with monohydric phenols

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Industry

CPC
C08J2461/08

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Parent Industries

CCHEMISTRY METALLURGY C08Organic compounds C08JWORKING-UP GENERAL PROCESSES OF COMPOUNDING AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G C08J2461/00Characterised by the use of condensation polymers of aldehydes or ketones Derivatives of such polymers

Current Industry

C08J2461/08with monohydric phenols

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting sheet, dicing die bonding film, and semiconductor app...
- Patent number 11,791,302
- Issue date Oct 17, 2023
- Nitto Denko Corporation
- Rena Kojima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Prepreg, metal-clad laminated board, and printed wiring board
- Patent number 11,647,583
- Issue date May 9, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shimpei Obata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin-coated metal sheet for containers
- Patent number 9,751,283
- Issue date Sep 5, 2017
- JFE Steel Corporation
- Yoichiro Yamanaka
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING SHEET, DICING DIE BONDING FILM, AND SEMICONDUCTOR APP...
- Publication number 20220130790
- Publication date Apr 28, 2022
- Nitto Denko Corporation
- Rena Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD
- Publication number 20190150279
- Publication date May 16, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Shimpei OBATA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD...
- Publication number 20160017141
- Publication date Jan 21, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Masaaki MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR