with retainers or specific soldering features

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CPC
H05K9/0028

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K9/00Screening of apparatus or components against electric or magnetic fields

Current Industry

H05K9/0028with retainers or specific soldering features

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,089,384
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Hojong Kim
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device for a vehicle
- Patent number 12,082,383
- Issue date Sep 3, 2024
- Aptiv Technologies AG
- Sebastian Melfried
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device comprising shielding member comprising recess for...
- Patent number 12,069,196
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Minkuk Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mitigation of physical impact-induced mechanical stress damage to p...
- Patent number 11,792,913
- Issue date Oct 17, 2023
- Google LLC
- Eric Robert Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounted on circuit board
- Patent number 11,744,019
- Issue date Aug 29, 2023
- Murata Manufacturing Co., Ltd.
- Shigeyuki Kamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield case and electronic circuit module
- Patent number 11,711,889
- Issue date Jul 25, 2023
- Lapis Semiconductor Co., Ltd.
- Mitsuhiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic shielding of heatsinks with spring press-fit pins
- Patent number 11,699,884
- Issue date Jul 11, 2023
- International Business Machines Corporation
- David J. Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield case
- Patent number 11,510,348
- Issue date Nov 22, 2022
- Lapis Semiconductor Co., Ltd.
- Shigeki Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,304,347
- Issue date Apr 12, 2022
- Pegatron Corporation
- Yu-Ti Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and electromagnetic shielding frame
- Patent number 11,272,645
- Issue date Mar 8, 2022
- Wistron NeWeb Corporation
- Jen-Yung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liner and display device including the same
- Patent number 11,254,093
- Issue date Feb 22, 2022
- Samsung Display Co., Ltd.
- Cheol Ho Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board for a control device for a vehicle, method for produc...
- Patent number 11,240,946
- Issue date Feb 1, 2022
- Robert Bosch GmbH
- Stefan Balz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderable electric conductive gasket
- Patent number 11,191,196
- Issue date Nov 30, 2021
- JOINSET CO., LTD.
- Sun-Ki Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having shield can structure
- Patent number 11,076,512
- Issue date Jul 27, 2021
- Samsung Electronics Co., Ltd.
- Sungyoung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including shield can
- Patent number 11,032,952
- Issue date Jun 8, 2021
- Samsung Electronics Co., Ltd.
- Chang Joon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having shield can structure
- Patent number 10,980,158
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Sungyoung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Snap-on electromagnetic interference (EMI)-shielding without mother...
- Patent number 10,938,161
- Issue date Mar 2, 2021
- Intel Corporation
- Jaejin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 10,863,615
- Issue date Dec 8, 2020
- Canon Kabushiki Kaisha
- Koji Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference (EMI) shield for circuit card assembly...
- Patent number 10,856,454
- Issue date Dec 1, 2020
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency component provided with a shield case
- Patent number 10,757,845
- Issue date Aug 25, 2020
- Murata Manufacturing Co., Ltd.
- Yoshikazu Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for mounting shielded module on printed wiring...
- Patent number 10,750,609
- Issue date Aug 18, 2020
- Murata Manufacturing Co., Ltd.
- Norifumi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding in electronic assemblies
- Patent number 10,548,249
- Issue date Jan 28, 2020
- Intel Corporation
- Scott Mokler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount metal unit and electric device including same
- Patent number 10,542,646
- Issue date Jan 21, 2020
- Samsung Electronics Co., Ltd.
- Chang-Joon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference shielding structure
- Patent number 10,531,599
- Issue date Jan 7, 2020
- Samsung Electronics Co., Ltd.
- Il-ju Mun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board level shields with virtual grounding capability
- Patent number 10,455,688
- Issue date Oct 22, 2019
- Laird Technologies, Inc.
- Mohammadali Khorrami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing used for electric component and method for manufacturing same
- Patent number 10,448,530
- Issue date Oct 15, 2019
- RF360 Technology (Wuxi) Co., Ltd.
- Wolfgang Pahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 10,433,417
- Issue date Oct 1, 2019
- Canon Kabushiki Kaisha
- Koji Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package structure and electronic device
- Patent number 10,091,915
- Issue date Oct 2, 2018
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit module
- Patent number 10,076,069
- Issue date Sep 11, 2018
- Alps Electric Co., Ltd.
- Tatsuo Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Auxiliary adhesive dispensing apparatus
- Patent number 9,961,819
- Issue date May 1, 2018
- HUAWEI DEVICE (DONGGUAN) CO., LTD.
- Fuqiang Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING SHIELDING MEMBER COMPRISING RECESS FOR...
- Publication number 20240414255
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Minkuk KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...
- Publication number 20240365523
- Publication date Oct 31, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Sei UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Shielding
- Publication number 20240114670
- Publication date Apr 4, 2024
- Google LLC
- Wen Shian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220330463
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Hojong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED GRID ARRAY MODULE
- Publication number 20220272880
- Publication date Aug 25, 2022
- Intel Corporation
- Shailendra Singh CHAUHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device for a Vehicle
- Publication number 20220142019
- Publication date May 5, 2022
- Aptiv Technologies Limited
- Sebastian Melfried
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTROMAGNETIC SHIELDING OF HEATSINKS WITH SPRING PRESS-FIT PINS
- Publication number 20220029361
- Publication date Jan 27, 2022
- International Business Machines Corporation
- David J. Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20210392787
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Haein CHUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE COMPRISING SHIELDING MEMBER COMPRISING RECESS FOR...
- Publication number 20210352169
- Publication date Nov 11, 2021
- Samsung Electronics Co., Ltd.
- Minkuk KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SHIELD CASE AND ELECTRONIC CIRCUIT MODULE
- Publication number 20210307154
- Publication date Sep 30, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Mitsuhiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELD CASE
- Publication number 20210307220
- Publication date Sep 30, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Shigeki YAMAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND ELECTROMAGNETIC SHIELDING FRAME
- Publication number 20210274692
- Publication date Sep 2, 2021
- WISTRON NEWEB CORPORATION
- JEN-YUNG CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLIES
- Publication number 20210051825
- Publication date Feb 18, 2021
- Hewlett-Packard Development Company, L.P.
- Xavier Gomez Travesset
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING SHIELD CAN STRUCTURE
- Publication number 20200404815
- Publication date Dec 24, 2020
- Samsung Electronics Co., LTD
- Sungyoung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERABLE ELECTRIC CONDUCTIVE GASKET
- Publication number 20200396872
- Publication date Dec 17, 2020
- JOINSET CO., LTD.
- Sun-Ki Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Attaching a Component to a Circuit Board Using an Over-filled Cavit...
- Publication number 20190307029
- Publication date Oct 3, 2019
- Google LLC
- Nael Hannan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC SHIELDING CAP, AN ELECTRICAL SYSTEM AND A METHOD FO...
- Publication number 20190297758
- Publication date Sep 26, 2019
- Intel IP Corporation
- Sonja KOLLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING IN ELECTRONIC ASSEMBLIES
- Publication number 20190098802
- Publication date Mar 28, 2019
- Intel Corporation
- Scott Mokler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE
- Publication number 20190082562
- Publication date Mar 14, 2019
- Samsung Electronics Co., Ltd.
- Il-ju MUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board Level Shields With Virtual Grounding Capability
- Publication number 20180295714
- Publication date Oct 11, 2018
- Laird Technologies, Inc.
- Mohammadali KHORRAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MOBILE TERMINAL MOUNTED THE SAME
- Publication number 20180241859
- Publication date Aug 23, 2018
- LG ELECTRONICS INC.
- Youngmin CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20180049351
- Publication date Feb 15, 2018
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20170202115
- Publication date Jul 13, 2017
- Alps Electric Co., Ltd.
- Tatsuo Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20150305210
- Publication date Oct 22, 2015
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECEIVING DEVICE AND SHIELD CASE CONNECTION METHOD
- Publication number 20150181773
- Publication date Jun 25, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Isao UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELD CASE AND ELECTRONIC APPARATUS
- Publication number 20150062809
- Publication date Mar 5, 2015
- TDK CORPORATION
- Takeshi Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION COVER AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20140355230
- Publication date Dec 4, 2014
- Sungyoung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTI-EMI SHIELDING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20140334119
- Publication date Nov 13, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- YU-HUA HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING REINFORCING APPARATUS
- Publication number 20140318851
- Publication date Oct 30, 2014
- Samsung Electronics Co., Ltd.
- Won-Jea JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE DEVICE
- Publication number 20140313668
- Publication date Oct 23, 2014
- FOXCONN TECHNOLOGY CO., LTD.
- WEI-HANG HSU
- G06 - COMPUTING CALCULATING COUNTING

with retainers or specific soldering features

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Electronic device for a vehicle

Electronic device comprising shielding member comprising recess for...

Mitigation of physical impact-induced mechanical stress damage to p...

Component mounted on circuit board

Shield case and electronic circuit module

Electromagnetic shielding of heatsinks with spring press-fit pins

Shield case

Electronic device

Electronic device and electromagnetic shielding frame

Liner and display device including the same

Circuit board for a control device for a vehicle, method for produc...

Solderable electric conductive gasket

Electronic device having shield can structure

Electronic device including shield can

Electronic device having shield can structure

Snap-on electromagnetic interference (EMI)-shielding without mother...

Electronic apparatus

Electromagnetic interference (EMI) shield for circuit card assembly...

High-frequency component provided with a shield case

Structure and method for mounting shielded module on printed wiring...

Shielding in electronic assemblies

Surface mount metal unit and electric device including same

Electromagnetic interference shielding structure

Board level shields with virtual grounding capability

Housing used for electric component and method for manufacturing same

Electronic apparatus

Electronic component package structure and electronic device

Electronic circuit module

Auxiliary adhesive dispensing apparatus

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COMPRISING SHIELDING MEMBER COMPRISING RECESS FOR...

METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...

Component Shielding

ELECTRONIC DEVICE

HIGH SPEED GRID ARRAY MODULE

Electronic Device for a Vehicle

ELECTROMAGNETIC SHIELDING OF HEATSINKS WITH SPRING PRESS-FIT PINS

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

ELECTRONIC DEVICE COMPRISING SHIELDING MEMBER COMPRISING RECESS FOR...

SHIELD CASE AND ELECTRONIC CIRCUIT MODULE

SHIELD CASE

ELECTRONIC DEVICE AND ELECTROMAGNETIC SHIELDING FRAME

CIRCUIT BOARD ASSEMBLIES

ELECTRONIC DEVICE HAVING SHIELD CAN STRUCTURE

SOLDERABLE ELECTRIC CONDUCTIVE GASKET

Attaching a Component to a Circuit Board Using an Over-filled Cavit...

ELECTROMAGNETIC SHIELDING CAP, AN ELECTRICAL SYSTEM AND A METHOD FO...

SHIELDING IN ELECTRONIC ASSEMBLIES

ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE

Board Level Shields With Virtual Grounding Capability

PRINTED CIRCUIT BOARD AND MOBILE TERMINAL MOUNTED THE SAME

Electronic Component Package Structure and Electronic Device

ELECTRONIC CIRCUIT MODULE

Electronic Component Package Structure and Electronic Device

RECEIVING DEVICE AND SHIELD CASE CONNECTION METHOD

SHIELD CASE AND ELECTRONIC APPARATUS

PROTECTION COVER AND ELECTRONIC DEVICE HAVING THE SAME

ANTI-EMI SHIELDING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME

SHIELDING REINFORCING APPARATUS

PROTECTIVE DEVICE