TREA

with provisions to reduce EMI leakage through the joining parts

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Industry

  • CPC
  • H05K9/0009
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K9/00Screening of apparatus or components against electric or magnetic fields

Current Industry

H05K9/0009with provisions to reduce EMI leakage through the joining parts
Industries