230018218
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Myunggil CHOI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONDUIT AND METHOD OF FORMING
- Publication number 20210016043
- Publication date Jan 21, 2021
- Fisher & Paykel Healthcare Limited
- Daniel John Smith
- B32 - LAYERED PRODUCTS
Information Patent Application
AUTOMATED COVERSLIPPER AND METHODS OF USE
- Publication number 20190258045
- Publication date Aug 22, 2019
- Ventana Medical Systems, Inc.
- Aaron Michael Ewoniuk
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD OF STACK
- Publication number 20170334187
- Publication date Nov 23, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo KUMAKURA
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
SUBSTRATE SEPARATION APPARATUS AND METHODKASN03436 US
- Publication number 20140352892
- Publication date Dec 4, 2014
- SAMSUNG DISPLAY CO. LTD.
- Seung Jun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
Separation Method and Separation Apparatus
- Publication number 20140332150
- Publication date Nov 13, 2014
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yoshiharu Hirakata
- B32 - LAYERED PRODUCTS
Information Patent Application
SUPPORTING MEMBER SEPARATION APPARATUS AND SUPPORTING MEMBER SEPARA...
- Publication number 20140318714
- Publication date Oct 30, 2014
- Shinji Takase
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...
- Publication number 20140299277
- Publication date Oct 9, 2014
- FUJI MACHINE MFG CO., LTD.
- Hideki Hosaka
- B32 - LAYERED PRODUCTS
Information Patent Application
DELAMINATION APPARATUS AND INLINE THERMAL IMAGING SYSTEM
- Publication number 20140290864
- Publication date Oct 2, 2014
- Kyung-Hyun Ahn
- B32 - LAYERED PRODUCTS
Information Patent Application
FILM RELEASING DEVICE AND FILM RELEASING METHOD
- Publication number 20140283999
- Publication date Sep 25, 2014
- FUJI XEROX CO., LTD
- Toshimasa SAKAE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...
- Publication number 20140262053
- Publication date Sep 18, 2014
- SKYWORKS SOLUTIONS, INC.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Application
DIE EJECT ASSEMBLY FOR DIE BONDER
- Publication number 20140251760
- Publication date Sep 11, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Ali Imran Amin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REMOVAL OF A LAYER
- Publication number 20140238617
- Publication date Aug 28, 2014
- GENERAL ELECTRIC COMPANY
- Sultan Shair
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR STRIPPING RELEASE PAPER FROM WORKPIECE
- Publication number 20140174671
- Publication date Jun 26, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- JIE NI
- B32 - LAYERED PRODUCTS
Information Patent Application
CARRIER SUBSTRATE REMOVING APPARATUS, DISPLAY APPARATUS MANUFACTURI...
- Publication number 20140138032
- Publication date May 22, 2014
- SAMSUNG DISPLAY CO., LTD.
- Jin-Keon Kweon
- B32 - LAYERED PRODUCTS
Information Patent Application
FILM PEELING APPARATUS AND FILM PEELING METHOD USING THE SAME
- Publication number 20140060748
- Publication date Mar 6, 2014
- Il-Young JEONG
- B32 - LAYERED PRODUCTS
Information Patent Application
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...
- Publication number 20140060751
- Publication date Mar 6, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Keita Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods of Separating Bonded Wafers
- Publication number 20140020818
- Publication date Jan 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...
- Publication number 20130327485
- Publication date Dec 12, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20130299098
- Publication date Nov 14, 2013
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING...
- Publication number 20130292062
- Publication date Nov 7, 2013
- TOKYO ELECTRON LIMITED
- Yasuharu Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEELING SYSTEM, PEELING METHOD, AND COMPUTER STORAGE MEDIUM
- Publication number 20130280825
- Publication date Oct 24, 2013
- TOKYO ELECTRON LIMITED
- Naoto Yoshitaka
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...
- Publication number 20130272837
- Publication date Oct 17, 2013
- Motoki Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS
- Publication number 20130255887
- Publication date Oct 3, 2013
- Corning Incorporated
- Michael Yoshiya Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRO...
- Publication number 20130240127
- Publication date Sep 19, 2013
- Kabushiki Kaisha Toshiba
- Daisuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REMOVING PRESSURE ADHESIVE LABELS FROM BAC...
- Publication number 20130240151
- Publication date Sep 19, 2013
- Khalid X. Hussain
- B32 - LAYERED PRODUCTS
Information Patent Application
Fiber Batt Reclaiming Method and Apparatus
- Publication number 20130186574
- Publication date Jul 25, 2013
- Kevin D. Baker
- B32 - LAYERED PRODUCTS
Information Patent Application
SEPARATION SYSTEM, SEPARATION METHOD, PROGRAM AND COMPUTER STORAGE...
- Publication number 20130146229
- Publication date Jun 13, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20130139972
- Publication date Jun 6, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
Vacuum Peeling Apparatus and Method
- Publication number 20130133838
- Publication date May 30, 2013
- Samsung Mobile Display Co., Ltd.
- Dong-Sul Kim
- B32 - LAYERED PRODUCTS

Vacuum delaminating means [e.g., vacuum chamber, etc.]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing apparatus of semiconductor device

Systems and methods for removing a backing from a ply of composite...

Semiconductor manufacturing apparatus and method of manufacturing s...

Bonding apparatus and bonding method

Dummy removal device and method of driving the same

Detaching a die from an adhesive tape by air ejection

Disassembling device

Film peeling device and method of peeling film

Processing apparatus

Systems and methods of automated film removal

Suction holder and holding mechanism for ring frame

Apparatus for supporting debonding and debonding method using the same

Film peeling device and method of peeling film

Peeling apparatus

Processing apparatus

Transfer device

Separable electronic device and process method therefor

Film material, and peeling device and method for film material

Transfer apparatus

Methods for processing a substrate

Prepreg debacker and method of layup

Apparatus and method for peeling a liner away from a substrate

Peel-off device

Apparatus of separating flexible panel from glass substrate and met...

Conduit and method of forming

Methods for enhancing the specific uptake of botulinum neurotoxins...

Label applicator with label peeling function, robot, and label peel...

Apparatus for manufacturing display module

Substrate separation system and method

Receiving system for components

Patents Applicationslast 30 patents

FILM PEELING DEVICE AND METHOD OF PEELING FILM

CONDUIT AND METHOD OF FORMING

AUTOMATED COVERSLIPPER AND METHODS OF USE

PROCESSING APPARATUS AND PROCESSING METHOD OF STACK

SUBSTRATE SEPARATION APPARATUS AND METHODKASN03436 US

Separation Method and Separation Apparatus

SUPPORTING MEMBER SEPARATION APPARATUS AND SUPPORTING MEMBER SEPARA...

WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...

DELAMINATION APPARATUS AND INLINE THERMAL IMAGING SYSTEM

FILM RELEASING DEVICE AND FILM RELEASING METHOD

DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...

DIE EJECT ASSEMBLY FOR DIE BONDER

SYSTEM AND METHOD FOR REMOVAL OF A LAYER

APPARATUS FOR STRIPPING RELEASE PAPER FROM WORKPIECE

CARRIER SUBSTRATE REMOVING APPARATUS, DISPLAY APPARATUS MANUFACTURI...

FILM PEELING APPARATUS AND FILM PEELING METHOD USING THE SAME

Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...

Systems and Methods of Separating Bonded Wafers

DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING...

PEELING SYSTEM, PEELING METHOD, AND COMPUTER STORAGE MEDIUM

SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...

HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRO...

APPARATUS AND METHOD FOR REMOVING PRESSURE ADHESIVE LABELS FROM BAC...

Fiber Batt Reclaiming Method and Apparatus

SEPARATION SYSTEM, SEPARATION METHOD, PROGRAM AND COMPUTER STORAGE...

METHOD FOR STRIPPING A WAFER FROM A CARRIER

Vacuum Peeling Apparatus and Method