TREA

with a cutting blade mounted on a carriage

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Industry

  • CPC
  • B28D5/023
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/023with a cutting blade mounted on a carriage
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20210107180
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20200391410
    • Publication date Dec 17, 2020
    • Disco Corporation
    • Takeomi FUKUOKA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20180286757
    • Publication date Oct 4, 2018
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    METHOD OF CUTTING OUT GLASS PLATE AND POSITIONING CUT-OUT GLASS PLA...
    • Publication number 20180044220
    • Publication date Feb 15, 2018
    • BANDO KIKO CO., LTD.
    • Kazuaki BANDO
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WORKPIECE SUPPORT JIG
    • Publication number 20170076971
    • Publication date Mar 16, 2017
    • Disco Corporation
    • Takeomi Fukuoka
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor...
    • Publication number 20130014738
    • Publication date Jan 17, 2013
    • MEMC ELECTRONIC MATERIALS SPA
    • Paolo Molino
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WAFER SEPARATING METHOD
    • Publication number 20080299745
    • Publication date Dec 4, 2008
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Sawing Apparatus and a Control Method for Manufacturing Processes o...
    • Publication number 20070259483
    • Publication date Nov 8, 2007
    • Hanmi Semiconductor Co., Ltd.
    • Yong-Goo Lee
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Group encapsulated dicing chuck
    • Publication number 20070068504
    • Publication date Mar 29, 2007
    • Warren M. Farnworth
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Group encapsulated dicing chuck
    • Publication number 20070062511
    • Publication date Mar 22, 2007
    • Warren M. Farnworth
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Cutting machine
    • Publication number 20060112802
    • Publication date Jun 1, 2006
    • DISCO CORPORATION
    • Koichi Fujinami
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Group encapsulated dicing chuck
    • Publication number 20060065262
    • Publication date Mar 30, 2006
    • Warren M. Farnworth
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Group encapsulated dicing chuck
    • Publication number 20050186761
    • Publication date Aug 25, 2005
    • Warren M. Farnworth
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Semiconductor wafer processing method
    • Publication number 20050155954
    • Publication date Jul 21, 2005
    • DISCO CORPORATION
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Processing apparatus provided with backpressure sensor
    • Publication number 20050045009
    • Publication date Mar 3, 2005
    • Koichi Shigematsu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Finishing machine using laser beam
    • Publication number 20040164061
    • Publication date Aug 26, 2004
    • Masaya Takeuchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Group encapsulated dicing chuck
    • Publication number 20040031476
    • Publication date Feb 19, 2004
    • Warren M. Farnworth
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Method and apparatus for manufacturing electronic parts
    • Publication number 20040031136
    • Publication date Feb 19, 2004
    • ISHI TOOL & ENGINEERING CORPORATION
    • Mitoshi Ishii
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Work cutting apparatus and method for cutting work
    • Publication number 20030205119
    • Publication date Nov 6, 2003
    • SUMITOMO SPECIAL METALS CO., LTD.
    • Sadahiko Kondo
    • B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
  • Information Patent Application

    Cutting machine
    • Publication number 20030070520
    • Publication date Apr 17, 2003
    • Takayuki Gawazawa
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Coaxial spindle cutting saw
    • Publication number 20030056628
    • Publication date Mar 27, 2003
    • Eli Razon
    • B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
  • Information Patent Application

    Group encapsulated dicing chuck
    • Publication number 20020185121
    • Publication date Dec 12, 2002
    • Warren M. Farnworth
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Dicing machine with interlock
    • Publication number 20020166552
    • Publication date Nov 14, 2002
    • TOKYO SEIMITSU CO., LTD.
    • Tadashi Adachi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Cutting apparatus and cutting method
    • Publication number 20020160695
    • Publication date Oct 31, 2002
    • TOWA CORPORATION
    • Michio Osada
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Dual-cutting method devoid of useless strokes
    • Publication number 20020104422
    • Publication date Aug 8, 2002
    • Katsuharu Negishi
    • B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
  • Information Patent Application

    Method and apparatus for manufacturing electronic parts
    • Publication number 20020035782
    • Publication date Mar 28, 2002
    • ISHII TOOL & ENGINEERING CORPORATION
    • Mitoshi Ishii
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Alignment method and apparatus for aligning cutting blade
    • Publication number 20020025616
    • Publication date Feb 28, 2002
    • Masakado Kamigaki
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Semiconductor wafer cutting machine
    • Publication number 20010029938
    • Publication date Oct 18, 2001
    • Kazuhisa Arai
    • B28 - WORKING CEMENT, CLAY, OR STONE