Wire bonding, wire wrap

Industry

CPC
G05B2219/45033

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Parent Industries

GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

Current Industry

G05B2219/45033Wire bonding, wire wrap

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Automated fiber bundle placement apparatus
- Patent number 11,707,841
- Issue date Jul 25, 2023
- Tsudakoma Kogyo Kabushiki Kaisha
- Ren Uenaka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Automated machine for inserting wires into grommet cavity locations...
- Patent number 11,662,713
- Issue date May 30, 2023
- The Boeing Company
- Eerik J. Helmick
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for calibrating an ultrasonic bonding machine
- Patent number 11,646,291
- Issue date May 9, 2023
- Infineon Technologies AG
- Florian Eacock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating an automated machine for inserting wires into...
- Patent number 10,649,442
- Issue date May 12, 2020
- The Boeing Company
- Eerik J. Helmick
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Vision system for positioning a bonding tool
- Patent number 7,810,698
- Issue date Oct 12, 2010
- ASM Assembly Automation Ltd.
- Kwok Kee Chung
- G05 - CONTROLLING REGULATING
Information Patent Grant
Servo drive with high speed wrapping function
- Patent number 7,375,478
- Issue date May 20, 2008
- Delta Electronics, Inc.
- T. S. Cheng
- G05 - CONTROLLING REGULATING
Information Patent Grant
System and method to customize bond programs compensating integrate...
- Patent number 7,069,102
- Issue date Jun 27, 2006
- Texas Instruments Incorporated
- David J. Bon
- G05 - CONTROLLING REGULATING
Information Patent Grant
Image processing method, an image processing device and a bonding a...
- Patent number 6,917,699
- Issue date Jul 12, 2005
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool position measurement method, offset measurement method, refere...
- Patent number 6,542,783
- Issue date Apr 1, 2003
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 6,502,738
- Issue date Jan 7, 2003
- Kabushiki Kaisha Shinkawa
- Tooru Mochida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for determining magnet wire production die sets
- Patent number 6,487,470
- Issue date Nov 26, 2002
- General Electric Company
- John Michael Sedlak
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Work holder assembly
- Patent number 6,202,293
- Issue date Mar 20, 2001
- Visteon Global Technologies, Inc.
- Alfred Schaller
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wire bonding apparatus and bonding load correction method for the same
- Patent number 6,119,917
- Issue date Sep 19, 2000
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for changing the data setting modes in a bondi...
- Patent number 5,613,000
- Issue date Mar 18, 1997
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Teaching method and teaching system for a bonding coordinate
- Patent number 5,583,756
- Issue date Dec 10, 1996
- Kabushiki Kaisha Shinkawa
- Toshiaki Sasano
- G05 - CONTROLLING REGULATING
Information Patent Grant
Lead frame lead located for wire bonder
- Patent number 5,097,406
- Issue date Mar 17, 1992
- Texas Instruments Incorporated
- Mandayam A. Narasimhan
- G05 - CONTROLLING REGULATING
Information Patent Grant
wire bonding method and apparatus and method of producing semicondu...
- Patent number 5,060,841
- Issue date Oct 29, 1991
- Hitachi, Ltd.
- Yoshio Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant motion servo
- Patent number 4,817,848
- Issue date Apr 4, 1989
- Hughes Aircraft Company
- John B. Gabaldon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with means and method for automatic calibration u...
- Patent number 4,759,073
- Issue date Jul 19, 1988
- Kulicke & Soffa Industries, Inc.
- Gautam N. Shah
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wire bonding apparatus
- Patent number 4,444,349
- Issue date Apr 24, 1984
- Kulicke & Soffa Industries, Inc.
- Glenn B. Bilane
- G05 - CONTROLLING REGULATING
Information Patent Grant
High speed wire bonding method
- Patent number 4,340,166
- Issue date Jul 20, 1982
- Kulicke & Soffa Industries, Inc.
- Glenn B. Bilane
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wire bonding apparatus
- Patent number 4,266,710
- Issue date May 12, 1981
- Kulicke and Soffa Industries Inc.
- Glenn B. Bilane
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF OPERATING AN AUTOMATED MACHINE FOR INSERTING WIRES INTO...
- Publication number 20200233404
- Publication date Jul 23, 2020
- The Boeing Company
- Eerik J. Helmick
- G05 - CONTROLLING REGULATING
Information Patent Application
Method for Calibrating an Ultrasonic Bonding Machine
- Publication number 20200043883
- Publication date Feb 6, 2020
- Florian Eacock
- G05 - CONTROLLING REGULATING
Information Patent Application
Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die...
- Publication number 20140074280
- Publication date Mar 13, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Yoshihide ISHII
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
VISION SYSTEM FOR POSITIONING A BONDING TOOL
- Publication number 20100125348
- Publication date May 20, 2010
- Kwok Kee CHUNG
- G05 - CONTROLLING REGULATING
Information Patent Application
Servo drive with high speed wrapping function
- Publication number 20070176571
- Publication date Aug 2, 2007
- DELTA ELECTRONICS, INC.
- T.S. Cheng
- G05 - CONTROLLING REGULATING
Information Patent Application
SYSTEM AND METHOD TO CUSTOMIZE BOND PROGRAMS COMPENSATING INTEGRATE...
- Publication number 20060217817
- Publication date Sep 28, 2006
- David J. Bon
- G05 - CONTROLLING REGULATING
Information Patent Application
Image processing method, an image processing device and a bonding a...
- Publication number 20020166885
- Publication date Nov 14, 2002
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- G05 - CONTROLLING REGULATING
Information Patent Application
System and method to customize bond programs compensating integrate...
- Publication number 20010044660
- Publication date Nov 22, 2001
- David J. Bon
- G05 - CONTROLLING REGULATING
Information Patent Application
Tool position measurement method, offset measurement method, refere...
- Publication number 20010016786
- Publication date Aug 23, 2001
- KABUSHIKI KAISHA SHINKAWA
- Kuniyuki Takahashi
- G05 - CONTROLLING REGULATING
Information Patent Application
Wire bonding apparatus
- Publication number 20010002031
- Publication date May 31, 2001
- KABUSHIKI KAISHA SHINKAWA
- Tooru Mochida
- G05 - CONTROLLING REGULATING

Wire bonding, wire wrap

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Automated fiber bundle placement apparatus

Automated machine for inserting wires into grommet cavity locations...

Method for calibrating an ultrasonic bonding machine

Methods of operating an automated machine for inserting wires into...

Vision system for positioning a bonding tool

Servo drive with high speed wrapping function

System and method to customize bond programs compensating integrate...

Image processing method, an image processing device and a bonding a...

Tool position measurement method, offset measurement method, refere...

Wire bonding apparatus

Method and apparatus for determining magnet wire production die sets

Work holder assembly

Wire bonding apparatus and bonding load correction method for the same

Method and apparatus for changing the data setting modes in a bondi...

Teaching method and teaching system for a bonding coordinate

Lead frame lead located for wire bonder

wire bonding method and apparatus and method of producing semicondu...

Compliant motion servo

Bonding apparatus with means and method for automatic calibration u...

Wire bonding apparatus

High speed wire bonding method

Wire bonding apparatus

Patents Applicationslast 30 patents

METHODS OF OPERATING AN AUTOMATED MACHINE FOR INSERTING WIRES INTO...

Method for Calibrating an Ultrasonic Bonding Machine

Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die...

VISION SYSTEM FOR POSITIONING A BONDING TOOL

Servo drive with high speed wrapping function

SYSTEM AND METHOD TO CUSTOMIZE BOND PROGRAMS COMPENSATING INTEGRATE...

Image processing method, an image processing device and a bonding a...

System and method to customize bond programs compensating integrate...

Tool position measurement method, offset measurement method, refere...

Wire bonding apparatus