with a ring blade having an inside cutting edge

Industry

CPC
B28D5/028

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/028with a ring blade having an inside cutting edge

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating silicon semiconductor discrete wafer
- Patent number 6,332,833
- Issue date Dec 25, 2001
- Naoetsu Electronics Company
- Hisashi Ohshima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for fabricating silicon semiconductor discrete wafer
- Patent number 6,066,562
- Issue date May 23, 2000
- Naoetsu Electronics Company
- Hisashi Ohshima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of producing semiconductor wafers
- Patent number 5,975,990
- Issue date Nov 2, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Hanifi Malcok
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for slicing a work
- Patent number 5,902,171
- Issue date May 11, 1999
- Toyo Advanced Technologies Co Ltd.
- Tatsumi Hamasaki
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing machine with built-in grinder
- Patent number 5,836,808
- Issue date Nov 17, 1998
- Tokyo Seimitsu Co., Ltd.
- Susumu Sawafuji
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ingot trimming method and apparatus
- Patent number 5,832,914
- Issue date Nov 10, 1998
- SEH America, Inc.
- Richard M. Aydelott
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for slicing workpiece
- Patent number 5,667,423
- Issue date Sep 16, 1997
- Shin-Etsu Handotai Co., Ltd.
- Kirio Itoi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for manufacturing wafer
- Patent number 5,582,536
- Issue date Dec 10, 1996
- Tokyo Seimitsu Co., Ltd.
- Takeshi Kagamida
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for detecting blade flexure and blade flexure con...
- Patent number 5,571,040
- Issue date Nov 5, 1996
- Toyo Advanced Technologies Co., Ltd.
- Keishi Kawaguchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for slicing semiconductor wafers
- Patent number 5,524,604
- Issue date Jun 11, 1996
- Tokyo Seimitsu Co., Ltd.
- Katsuo Honda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of slicing a semiconductor wafer and an apparatus
- Patent number 5,458,526
- Issue date Oct 17, 1995
- Tokyo Seimitsu Co., Ltd.
- Shuichi Tsukada
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Inner diameter saw slicing machine
- Patent number 5,413,521
- Issue date May 9, 1995
- Shin-Etsu Handotai Company, Ltd.
- Seiichi Terashima
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing machine
- Patent number 5,383,444
- Issue date Jan 24, 1995
- Mitsubishi Materials Corporation
- Yoshihiko Kimura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for the rotary sawing of brittle and hard mate...
- Patent number 5,351,446
- Issue date Oct 4, 1994
- Wacker-Chemtronic Gesellschaft fur Elecktronik-Grundstoffe mbH
- Karlheinz Langsdorf
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer slicing and grinding machine and a method of slicing and grin...
- Patent number 5,329,733
- Issue date Jul 19, 1994
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of and an apparatus for slicing a single crystal ingot using...
- Patent number 5,313,741
- Issue date May 24, 1994
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing machine employing an axial force to provide rigidity to a r...
- Patent number 5,287,843
- Issue date Feb 22, 1994
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and arrangement for subdividing semiconductor bars into semi...
- Patent number 5,285,597
- Issue date Feb 15, 1994
- GMN Georg Muller Nurnberg AG
- Hubert Hinzen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of using an ID saw slicing machine for slicing a single crys...
- Patent number 5,226,403
- Issue date Jul 13, 1993
- Shin-Etsu Handotai Co., Ltd.
- Kohei Toyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Inside diameter blade
- Patent number 5,218,948
- Issue date Jun 15, 1993
- Mitsubishi Kinzoku Kabushiki Kaisha
- Shigeru Mazaki
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer slicing and grinding machine and a method of slicing and grin...
- Patent number 5,189,843
- Issue date Mar 2, 1993
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer slicing and grinding system
- Patent number 5,185,956
- Issue date Feb 16, 1993
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing machine and a slicing method by the same
- Patent number 5,174,270
- Issue date Dec 29, 1992
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Mounting for an internal diameter saw blade
- Patent number 5,148,797
- Issue date Sep 22, 1992
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for resharpening saws especially used for making...
- Patent number 5,144,938
- Issue date Sep 8, 1992
- Elektronik-Grundstoffe mbH
- Helmut Seeburger
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for loading and re-slicing semiconductor wafer
- Patent number 5,142,756
- Issue date Sep 1, 1992
- Naoetsu Electronics Company
- Tadashi Ibaraki
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing and grinding system for a wafer slicing machine
- Patent number 5,111,622
- Issue date May 12, 1992
- Silicon Technology Corporation
- Robert E. Steere
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing method by a slicing machine
- Patent number 5,074,276
- Issue date Dec 24, 1991
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of monitoring the path of an annular blade through a semicon...
- Patent number 5,036,274
- Issue date Jul 30, 1991
- Helmut Seeburger
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for slicing crystalline wafers aided by magnet...
- Patent number 5,030,910
- Issue date Jul 9, 1991
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
- Joachim Junge
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Internal diameter cutting blades and methods
- Publication number 20040038629
- Publication date Feb 26, 2004
- SEH America, Inc.
- Jesse B. Griggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with a ring blade having an inside cutting edge

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating silicon semiconductor discrete wafer

Method for fabricating silicon semiconductor discrete wafer

Method of producing semiconductor wafers

Method and apparatus for slicing a work

Slicing machine with built-in grinder

Ingot trimming method and apparatus

Method and apparatus for slicing workpiece

Apparatus and method for manufacturing wafer

Method and device for detecting blade flexure and blade flexure con...

Method and apparatus for slicing semiconductor wafers

Method of slicing a semiconductor wafer and an apparatus

Inner diameter saw slicing machine

Slicing machine

Method and apparatus for the rotary sawing of brittle and hard mate...

Wafer slicing and grinding machine and a method of slicing and grin...

Method of and an apparatus for slicing a single crystal ingot using...

Slicing machine employing an axial force to provide rigidity to a r...

Method and arrangement for subdividing semiconductor bars into semi...

Method of using an ID saw slicing machine for slicing a single crys...

Inside diameter blade

Wafer slicing and grinding machine and a method of slicing and grin...

Wafer slicing and grinding system

Slicing machine and a slicing method by the same

Mounting for an internal diameter saw blade

Method and device for resharpening saws especially used for making...

Apparatus for loading and re-slicing semiconductor wafer

Slicing and grinding system for a wafer slicing machine

Slicing method by a slicing machine

Method of monitoring the path of an annular blade through a semicon...

Method and apparatus for slicing crystalline wafers aided by magnet...

Patents Applicationslast 30 patents

Internal diameter cutting blades and methods