TREA

with a magnetic layer

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  • CPC
  • H01F2017/0066
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Parent Industries

HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

Current Industry

H01F2017/0066with a magnetic layer
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240161957
    • Publication date May 16, 2024
    • PHOENIX PIONEER TECHNOLOGY CO., LTD.
    • Pao-Hung Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC THIN FILM INDUCTOR STRUCTURES
    • Publication number 20240162277
    • Publication date May 16, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Alan ROTH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20240153693
    • Publication date May 9, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuuki KAWAKAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240136111
    • Publication date Apr 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hyun KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240128016
    • Publication date Apr 18, 2024
    • Murata Manufacturing Co., Ltd.
    • Kazunori ANNEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER COIL COMPONENT
    • Publication number 20240079177
    • Publication date Mar 7, 2024
    • TDK Corporation
    • Yusuke NAGAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...
    • Publication number 20240006308
    • Publication date Jan 4, 2024
    • QUALCOMM Incorporated
    • Kai LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR ARRAY COMPONENT AND INDUCTOR ARRAY COMPONENT BUILT-IN SUBS...
    • Publication number 20230420180
    • Publication date Dec 28, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC COUPLING COIL ELEMENT
    • Publication number 20230395303
    • Publication date Dec 7, 2023
    • Taiyo Yuden Co., Ltd.
    • Natsuko SATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER COIL COMPONENT
    • Publication number 20230317342
    • Publication date Oct 5, 2023
    • TDK Corporation
    • Shinichi SATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multilayer Inductor Construction
    • Publication number 20230298807
    • Publication date Sep 21, 2023
    • Steward (Foshan) Magnetics Co., Ltd.
    • Jacken ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
    • Publication number 20230282406
    • Publication date Sep 7, 2023
    • Murata Manufacturing Co., Ltd.
    • Kouhei MATSUURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20230260696
    • Publication date Aug 17, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF INDUCTOR AND MANUFACTURING METHOD OF ELECTR...
    • Publication number 20230253150
    • Publication date Aug 10, 2023
    • FUJIFILM CORPORATION
    • Tatsuo MIKAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230238170
    • Publication date Jul 27, 2023
    • TDK Corporation
    • Yuuichi KAWAGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    A COIL ASSEMBLY AND METHOD OF TERMINATING A COIL TO A CIRCUIT BOARD
    • Publication number 20230059533
    • Publication date Feb 23, 2023
    • 3M Innovative Properties Company
    • Jinwook Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER COIL COMPONENT
    • Publication number 20230005654
    • Publication date Jan 5, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Atsuo Hirukawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20220392687
    • Publication date Dec 8, 2022
    • Murata Manufacturing Co., Ltd.
    • Keita MUNEUCHI
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    INDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF
    • Publication number 20220384091
    • Publication date Dec 1, 2022
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220310311
    • Publication date Sep 29, 2022
    • Murata Manufacturing Co., Ltd.
    • Ryuichiro TOMINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-LAYER INDUCTOR
    • Publication number 20220310299
    • Publication date Sep 29, 2022
    • TDK Corporation
    • Akihiko OIDE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC THIN FILM INDUCTOR STRUCTURES
    • Publication number 20220208953
    • Publication date Jun 30, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Alan ROTH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220189681
    • Publication date Jun 16, 2022
    • Taiyo Yuden Co., Ltd.
    • Hideaki HOSHINO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR
    • Publication number 20220165465
    • Publication date May 26, 2022
    • Nitto Denko Corporation
    • Keisuke OKUMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
    • Publication number 20220130748
    • Publication date Apr 28, 2022
    • Intel Corporation
    • Sai Vadlamani
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220108822
    • Publication date Apr 7, 2022
    • Murata Manufacturing Co., Ltd.
    • Masayuki OISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220102065
    • Publication date Mar 31, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Ju Hwan YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR COUPLED MAGNETIC VOLTAGE REGULATORS
    • Publication number 20220085142
    • Publication date Mar 17, 2022
    • Intel Corporation
    • Beomseok CHOI
    • G05 - CONTROLLING REGULATING
  • Information Patent Application

    METHOD FOR MANUFACTURING MULTILAYER INDUCTANCE COMPONENT
    • Publication number 20220068551
    • Publication date Mar 3, 2022
    • RALEC ELECTRONIC CORPORATION
    • Tim Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20220068546
    • Publication date Mar 3, 2022
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS