with orientation of the component while holding it

Industry

CPC
H05K13/0413

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0413with orientation of the component while holding it

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mounting device and control method for same
- Patent number 11,968,785
- Issue date Apr 23, 2024
- FUJI CORPORATION
- Hidetoshi Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounter
- Patent number 11,943,871
- Issue date Mar 26, 2024
- FUJI CORPORATION
- Yukinori Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting components on a substrate
- Patent number 11,924,974
- Issue date Mar 5, 2024
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for handling components
- Patent number 11,856,705
- Issue date Dec 26, 2023
- Muehlbauer GmbH & Co. KG
- Stefan Feigl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic housing element comprising a radiator, and associated ad...
- Patent number 11,844,196
- Issue date Dec 12, 2023
- Continental Automotive GmbH
- Jean-Philippe Bekaert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mass transfer tool with high productivity
- Patent number 11,820,651
- Issue date Nov 21, 2023
- Apple Inc.
- Antoine Manens
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Information processing device, work system, and determination method
- Patent number 11,778,798
- Issue date Oct 3, 2023
- FUJI CORPORATION
- Takeshi Sakurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting components on a substrate
- Patent number 11,696,429
- Issue date Jul 4, 2023
- Besi Switzerland AG
- Norbert Bilewicz
- G05 - CONTROLLING REGULATING
Information Patent Grant
Printed circuit board automated layup system
- Patent number 11,653,484
- Issue date May 16, 2023
- Raytheon Company
- Mikhail Pevzner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Component mounting device
- Patent number 11,653,485
- Issue date May 16, 2023
- FUJI CORPORATION
- Takahiro Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead cutting system
- Patent number 11,570,939
- Issue date Jan 31, 2023
- FUJI CORPORATION
- Kazuya Degura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dispensing head, nozzle and method
- Patent number 11,464,146
- Issue date Oct 4, 2022
- Universal Instruments Corporation
- John Danek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spindle module, pick-and-place machine and method of assembly
- Patent number 11,464,147
- Issue date Oct 4, 2022
- Universal Instruments Corporation
- John Danek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spindle module, bank, and method
- Patent number 11,457,549
- Issue date Sep 27, 2022
- Universal Instruments Corporation
- John Danek
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Work machine
- Patent number 11,452,248
- Issue date Sep 20, 2022
- FUJI CORPORATION
- Toru Matsumoto
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate working machine that selects which lifting and lowering s...
- Patent number 11,432,445
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Hideya Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting machine and electronic component moun...
- Patent number 11,432,446
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Kenzo Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-mounting device
- Patent number 11,412,648
- Issue date Aug 9, 2022
- FUJI CORPORATION
- Hidenori Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spindle bank, pick-and-place machine and method of assembly
- Patent number 11,412,646
- Issue date Aug 9, 2022
- Universal Instruments Corporation
- John Danek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting machine
- Patent number 11,412,647
- Issue date Aug 9, 2022
- FUJI CORPORATION
- Jo Ikeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module, chip-embedded package module and manufacturing method...
- Patent number 11,399,438
- Issue date Jul 26, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispensing head
- Patent number 11,382,248
- Issue date Jul 5, 2022
- Universal Instruments Corporation
- John Danek
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Dispensing head, nozzle and method
- Patent number 11,375,651
- Issue date Jun 28, 2022
- Universal Instruments Corporation
- John Danek
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Component mounting machine and method for determining dropping of c...
- Patent number 11,350,550
- Issue date May 31, 2022
- FUJI CORPORATION
- Rie Kito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Measurement position determination device
- Patent number 11,324,151
- Issue date May 3, 2022
- FUJI CORPORATION
- Hiroyoshi Sugita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounter
- Patent number 11,317,551
- Issue date Apr 26, 2022
- FUJI CORPORATION
- Ryohei Kamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board work machine and insertion method
- Patent number 11,304,350
- Issue date Apr 12, 2022
- FUJI CORPORATION
- Katsunori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting device, information processing device, and mounting method
- Patent number 11,304,351
- Issue date Apr 12, 2022
- FUJI CORPORATION
- Kosei Baba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting component mounting method
- Patent number 11,293,626
- Issue date Apr 5, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Katou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of inserting an electronic components in through-hole techno...
- Publication number 20240098905
- Publication date Mar 21, 2024
- Fitech Sp. z o.o.
- Grzegorz Marcin Bartyzel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUPPLYING COMPONENTS FROM A CONTINUOUS MATERIAL TO A PLACEMENT MACHINE
- Publication number 20230320053
- Publication date Oct 5, 2023
- ASMPT GmbH & Co. KG
- Christoph OECKL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for mounting components on a substrate
- Publication number 20230284426
- Publication date Sep 7, 2023
- Besi Switzerland AG
- Norbert BILEWICZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM
- Publication number 20230189494
- Publication date Jun 15, 2023
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Hikaru IMADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20230154770
- Publication date May 18, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING MACHINE
- Publication number 20230033735
- Publication date Feb 2, 2023
- FUJI CORPORATION
- Mikine ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING LINE
- Publication number 20230033844
- Publication date Feb 2, 2023
- FUJI CORPORATION
- Akihiro NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT ADSORPTION NOZZLE AND COMPONENT MOUNTING SYSTEM
- Publication number 20220361386
- Publication date Nov 10, 2022
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Kenji TSURI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COMPONENT HANDLING
- Publication number 20220330465
- Publication date Oct 13, 2022
- Muehlbauer GmbH & Co. KG
- Stefan Feigl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTARY MOUNTING HEAD AND COMPONENT MOUNTING MACHINE
- Publication number 20220279691
- Publication date Sep 1, 2022
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Shingo YAMAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mass Transfer Tool with High Productivity
- Publication number 20220135400
- Publication date May 5, 2022
- Apple Inc.
- Antoine Manens
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT MOUNTER
- Publication number 20220132712
- Publication date Apr 28, 2022
- FUJI CORPORATION
- Yukinori NAKAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC HOUSING ELEMENT COMPRISING A RADIATOR, AND ASSOCIATED AD...
- Publication number 20220132698
- Publication date Apr 28, 2022
- CONTINENTAL AUTOMOTIVE GMBH
- Jean-Philippe Bekaert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE
- Publication number 20220007558
- Publication date Jan 6, 2022
- FUJI CORPORATION
- Takahiro OTSUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING MACHINE AND ELECTRONIC COMPONENT MOUN...
- Publication number 20210195815
- Publication date Jun 24, 2021
- FUJI CORPORATION
- Kenzo ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for mounting components on a substrate
- Publication number 20210195816
- Publication date Jun 24, 2021
- Besi Switzerland AG
- Norbert BILEWICZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION PROCESSING DEVICE, WORK SYSTEM, AND DETERMINATION METHOD
- Publication number 20210153399
- Publication date May 20, 2021
- FUJI CORPORATION
- Takeshi SAKURAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AUTOMATED LAYUP SYSTEM
- Publication number 20210144892
- Publication date May 13, 2021
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PLACING DEVICE AND COMPONENT PLACING METHOD
- Publication number 20210127535
- Publication date Apr 29, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- DAISUKE FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-MOUNTING DEVICE
- Publication number 20210100143
- Publication date Apr 1, 2021
- FUJI CORPORATION
- Hidenori GOTO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MOUNTING DEVICE, INFORMATION PROCESSING DEVICE, AND MOUNTING METHOD
- Publication number 20210084801
- Publication date Mar 18, 2021
- FUJI CORPORATION
- Kosei BABA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPENSING HEAD, NOZZLE AND METHOD
- Publication number 20210007253
- Publication date Jan 7, 2021
- John Danek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING DEVICE AND CONTROL METHOD FOR SAME
- Publication number 20200413579
- Publication date Dec 31, 2020
- FUJI CORPORATION
- Hidetoshi KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20200413581
- Publication date Dec 31, 2020
- KAWASAKI JUKOGYO KABUSHIKI KAISHA
- Toshimitsu KIMURA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DISPENSING HEAD
- Publication number 20200375074
- Publication date Nov 26, 2020
- UNIVERSAL INSTRUMENTS CORPORATION
- John Danek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITIONING MODULE AND ELECTRONIC DEVICE
- Publication number 20200288609
- Publication date Sep 10, 2020
- Compal Electronics, Inc.
- Cheng-Ya Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING MACHINE
- Publication number 20200275591
- Publication date Aug 27, 2020
- FUJI CORPORATION
- Jinya IMURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT MOUNTING MACHINE
- Publication number 20200253100
- Publication date Aug 6, 2020
- FUJI CORPORATION
- Koji KAWAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORK MACHINE
- Publication number 20200233395
- Publication date Jul 23, 2020
- FUJI CORPORATION
- Toru MATSUMOTO
- G05 - CONTROLLING REGULATING
Information Patent Application
COMPONENT MOUNTING MACHINE FOR PREVENTING RELEASE FAIL OF A COMPONENT
- Publication number 20200229332
- Publication date Jul 16, 2020
- FUJI CORPORATION
- Daisuke SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with orientation of the component while holding it

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting device and control method for same

Component mounter

Apparatus for mounting components on a substrate

Apparatus for handling components

Electronic housing element comprising a radiator, and associated ad...

Mass transfer tool with high productivity

Information processing device, work system, and determination method

Apparatus and method for mounting components on a substrate

Printed circuit board automated layup system

Component mounting device

Component mounting system

Lead cutting system

Dispensing head, nozzle and method

Spindle module, pick-and-place machine and method of assembly

Spindle module, bank, and method

Work machine

Substrate working machine that selects which lifting and lowering s...

Electronic component mounting machine and electronic component moun...

Component-mounting device

Spindle bank, pick-and-place machine and method of assembly

Electronic component mounting machine

Power module, chip-embedded package module and manufacturing method...

Dispensing head

Dispensing head, nozzle and method

Component mounting machine and method for determining dropping of c...

Measurement position determination device

Component mounter

Board work machine and insertion method

Mounting device, information processing device, and mounting method

Light emitting component mounting method

Patents Applicationslast 30 patents

Method of inserting an electronic components in through-hole techno...

SUPPLYING COMPONENTS FROM A CONTINUOUS MATERIAL TO A PLACEMENT MACHINE

Apparatus for mounting components on a substrate

COMPONENT MOUNTING SYSTEM

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

COMPONENT MOUNTING MACHINE

COMPONENT MOUNTING LINE

COMPONENT ADSORPTION NOZZLE AND COMPONENT MOUNTING SYSTEM

COMPONENT HANDLING

ROTARY MOUNTING HEAD AND COMPONENT MOUNTING MACHINE

Mass Transfer Tool with High Productivity

COMPONENT MOUNTER

ELECTRONIC HOUSING ELEMENT COMPRISING A RADIATOR, AND ASSOCIATED AD...

COMPONENT MOUNTING DEVICE

ELECTRONIC COMPONENT MOUNTING MACHINE AND ELECTRONIC COMPONENT MOUN...

Apparatus and method for mounting components on a substrate

INFORMATION PROCESSING DEVICE, WORK SYSTEM, AND DETERMINATION METHOD

PRINTED CIRCUIT BOARD AUTOMATED LAYUP SYSTEM

COMPONENT PLACING DEVICE AND COMPONENT PLACING METHOD

COMPONENT-MOUNTING DEVICE

MOUNTING DEVICE, INFORMATION PROCESSING DEVICE, AND MOUNTING METHOD

DISPENSING HEAD, NOZZLE AND METHOD

MOUNTING DEVICE AND CONTROL METHOD FOR SAME

MOUNTING DEVICE AND MOUNTING METHOD

DISPENSING HEAD

POSITIONING MODULE AND ELECTRONIC DEVICE

COMPONENT MOUNTING MACHINE

COMPONENT MOUNTING MACHINE

WORK MACHINE

COMPONENT MOUNTING MACHINE FOR PREVENTING RELEASE FAIL OF A COMPONENT