with poking during delaminating

Industry

CPC
Y10S156/932

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10S156/932with poking during delaminating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Detaching a die from an adhesive tape by air ejection
- Patent number 11,764,098
- Issue date Sep 19, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ngai Tat Man
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating a window and method for separating a windo...
- Patent number 11,458,721
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Jongman Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip ejecting apparatus
- Patent number 11,239,104
- Issue date Feb 1, 2022
- Samsung Electronics Co., Ltd.
- Jae Ryoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,062,925
- Issue date Jul 13, 2021
- Mitsubishi Electric Corporation
- Masato Negishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating a window and method for separating a windo...
- Patent number 10,836,151
- Issue date Nov 17, 2020
- Samsung Display Co., Ltd.
- Jongman Bae
- B32 - LAYERED PRODUCTS
Information Patent Grant
System and method for peeling a semiconductor chip from a tape usin...
- Patent number 9,929,036
- Issue date Mar 27, 2018
- Manufacturing Integration Technology Ltd
- Kim Mone Kwong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation device and pickup system
- Patent number 9,520,316
- Issue date Dec 13, 2016
- Tesec Corporation
- Takashi Kurakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-related data management method and wafer-related data creatio...
- Patent number 9,378,993
- Issue date Jun 28, 2016
- Fuji Machine Mfg. Co., Ltd.
- Hideki Hosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Pick-up method of die bonder and die bonder
- Patent number 9,343,338
- Issue date May 17, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Naoki Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die eject assembly for die bonder
- Patent number 9,305,812
- Issue date Apr 5, 2016
- Texas Instruments Incorporated
- Ali Imran Amin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for thermal-slide debonding of temporary bonded semiconducto...
- Patent number 9,281,229
- Issue date Mar 8, 2016
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Die bonding apparatus, die picking up apparatus and die picking up...
- Patent number 9,245,778
- Issue date Jan 26, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Keita Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for detaching a semiconductor chip from a foil
- Patent number 9,240,334
- Issue date Jan 19, 2016
- Besi Switzerland AG
- Ernst Barmettler
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for detaching a semiconductor chip from a foil
- Patent number 9,039,867
- Issue date May 26, 2015
- Besi Switzerland AG
- Ernst Barmettler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die pick-up apparatus and method of picking up semico...
- Patent number 9,028,649
- Issue date May 12, 2015
- Shinkawa Ltd.
- Motoki Nakazawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate separating apparatus, load lock apparatus, substrate bond...
- Patent number 8,932,432
- Issue date Jan 13, 2015
- Nikon Corporation
- Keiichi Tanaka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for thermal-slide debonding of temporary bonded semicondu...
- Patent number 8,919,412
- Issue date Dec 30, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for releasing an interconnect layer that provides connection...
- Patent number 8,905,111
- Issue date Dec 9, 2014
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for peeling protective tape
- Patent number 8,778,133
- Issue date Jul 15, 2014
- Mitsubishi Electric Corporation
- Shoichi Kuga
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Device for centering wafers
- Patent number 8,764,026
- Issue date Jul 1, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for stripping a wafer from a carrier
- Patent number 8,603,294
- Issue date Dec 10, 2013
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for stripping a wafer from a carrier
- Patent number 8,443,864
- Issue date May 21, 2013
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for mechanically debonding temporary bonded semiconductor...
- Patent number 8,267,143
- Issue date Sep 18, 2012
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
System for peeling semiconductor chips from tape
- Patent number 8,221,583
- Issue date Jul 17, 2012
- Stats Chippac Ltd.
- Gab Yong Min
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip pickup apparatus, chip pickup method, chip releasing device an...
- Patent number 8,192,578
- Issue date Jun 5, 2012
- Panasonic Corporation
- Hiroshi Haji
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for temporary wafer bonding and debonding
- Patent number 8,181,688
- Issue date May 22, 2012
- Suss Microtec Lithography, GmbH
- Hale Johnson
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for thin die detachment and pick-up
- Patent number 8,141,612
- Issue date Mar 27, 2012
- ASM Assembly Automation LTD
- Man Wai Chan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Control and monitoring system for thin die detachment and pick-up
- Patent number 8,092,645
- Issue date Jan 10, 2012
- ASM Assembly Automation LTD
- Siu Ping Yip
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for picking up work piece and mounting machine
- Patent number 7,445,688
- Issue date Nov 4, 2008
- TDK Corporation
- Hidetoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving mechanism for chip detachment apparatus
- Patent number 7,303,647
- Issue date Dec 4, 2007
- ASM Assembly Automation Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR SEPARATING A WINDOW AND METHOD FOR SEPARATING A WINDO...
- Publication number 20210070030
- Publication date Mar 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jongman Bae
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...
- Publication number 20140299277
- Publication date Oct 9, 2014
- FUJI MACHINE MFG CO., LTD.
- Hideki Hosaka
- B32 - LAYERED PRODUCTS
Information Patent Application
DIE EJECT ASSEMBLY FOR DIE BONDER
- Publication number 20140251760
- Publication date Sep 11, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Ali Imran Amin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20140196853
- Publication date Jul 17, 2014
- Besi Switzerland AG
- Ernst Barmettler
- B32 - LAYERED PRODUCTS
Information Patent Application
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...
- Publication number 20140060751
- Publication date Mar 6, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Keita Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...
- Publication number 20130327485
- Publication date Dec 12, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...
- Publication number 20130272837
- Publication date Oct 17, 2013
- Motoki Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20130255889
- Publication date Oct 3, 2013
- Besi Switzerland AG
- Ernst Barmettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20130139972
- Publication date Jun 6, 2013
- EV GROUP GMBH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE
- Publication number 20130098542
- Publication date Apr 25, 2013
- Shoichi KUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BOND...
- Publication number 20130048222
- Publication date Feb 28, 2013
- Keiichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pick-Up Method of Die Bonder and Die Bonder
- Publication number 20120244647
- Publication date Sep 27, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Naoki OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER
- Publication number 20120000613
- Publication date Jan 5, 2012
- EV Group GmbH
- Erich Thallner
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE
- Publication number 20110220296
- Publication date Sep 15, 2011
- MITSUBISHI ELECTRIC CORPORATION
- Shoichi KUGA
- B32 - LAYERED PRODUCTS
Information Patent Application
CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20110192547
- Publication date Aug 11, 2011
- Siu Ping YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...
- Publication number 20110010908
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
- Publication number 20110014774
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- HALE JOHNSON
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...
- Publication number 20100263794
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR CENTERING WAFERS
- Publication number 20100266373
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20100252205
- Publication date Oct 7, 2010
- Man Wai CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...
- Publication number 20090279995
- Publication date Nov 12, 2009
- PANASONIC CORPORATION
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE
- Publication number 20080173407
- Publication date Jul 24, 2008
- Gab Yong Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE
- Publication number 20060237142
- Publication date Oct 26, 2006
- STATS ChipPAC Ltd.
- Soo-San Park
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Driving mechanism for chip detachment apparatus
- Publication number 20060090846
- Publication date May 4, 2006
- ASM Assembly Automation Ltd
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for picking up work piece and mounting machine
- Publication number 20050006029
- Publication date Jan 13, 2005
- TDK Corporation
- Hidetoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and apparatus for disengaging semiconductor die from an adh...
- Publication number 20030154597
- Publication date Aug 21, 2003
- Lup Kweun Yee
- H01 - BASIC ELECTRIC ELEMENTS

with poking during delaminating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detaching a die from an adhesive tape by air ejection

Apparatus for separating a window and method for separating a windo...

Chip ejecting apparatus

Semiconductor manufacturing apparatus and method of manufacturing s...

Apparatus for separating a window and method for separating a windo...

System and method for peeling a semiconductor chip from a tape usin...

Separation device and pickup system

Wafer-related data management method and wafer-related data creatio...

Pick-up method of die bonder and die bonder

Die eject assembly for die bonder

Method for thermal-slide debonding of temporary bonded semiconducto...

Die bonding apparatus, die picking up apparatus and die picking up...

Method for detaching a semiconductor chip from a foil

Method for detaching a semiconductor chip from a foil

Semiconductor die pick-up apparatus and method of picking up semico...

Substrate separating apparatus, load lock apparatus, substrate bond...

Apparatus for thermal-slide debonding of temporary bonded semicondu...

Device for releasing an interconnect layer that provides connection...

Method and apparatus for peeling protective tape

Device for centering wafers

Method for stripping a wafer from a carrier

Device for stripping a wafer from a carrier

Apparatus for mechanically debonding temporary bonded semiconductor...

System for peeling semiconductor chips from tape

Chip pickup apparatus, chip pickup method, chip releasing device an...

Apparatus for temporary wafer bonding and debonding

Device for thin die detachment and pick-up

Control and monitoring system for thin die detachment and pick-up

Method and apparatus for picking up work piece and mounting machine

Driving mechanism for chip detachment apparatus

Patents Applicationslast 30 patents

APPARATUS FOR SEPARATING A WINDOW AND METHOD FOR SEPARATING A WINDO...

WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATIO...

DIE EJECT ASSEMBLY FOR DIE BONDER

Method For Detaching A Semiconductor Chip From A Foil

Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...

DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION...

SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...

Method For Detaching A Semiconductor Chip From A Foil

METHOD FOR STRIPPING A WAFER FROM A CARRIER

METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE

SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BOND...

Pick-Up Method of Die Bonder and Die Bonder

DEVICE AND METHOD FOR STRIPPING A WAFER FROM A CARRIER

METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE

CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP

APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...

APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING

APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...

DEVICE FOR CENTERING WAFERS

DEVICE FOR THIN DIE DETACHMENT AND PICK-UP

CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AN...

SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE

SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE

Driving mechanism for chip detachment apparatus

Method and apparatus for picking up work piece and mounting machine

Process and apparatus for disengaging semiconductor die from an adh...