with metallic articles

Industry

CPC
C04B37/02

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Parent Industries

CCHEMISTRY METALLURGY C04Concrete, cement, ceramics C04BLIME, MAGNESIA SLAG CEMENTS COMPOSITIONS THEREOF C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating

Current Industry

C04B37/02with metallic articles

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ceramic material, powder, and layer system comprising the ceramic m...
- Patent number 12,187,652
- Issue date Jan 7, 2025
- Siemens Energy Global GmbH & Co. KG
- Arturo Flores Renteria
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electrode embedded ceramic structure
- Patent number 12,174,051
- Issue date Dec 24, 2024
- NGK Insulators, Ltd.
- Takao Ohnishi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Support substrate and method for producing a support substrate
- Patent number 12,177,970
- Issue date Dec 24, 2024
- Rogers Germany GmbH
- Tilo Welker
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Copper/ceramic bonded body, insulating circuit substrate, copper/ce...
- Patent number 12,168,634
- Issue date Dec 17, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 12,145,352
- Issue date Nov 19, 2024
- DOWA METALTECH CO, LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ceramic structural body
- Patent number 12,145,891
- Issue date Nov 19, 2024
- Kyocera Corporation
- Kazuhiko Fujio
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor processing equipment with high temperature resistant...
- Patent number 12,128,494
- Issue date Oct 29, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Rapid ceramic processing techniques and equipment
- Patent number 12,090,684
- Issue date Sep 17, 2024
- QuantumScape Battery, Inc.
- Timothy Holme
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Metal ceramic substrate and method for manufacturing such metal cer...
- Patent number 12,075,557
- Issue date Aug 27, 2024
- Rogers Germany GmbH
- Vitalij Gil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, method of producing ceramic-copper compos...
- Patent number 12,065,385
- Issue date Aug 20, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic bonded body, insulating circuit substrate, copper/ce...
- Patent number 12,037,294
- Issue date Jul 16, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High optical power light conversion device using a phosphor element...
- Patent number 12,034,092
- Issue date Jul 9, 2024
- Materion Corporation
- Michael P. Newell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing holding device and holding device
- Patent number 12,027,406
- Issue date Jul 2, 2024
- NITERRA CO., LTD.
- Makoto Kuribayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure body, structure body manufacturing method, and electronic...
- Patent number 12,023,892
- Issue date Jul 2, 2024
- Sony Group Corporation
- Yuichi Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonded body of copper and ceramic, insulating circuit substrate, bo...
- Patent number 12,027,434
- Issue date Jul 2, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cover lid with selective and edge metallization and methods of making
- Patent number 12,020,999
- Issue date Jun 25, 2024
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Termination feedthrough unit with ceramic insulator for vacuum and...
- Patent number 11,993,547
- Issue date May 28, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polycrystalline diamond
- Patent number 11,969,860
- Issue date Apr 30, 2024
- Element Six Limited
- John Hewitt Liversage
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing active metal-brazed nitride ceramic substr...
- Patent number 11,964,919
- Issue date Apr 23, 2024
- ZONE INFINITYCO., LTD.
- Inchul Cho
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Embedding sensors in 3D-printed silicon carbide
- Patent number 11,964,918
- Issue date Apr 23, 2024
- UT-Battelle, LLC
- Christian M. Petrie
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Composite green sheet and ceramic member
- Patent number 11,952,316
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature sealant and methods thereof
- Patent number 11,945,749
- Issue date Apr 2, 2024
- Corning Incorporated
- Melinda Ann Drake
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Ceramic structure and structure with terminal
- Patent number 11,945,755
- Issue date Apr 2, 2024
- Kyocera Corporation
- Kazuo Watada
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Bonded body, circuit board, and semiconductor device
- Patent number 11,948,900
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic heater and method of forming using transient liquid phase b...
- Patent number 11,943,845
- Issue date Mar 26, 2024
- Watlow Electric Manufacturing Company
- Patrick Margavio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method for copper/ceramic joined body, production method...
- Patent number 11,939,270
- Issue date Mar 26, 2024
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
NTC compound, thermistor and method for producing the thermistor
- Patent number 11,929,193
- Issue date Mar 12, 2024
- TDK ELECTRONICS AG
- Michael Naderer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATING LAMINATE
- Publication number 20240384146
- Publication date Nov 21, 2024
- JAPAN MATEX CO., LTD.
- Katsuro Tsukamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION
- Publication number 20240360043
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Kai-Mou CHOU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COMPOSITE MATERIAL SINTERED BODY, JOINED ASSEMBLY, SEMICONDUCTOR MA...
- Publication number 20240327301
- Publication date Oct 3, 2024
- NGK Insulators, Ltd.
- Kana IBATA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
POSITIVE TEMPERATURE COEFFICIENT CERAMIC THERMISTOR ELEMENT HAVING...
- Publication number 20240312678
- Publication date Sep 19, 2024
- JIANGSU NEW LINZHI ELECTRONIC TECHNOLOGY CO., LTD.
- Qiuyun FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING SENSORS IN 3D-PRINTED SILICON CARBIDE
- Publication number 20240279127
- Publication date Aug 22, 2024
- UT-Battelle, LLC
- Christian M. Petrie
- G01 - MEASURING TESTING
Information Patent Application
POLYCRYSTALLINE DIAMOND COMPOSITE SHEET HAVING RIPPLE-SHAPED GRADIE...
- Publication number 20240279126
- Publication date Aug 22, 2024
- Central South University
- Shaohe ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF MAKING A SHAPED TOOL COMPONENT
- Publication number 20240239714
- Publication date Jul 18, 2024
- Element Six (UK) Limited
- David Thomas FORD
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIEZOELECTRIC THIN-FILM ELEMENT, MICROELECTROMECHANICAL SYSTEM, AND...
- Publication number 20240224808
- Publication date Jul 4, 2024
- TDK CORPORATION
- Yusuke SATO
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240222179
- Publication date Jul 4, 2024
- SEMES CO., LTD.
- So Hyung JIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK, ELECTROSTATIC CHUCK HEATER COMPRISING SAME, AN...
- Publication number 20240178039
- Publication date May 30, 2024
- AMOSENSE CO.,LTD
- Ji Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID CERAMIC PROCESSING TECHNIQUES AND EQUIPMENT
- Publication number 20240116826
- Publication date Apr 11, 2024
- QUANTUMSCAPE BATTERY, INC.
- Timothy HOLME
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR
- Publication number 20240064895
- Publication date Feb 22, 2024
- DENKA COMPANY LIMITED
- Kenji MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC SUBSTRATE
- Publication number 20230399267
- Publication date Dec 14, 2023
- AURUBIS STOLBERG GMBH & CO. KG
- Benjamin CAPPI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS OF MAKING HEATING BLOCKS, HEATING BLOCKS, AND SEMICONDUCTOR...
- Publication number 20230389134
- Publication date Nov 30, 2023
- ASM IP HOLDING B.V.
- ChangMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230377934
- Publication date Nov 23, 2023
- TEMNEST INC.
- Hae Ran KIM
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE SHEET AND METHOD FOR PRODUCING SAME, AND MULTILAYER BODY...
- Publication number 20230365471
- Publication date Nov 16, 2023
- Denka Company Limited
- Yusuke WAKUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE SHEET AND MANUFACTURING METHOD THEREOF, AND LAMINATE AND...
- Publication number 20230357089
- Publication date Nov 9, 2023
- Denka Company Limited
- Yoshitaka MINAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SHEET, LAMINATE, AND EVALUATION METHOD FOR ESTIMATING ADH...
- Publication number 20230357090
- Publication date Nov 9, 2023
- Denka Company Limited
- Yusuke WAKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFA...
- Publication number 20230354514
- Publication date Nov 2, 2023
- Proterial, Ltd.
- Teruyuki OMORI
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE SHEET AND METHOD FOR MANUFACTURING SAME, AND LAYERED BODY...
- Publication number 20230348335
- Publication date Nov 2, 2023
- Denka Company Limited
- Yoshitaka MINAKATA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Visual Communications
- Publication number 20230339816
- Publication date Oct 26, 2023
- Sococo, Inc.
- Eric Cozzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL STRESS ENGINEERED METAL STRUCTURES
- Publication number 20230339820
- Publication date Oct 26, 2023
- Powdermet, Inc.
- Andrew Sherman
- B22 - CASTING POWDER METALLURGY
Information Patent Application
JOINED BODY, HOLDING DEVICE, AND ELECTROSTATIC CHUCK
- Publication number 20230311451
- Publication date Oct 5, 2023
- NGK Spark Plug Co., Ltd.
- Osamu YOSHIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED BODY, HOLDING DEVICE, AND ELECTROSTATIC CHUCK
- Publication number 20230303457
- Publication date Sep 28, 2023
- NGK Spark Plug Co., Ltd.
- Osamu YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC S...
- Publication number 20230294213
- Publication date Sep 21, 2023
- Rogers Germany GmbH
- Vitalij GIL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMI...
- Publication number 20230286872
- Publication date Sep 14, 2023
- Rogers Germany GmbH
- Fabian WAGLE
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...
- Publication number 20230278123
- Publication date Sep 7, 2023
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DENSE TARGET
- Publication number 20230272519
- Publication date Aug 31, 2023
- SOLERAS ADVANCED COATINGS BV
- Wilmert DE BOSSCHER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...
- Publication number 20230269879
- Publication date Aug 24, 2023
- BYD Company Limited
- Wei ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20230260868
- Publication date Aug 17, 2023
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

with metallic articles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic material, powder, and layer system comprising the ceramic m...

Electrode embedded ceramic structure

Support substrate and method for producing a support substrate

Copper/ceramic bonded body, insulating circuit substrate, copper/ce...

Metal/ceramic bonding substrate and method for producing same

Ceramic structural body

Semiconductor processing equipment with high temperature resistant...

Copper/ceramic joined body and insulating circuit substrate

Ceramic-copper composite, ceramic circuit board, power module, and...

Rapid ceramic processing techniques and equipment

Metal ceramic substrate and method for manufacturing such metal cer...

Ceramic-copper composite, method of producing ceramic-copper compos...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Copper/ceramic bonded body, insulating circuit substrate, copper/ce...

High optical power light conversion device using a phosphor element...

Method for manufacturing holding device and holding device

Structure body, structure body manufacturing method, and electronic...

Bonded body of copper and ceramic, insulating circuit substrate, bo...

Cover lid with selective and edge metallization and methods of making

Termination feedthrough unit with ceramic insulator for vacuum and...

Polycrystalline diamond

Method for manufacturing active metal-brazed nitride ceramic substr...

Embedding sensors in 3D-printed silicon carbide

Composite green sheet and ceramic member

High temperature sealant and methods thereof

Ceramic structure and structure with terminal

Bonded body, circuit board, and semiconductor device

Ceramic heater and method of forming using transient liquid phase b...

Production method for copper/ceramic joined body, production method...

NTC compound, thermistor and method for producing the thermistor

Patents Applicationslast 30 patents

HEAT DISSIPATING LAMINATE

COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION

COMPOSITE MATERIAL SINTERED BODY, JOINED ASSEMBLY, SEMICONDUCTOR MA...

POSITIVE TEMPERATURE COEFFICIENT CERAMIC THERMISTOR ELEMENT HAVING...

EMBEDDING SENSORS IN 3D-PRINTED SILICON CARBIDE

POLYCRYSTALLINE DIAMOND COMPOSITE SHEET HAVING RIPPLE-SHAPED GRADIE...

METHOD OF MAKING A SHAPED TOOL COMPONENT

PIEZOELECTRIC THIN-FILM ELEMENT, MICROELECTROMECHANICAL SYSTEM, AND...

SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME

ELECTROSTATIC CHUCK, ELECTROSTATIC CHUCK HEATER COMPRISING SAME, AN...

RAPID CERAMIC PROCESSING TECHNIQUES AND EQUIPMENT

CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR

COPPER-CERAMIC SUBSTRATE

METHODS OF MAKING HEATING BLOCKS, HEATING BLOCKS, AND SEMICONDUCTOR...

ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME

COMPOSITE SHEET AND METHOD FOR PRODUCING SAME, AND MULTILAYER BODY...

COMPOSITE SHEET AND MANUFACTURING METHOD THEREOF, AND LAMINATE AND...

COMPOSITE SHEET, LAMINATE, AND EVALUATION METHOD FOR ESTIMATING ADH...

CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFA...

COMPOSITE SHEET AND METHOD FOR MANUFACTURING SAME, AND LAYERED BODY...

Visual Communications

LOW THERMAL STRESS ENGINEERED METAL STRUCTURES

JOINED BODY, HOLDING DEVICE, AND ELECTROSTATIC CHUCK

JOINED BODY, HOLDING DEVICE, AND ELECTROSTATIC CHUCK

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC S...

PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMI...

SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT...

DENSE TARGET

CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...

BONDED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE