with bending or straightening of the terminal leads

Industry

CPC
H05K13/023

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/023with bending or straightening of the terminal leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tape feeder
- Patent number 11,395,447
- Issue date Jul 19, 2022
- FUJI CORPORATION
- Shigeo Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component supply device and component mounting device
- Patent number 11,357,144
- Issue date Jun 7, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Component feeder
- Patent number 10,905,040
- Issue date Jan 26, 2021
- FUJI CORPORATION
- Satoru Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead pin rectifying apparatus and lead pin rectifying method
- Patent number 9,352,381
- Issue date May 31, 2016
- Ricoh Company, Ltd.
- Fumikata Andoh
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Lead pin correction device and lead pin correction method
- Patent number 8,800,337
- Issue date Aug 12, 2014
- Ricoh Company, Ltd.
- Shigeru Fujita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier tape cutter and component packaging machine
- Patent number 6,233,906
- Issue date May 22, 2001
- Matsushita Electric Industrial, Co., Ltd.
- Makoto Sueki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC leadframe processing system
- Patent number 5,956,838
- Issue date Sep 28, 1999
- Ishii Tool & Engineering Corp.
- Mitoshi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
General-purpose lead working machine
- Patent number 5,636,430
- Issue date Jun 10, 1997
- Apic Yamada Corporation
- Shigeyuki Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromechanical press and method of operating
- Patent number 5,531,014
- Issue date Jul 2, 1996
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromechanical press and method of operating
- Patent number 5,493,768
- Issue date Feb 27, 1996
- Richard H. J. Fierkens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering apparatus and method
- Patent number 5,361,964
- Issue date Nov 8, 1994
- Sun Industrial Coatings Private Limited
- Ah T. Sim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Part pitch independent electrical component feeder
- Patent number 5,307,555
- Issue date May 3, 1994
- Ford Motor Company
- Scott T. Eder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape automated bonding feeder and lead forming apparatus
- Patent number 5,287,608
- Issue date Feb 22, 1994
- Microtek Industries
- J. Gregg Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component supplying apparatus
- Patent number 5,271,146
- Issue date Dec 21, 1993
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Kashiwagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated excise-form and shuttle system and apparatus
- Patent number 5,241,740
- Issue date Sep 7, 1993
- John H. Kettler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape automated bonding feeder and lead forming apparatus
- Patent number 5,133,390
- Issue date Jul 28, 1992
- Microtek Industries, Inc.
- J. Gregg Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for processing semiconductor packages and the like
- Patent number 5,048,412
- Issue date Sep 17, 1991
- Y.K.C. Co., Ltd.
- Hiroshi Murakami
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Flatpack preparation machine
- Patent number 4,957,146
- Issue date Sep 18, 1990
- Harris Corporation
- Nathaniel J. Satterfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanism for processing and offering tapepaks for automatic equipp...
- Patent number 4,941,248
- Issue date Jul 17, 1990
- Siemens Aktiengesellschaft
- Werner Seidel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial component lead cutter and former
- Patent number 4,840,204
- Issue date Jun 20, 1989
- Avraham Shiloh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for sensing and forming objects such as leads of electronic...
- Patent number 4,821,157
- Issue date Apr 11, 1989
- Hewlett-Packard Co.
- John Birk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for sensing and forming objects such as leads of electronic...
- Patent number 4,813,255
- Issue date Mar 21, 1989
- Hewlett-Packard Company
- John Birk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin grid array straightening method and apparatus
- Patent number 4,789,011
- Issue date Dec 6, 1988
- American Tech. Manufacturing, Inc.
- Richard Moloney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for bending the leads of electrical and/or electronic compon...
- Patent number 4,718,461
- Issue date Jan 12, 1988
- Arcotronics Italia, S.p.A.
- Mario Musiani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for sensing and forming objects such as leads of electronic...
- Patent number 4,705,081
- Issue date Nov 10, 1987
- Hewlett-Packard Company
- John Birk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for loose feeding of electrical components
- Patent number 4,677,732
- Issue date Jul 7, 1987
- Henry Mann, Inc.
- Harumi Furuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor for component plug-in
- Patent number 4,654,964
- Issue date Apr 7, 1987
- Siemens Aktiengesellschaft
- Bernd Schneider
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for hairpin-type forming of axial lead components
- Patent number 4,581,809
- Issue date Apr 15, 1986
- Universal Instruments Corporation
- Henry J. Soth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for cutting and forming leads
- Patent number 4,573,501
- Issue date Mar 4, 1986
- Henry Mann, Inc.
- Harumi Furuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for processing end-taped radial components
- Patent number 4,567,653
- Issue date Feb 4, 1986
- Heller; Martin G.
- Martin G. Heller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT FEEDER
- Publication number 20200068753
- Publication date Feb 27, 2020
- FUJI CORPORATION
- Satoru OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE FEEDER
- Publication number 20170020039
- Publication date Jan 19, 2017
- FUJI MACHINE MFG. CO., LTD.
- Shigeo SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD PIN CORRECTION DEVICE AND LEAD PIN CORRECTION METHOD
- Publication number 20130047693
- Publication date Feb 28, 2013
- RICOH COMPANY, LTD.
- Shigeru Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD PIN RECTIFYING APPARATUS AND LEAD PIN RECTIFYING METHOD
- Publication number 20130042663
- Publication date Feb 21, 2013
- RICOH COMPANY, LTD.,
- Fumikata ANDOH
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

with bending or straightening of the terminal leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tape feeder

Component supply device and component mounting device

Component feeder

Lead pin rectifying apparatus and lead pin rectifying method

Lead pin correction device and lead pin correction method

Carrier tape cutter and component packaging machine

IC leadframe processing system

General-purpose lead working machine

Electromechanical press and method of operating

Electromechanical press and method of operating

Soldering apparatus and method

Part pitch independent electrical component feeder

Tape automated bonding feeder and lead forming apparatus

Electronic component supplying apparatus

Automated excise-form and shuttle system and apparatus

Tape automated bonding feeder and lead forming apparatus

Apparatus for processing semiconductor packages and the like

Flatpack preparation machine

Mechanism for processing and offering tapepaks for automatic equipp...

Axial component lead cutter and former

System for sensing and forming objects such as leads of electronic...

System for sensing and forming objects such as leads of electronic...

Pin grid array straightening method and apparatus

Device for bending the leads of electrical and/or electronic compon...

System for sensing and forming objects such as leads of electronic...

Apparatus for loose feeding of electrical components

Sensor for component plug-in

Device for hairpin-type forming of axial lead components

Apparatus for cutting and forming leads

Method and apparatus for processing end-taped radial components

Patents Applicationslast 30 patents

COMPONENT FEEDER

TAPE FEEDER

LEAD PIN CORRECTION DEVICE AND LEAD PIN CORRECTION METHOD

LEAD PIN RECTIFYING APPARATUS AND LEAD PIN RECTIFYING METHOD