with the coil helically wound around a magnetic core

Industry

CPC
H01F17/0033

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Parent Industries

HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F17/00Fixed inductances of the signal type

Current Industry

H01F17/0033with the coil helically wound around a magnetic core

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing ferromagnetic-dielectric composite material
- Patent number 12,125,713
- Issue date Oct 22, 2024
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component
- Patent number 12,087,502
- Issue date Sep 10, 2024
- Murata Manufacturing Co., Ltd.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with inductor windings around a core above an...
- Patent number 12,057,468
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with laminated magnetic core inductor and magnet...
- Patent number 12,048,097
- Issue date Jul 23, 2024
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor made of component carrier material comprising electrically...
- Patent number 12,002,614
- Issue date Jun 4, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor system having an inductor module attached to a...
- Patent number 11,996,771
- Issue date May 28, 2024
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Winding-type coil component
- Patent number 11,984,252
- Issue date May 14, 2024
- Murata Manufacturing Co., Ltd.
- Kohei Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material and coil component
- Patent number 11,972,885
- Issue date Apr 30, 2024
- Taiyo Yuden Co., Ltd.
- Kenji Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors with through-substrate via cores
- Patent number 11,942,428
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband induction
- Patent number 11,908,617
- Issue date Feb 20, 2024
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing laminated magnetic core inductor with insul...
- Patent number 11,903,130
- Issue date Feb 13, 2024
- Ferric Inc.
- Noah Sturcken
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Wire-wound coil element
- Patent number 11,901,106
- Issue date Feb 13, 2024
- Taiyo Yuden Co., Ltd.
- Hidenori Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated electronic component
- Patent number 11,887,764
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Yutaka Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
- Patent number 11,864,327
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 11,830,822
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing ceramic electronic component
- Patent number 11,821,090
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Yoshinori Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing electronic component
- Patent number 11,817,244
- Issue date Nov 14, 2023
- Murata Manufacturing Co., Ltd.
- Mitsunori Inoue
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Coil component
- Patent number 11,752,549
- Issue date Sep 12, 2023
- Taiyo Yuden Co., Ltd.
- Masahiro Hachiya
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,728,077
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component
- Patent number 11,676,761
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems and methods including magnetic structures and micr...
- Patent number 11,649,157
- Issue date May 16, 2023
- Analog Devices International Unlimited Company
- Alan J. O'Donnell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Helical plated through-hole package inductor
- Patent number 11,608,564
- Issue date Mar 21, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core, inductor and module including inductor
- Patent number 11,610,710
- Issue date Mar 21, 2023
- Tokin Corporation
- Kenichi Chatani
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Release layer-assisted selective embedding of magnetic material in...
- Patent number 11,610,706
- Issue date Mar 21, 2023
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor component
- Patent number 11,610,712
- Issue date Mar 21, 2023
- Murata Manufacturing Co., Ltd.
- Yoshinori Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless monitoring system for coal-gangue mixing ratio based on no...
- Patent number 11,592,410
- Issue date Feb 28, 2023
- Shanxi Datong University
- Lijuan Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 11,587,883
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR
- Publication number 20240347578
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE COUPLING PROXIMITY CURRENT SENSOR FOR ENERGY MEASUREMENT
- Publication number 20240331914
- Publication date Oct 3, 2024
- SCHNEIDER ELECTRIC USA, INC.
- Adrian Abdala RENDON HERNANDEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE
- Publication number 20240332170
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDING-TYPE COIL COMPONENT
- Publication number 20240258016
- Publication date Aug 1, 2024
- Murata Manufacturing Co., Ltd.
- Kohei Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
- Publication number 20240234324
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER BOARD INTEGRATED WITH MAGNETIC ELEMENT STRUCTURE AN...
- Publication number 20240215174
- Publication date Jun 27, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- SHIH-PING HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240097303
- Publication date Mar 21, 2024
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER
- Publication number 20240038429
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20230395298
- Publication date Dec 7, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Dong Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230387038
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Broadband Induction
- Publication number 20230352238
- Publication date Nov 2, 2023
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT
- Publication number 20230260696
- Publication date Aug 17, 2023
- MURATA MANUFACTURING CO., LTD.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230197631
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP
- Publication number 20230154788
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...
- Publication number 20230127874
- Publication date Apr 27, 2023
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Broadband Induction
- Publication number 20230122085
- Publication date Apr 20, 2023
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
WIRELESS MONITORING SYSTEM FOR COAL-GANGUE MIXING RATIO BASED ON NO...
- Publication number 20230064933
- Publication date Mar 2, 2023
- Shanxi Datong University
- Lijuan DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230015749
- Publication date Jan 19, 2023
- Murata Manufacturing Co., Ltd.
- Eiji ISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20220351883
- Publication date Nov 3, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hwan Soo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-WOUND COIL ELEMENT
- Publication number 20220285067
- Publication date Sep 8, 2022
- Taiyo Yuden Co., Ltd.
- Hidenori AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220262556
- Publication date Aug 18, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Tong WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURIN...
- Publication number 20220216295
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INDUCTOR FOR WLCSP
- Publication number 20220122756
- Publication date Apr 21, 2022
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANDEM MAGNETICS IN PACKAGE
- Publication number 20220084736
- Publication date Mar 17, 2022
- Intel Corporation
- Beomseok CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES
- Publication number 20220005638
- Publication date Jan 6, 2022
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS INCLUDING MAGNETIC STRUCTURES
- Publication number 20210405130
- Publication date Dec 30, 2021
- ANALOG DEVICES GLOBAL
- Alan J. O'Donnell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Circuit with Laminated Magnetic Core Inductor and Magnet...
- Publication number 20210321518
- Publication date Oct 14, 2021
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR
- Publication number 20210304952
- Publication date Sep 30, 2021
- Intel Corporation
- William J. Lambert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

with the coil helically wound around a magnetic core

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing ferromagnetic-dielectric composite material

Semiconductor device and method of making the same

Inductor component

Semiconductor device with inductor windings around a core above an...

Integrated circuit with laminated magnetic core inductor and magnet...

Inductor made of component carrier material comprising electrically...

Power semiconductor system having an inductor module attached to a...

Winding-type coil component

Vertical inductor for WLCSP

Magnetic material and coil component

Inductors with through-substrate via cores

Broadband induction

Method of manufacturing laminated magnetic core inductor with insul...

Wire-wound coil element

Laminated electronic component

Creating inductors, resistors, capacitors and other structures in p...

Methods of embedding magnetic structures in substrates

Semiconductor device and method of making the same

Method of manufacturing ceramic electronic component

Method for manufacturing electronic component

Coil component

Magnetic material having coated ferromagnetic filler particles

Inductor component

Devices, systems and methods including magnetic structures and micr...

Helical plated through-hole package inductor

Magnetic core, inductor and module including inductor

Release layer-assisted selective embedding of magnetic material in...

Inductor component

Wireless monitoring system for coal-gangue mixing ratio based on no...

Semiconductor device and method of making the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR

INDUCTIVE COUPLING PROXIMITY CURRENT SENSOR FOR ENERGY MEASUREMENT

INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE

WINDING-TYPE COIL COMPONENT

INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES

PACKAGE CARRIER BOARD INTEGRATED WITH MAGNETIC ELEMENT STRUCTURE AN...

ISOLATOR

STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER

COIL COMPONENT

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

Broadband Induction

INDUCTOR COMPONENT

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP

POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...

Broadband Induction

WIRELESS MONITORING SYSTEM FOR COAL-GANGUE MIXING RATIO BASED ON NO...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME

COIL COMPONENT

WIRE-WOUND COIL ELEMENT

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

INDUCTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURIN...

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

VERTICAL INDUCTOR FOR WLCSP

TANDEM MAGNETICS IN PACKAGE

MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES

DEVICES, SYSTEMS AND METHODS INCLUDING MAGNETIC STRUCTURES

Integrated Circuit with Laminated Magnetic Core Inductor and Magnet...

HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR