with preliminary treatment

Industry

CPC
B28D5/0011

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0011with preliminary treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate
- Patent number 12,214,526
- Issue date Feb 4, 2025
- Disco Corporation
- Hayato Iga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing monocrystalline silicon substrate
- Patent number 12,202,173
- Issue date Jan 21, 2025
- Disco Corporation
- Hayato Iga
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Laser processing method, semiconductor member manufacturing method,...
- Patent number 12,194,570
- Issue date Jan 14, 2025
- NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH...
- Atsushi Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wafers with modification lines of defined orie...
- Patent number 12,159,805
- Issue date Dec 3, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for applying pressure to stress-producing layers...
- Patent number 12,151,314
- Issue date Nov 26, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing glass plate and apparatus for manufacturin...
- Patent number 12,139,432
- Issue date Nov 12, 2024
- Nippon Electric Glass Co., Ltd.
- Taisei Matsubushi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer producing method and wafer producing apparatus
- Patent number 12,097,642
- Issue date Sep 24, 2024
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide wafers with relaxed positive bow and related methods
- Patent number 12,070,875
- Issue date Aug 27, 2024
- Wolfspeed, Inc.
- Simon Bubel
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dividing device for wafer
- Patent number 12,036,700
- Issue date Jul 16, 2024
- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
- Tsuyoshi Naya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating wafers from donor substrates
- Patent number 12,030,216
- Issue date Jul 9, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer forming method
- Patent number 11,969,916
- Issue date Apr 30, 2024
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip manufacturing device and method of manufacturing...
- Patent number 11,973,309
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Tetsuya Uetsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC ingot processing method and laser processing apparatus
- Patent number 11,958,132
- Issue date Apr 16, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC wafer manufacturing method and SiC wafer manufacturing apparatus
- Patent number 11,945,049
- Issue date Apr 2, 2024
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of wafer
- Patent number 11,890,783
- Issue date Feb 6, 2024
- Disco Corporation
- Xiaoming Qiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing the thickness of solid-state layers provided wi...
- Patent number 11,869,810
- Issue date Jan 9, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Splitting of a solid using conversion of material
- Patent number 11,833,617
- Issue date Dec 5, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production facility for separating wafers from donor substrates
- Patent number 11,787,083
- Issue date Oct 17, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating solid body layers from composite structures m...
- Patent number 11,772,201
- Issue date Oct 3, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a layer of solid material
- Patent number 11,699,616
- Issue date Jul 11, 2023
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for laser machining inside materials
- Patent number 11,685,003
- Issue date Jun 27, 2023
- Oxford University Innovation Limited
- Martin James Booth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide wafers with relaxed positive bow and related methods
- Patent number 11,654,596
- Issue date May 23, 2023
- Wolfspeed, Inc.
- Simon Bubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method and laser processing apparatus
- Patent number 11,597,039
- Issue date Mar 7, 2023
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of treating a solid layer bonded to a carrier substrate
- Patent number 11,518,066
- Issue date Dec 6, 2022
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon wafer forming method
- Patent number 11,511,374
- Issue date Nov 29, 2022
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 11,420,294
- Issue date Aug 23, 2022
- Disco Corporation
- Jingshi Chi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate dividing method
- Patent number 11,424,162
- Issue date Aug 23, 2022
- Hamamatsu Photonics K.K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brittle object cutting apparatus and cutting method thereof
- Patent number 11,420,894
- Issue date Aug 23, 2022
- NANOPLUS LTD.
- Hung-Tu Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Splitting of a solid using conversion of material
- Patent number 11,407,066
- Issue date Aug 9, 2022
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD
- Publication number 20250033245
- Publication date Jan 30, 2025
- Disco Corporation
- Yuya SETO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods
- Publication number 20240367348
- Publication date Nov 7, 2024
- Wolfspeed, Inc.
- Simon Bubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20240316823
- Publication date Sep 26, 2024
- Disco Corporation
- Tsubasa HIROSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCTION METHOD
- Publication number 20240316824
- Publication date Sep 26, 2024
- DENSO CORPORATION
- Koichiro Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD
- Publication number 20240239104
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- TAKANOBU MANABE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUBSTRATE MANUFACTURING DEVICE
- Publication number 20240165746
- Publication date May 23, 2024
- Hamamatsu Photonics K.K.
- Atsushi TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE
- Publication number 20240149379
- Publication date May 9, 2024
- Disco Corporation
- Asahi NOMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR SILICON CARBIDE INGOT PEELING
- Publication number 20240149494
- Publication date May 9, 2024
- Industrial Technology Research Institute
- WENG-JUNG LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Detachment Region in a Solid-state Body
- Publication number 20240058899
- Publication date Feb 22, 2024
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIAMOND SUBSTRATE MANUFACTURING METHOD
- Publication number 20240001490
- Publication date Jan 4, 2024
- Disco Corporation
- Naoki MURAZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LASER MACHINING INSIDE MATERIALS
- Publication number 20230398639
- Publication date Dec 14, 2023
- Oxford University Innovation Limited
- Martin James BOOTH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Separating Wafers from Donor Substrates
- Publication number 20230390961
- Publication date Dec 7, 2023
- SILTECTRA GMBH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING APPARATUS
- Publication number 20230373129
- Publication date Nov 23, 2023
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCTION SYSTEM AND WAFER MANUFACTURING METHOD
- Publication number 20230331614
- Publication date Oct 19, 2023
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20230307286
- Publication date Sep 28, 2023
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods
- Publication number 20230241803
- Publication date Aug 3, 2023
- Wolfspeed, Inc.
- Simon Bubel
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE
- Publication number 20230234169
- Publication date Jul 27, 2023
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING METHOD
- Publication number 20230219256
- Publication date Jul 13, 2023
- Disco Corporation
- Yuki IKKU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...
- Publication number 20230207390
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE
- Publication number 20230137722
- Publication date May 4, 2023
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNMENT OF PHOTONIC SYSTEM COMPONENTS USING A REFERENCE SURFACE
- Publication number 20230114532
- Publication date Apr 13, 2023
- Fluxus, Inc.
- Joshua Wayne PARKS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING METHOD
- Publication number 20230112548
- Publication date Apr 13, 2023
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING GLASS PLATE AND APPARATUS FOR MANUFACTURIN...
- Publication number 20230084567
- Publication date Mar 16, 2023
- Nippon Electric Glass Co., Ltd.
- Taisei MATSUBUSHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS
- Publication number 20230073379
- Publication date Mar 9, 2023
- DENSO CORPORATION
- Sodai NOMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MARKING MACHINE AND WAFER PRODUCTION SYSTEM
- Publication number 20220410320
- Publication date Dec 29, 2022
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING APPARATUS
- Publication number 20220410431
- Publication date Dec 29, 2022
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING METHOD AND PEELING APPARATUS
- Publication number 20220379520
- Publication date Dec 1, 2022
- Disco Corporation
- Ryohei YAMAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEPARATING WAFER
- Publication number 20220371224
- Publication date Nov 24, 2022
- Disco Corporation
- Shunsuke TERANISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE DIVIDING METHOD
- Publication number 20220352026
- Publication date Nov 3, 2022
- HAMAMATSU PHOTONICS K. K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF SPLITTING A SEMICONDUCTOR WORK PIECE
- Publication number 20220339740
- Publication date Oct 27, 2022
- Benjamin Bernard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with preliminary treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing substrate

Method of manufacturing monocrystalline silicon substrate

Laser processing method, semiconductor member manufacturing method,...

Method for producing wafers with modification lines of defined orie...

Device and method for applying pressure to stress-producing layers...

Method for manufacturing glass plate and apparatus for manufacturin...

Wafer producing method and wafer producing apparatus

Silicon carbide wafers with relaxed positive bow and related methods

Method of producing a substrate and system for producing a substrate

Dividing device for wafer

Method for separating wafers from donor substrates

Wafer forming method

Semiconductor chip manufacturing device and method of manufacturing...

SiC ingot processing method and laser processing apparatus

SiC wafer manufacturing method and SiC wafer manufacturing apparatus

Production method of wafer

Method for reducing the thickness of solid-state layers provided wi...

Splitting of a solid using conversion of material

Production facility for separating wafers from donor substrates

Method for separating solid body layers from composite structures m...

Method for producing a layer of solid material

Method for laser machining inside materials

Silicon carbide wafers with relaxed positive bow and related methods

Wafer producing method and laser processing apparatus

Method of treating a solid layer bonded to a carrier substrate

Silicon wafer forming method

Wafer processing method

Substrate dividing method

Brittle object cutting apparatus and cutting method thereof

Splitting of a solid using conversion of material

Patents Applicationslast 30 patents

BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD

Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods

WORKPIECE PROCESSING METHOD

WAFER PRODUCTION METHOD

METHOD FOR MANUFACTURING LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD

SUBSTRATE MANUFACTURING DEVICE

MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE

APPARATUS AND METHOD FOR SILICON CARBIDE INGOT PEELING

Method for Producing a Detachment Region in a Solid-state Body

DIAMOND SUBSTRATE MANUFACTURING METHOD

METHOD FOR LASER MACHINING INSIDE MATERIALS

Method for Separating Wafers from Donor Substrates

PEELING APPARATUS

WAFER PRODUCTION SYSTEM AND WAFER MANUFACTURING METHOD

Method for Producing a Layer of Solid Material

Silicon Carbide Wafers with Relaxed Positive Bow and Related Methods

MANUFACTURING METHOD OF SINGLE-CRYSTAL SILICON SUBSTRATE

SUBSTRATE MANUFACTURING METHOD

METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS TH...

METHOD OF MANUFACTURING SUBSTRATE

ALIGNMENT OF PHOTONIC SYSTEM COMPONENTS USING A REFERENCE SURFACE

SUBSTRATE MANUFACTURING METHOD

METHOD FOR MANUFACTURING GLASS PLATE AND APPARATUS FOR MANUFACTURIN...

METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS

MARKING MACHINE AND WAFER PRODUCTION SYSTEM

PEELING APPARATUS

PEELING METHOD AND PEELING APPARATUS

METHOD OF SEPARATING WAFER

SUBSTRATE DIVIDING METHOD

METHODS OF SPLITTING A SEMICONDUCTOR WORK PIECE