with treatment of the terminal leads

Industry

CPC
H05K13/0421

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0421with treatment of the terminal leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Configurable printed-circuit-board-assembly component pressing fixture
- Patent number 11,696,427
- Issue date Jul 4, 2023
- International Business Machines Corporation
- XiYuan Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape feeder
- Patent number 11,395,447
- Issue date Jul 19, 2022
- FUJI CORPORATION
- Shigeo Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component supply device and component mounting device
- Patent number 11,357,144
- Issue date Jun 7, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Board work machine and insertion method
- Patent number 11,304,350
- Issue date Apr 12, 2022
- FUJI CORPORATION
- Katsunori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component feeder
- Patent number 11,122,720
- Issue date Sep 14, 2021
- FUJI CORPORATION
- Shunji Morikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing component-mounted substrate
- Patent number 11,006,560
- Issue date May 11, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component supply device, component mounter, and component-mounted b...
- Patent number 10,390,470
- Issue date Aug 20, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Lead position detecting apparatus and component inserting machine
- Patent number 10,285,318
- Issue date May 7, 2019
- FUJI CORPORATION
- Haruaki Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip components feeding apparatus
- Patent number 7,331,442
- Issue date Feb 19, 2008
- Taiyo Yuden Co., Ltd.
- Koji Saito
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus for winding a carrier tape
- Patent number 6,123,286
- Issue date Sep 26, 2000
- Kemet Corporation
- Marcos Varela Garcia
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Feeder for separating parts molded to a continuous carrier tape
- Patent number 5,967,365
- Issue date Oct 19, 1999
- Autosplice Systems, Inc.
- Robert M. Bogursky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmable lead conditioner
- Patent number 5,777,886
- Issue date Jul 7, 1998
- Semiconductor Technologies & Instruments, Inc.
- Michael D. Glucksman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Splicing aid for connecting component belts
- Patent number 5,643,401
- Issue date Jul 1, 1997
- Siemens Aktiengesellschaft
- Rainer Schulze-Kahlayss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip-supply method and apparatus
- Patent number 5,589,029
- Issue date Dec 31, 1996
- Matsushita Electric Industrial Co., Ltd.
- Hisako Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component supplying cartridge
- Patent number 5,588,614
- Issue date Dec 31, 1996
- Fuji Machine Mfg. Co., Ltd.
- Yukinori Takada
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Tape carrier package mounting apparatus with heaters for bonding tools
- Patent number 5,575,059
- Issue date Nov 19, 1996
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiko Muraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece finishing and presentation machine
- Patent number 5,483,857
- Issue date Jan 16, 1996
- Bi-Link Metal Specialties
- Frank Ziberna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus for mounting chip component on mounting portion...
- Patent number 5,447,266
- Issue date Sep 5, 1995
- Kabushiki Kaisha Toshiba
- Hiroshi Misono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microchip storage tape and cover therefor
- Patent number 5,425,838
- Issue date Jun 20, 1995
- Advantek, Inc.
- Dean B. Chenoweth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembling apparatus
- Patent number 5,295,778
- Issue date Mar 22, 1994
- Matsushita Electric Industrial Co., Ltd.
- Hiroyuki Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microchip storage tape and cover therefor
- Patent number 5,265,723
- Issue date Nov 30, 1993
- Advantek, Inc.
- Dean B. Chenoweth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of lubricating component leads
- Patent number 5,240,090
- Issue date Aug 31, 1993
- AT&T Bell Laboratories
- Donald W. Rumps
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Tape carrier type electrical connector
- Patent number 5,141,450
- Issue date Aug 25, 1992
- Shoji Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Part mounting apparatus with single viewing camera viewing part fro...
- Patent number 5,140,643
- Issue date Aug 18, 1992
- Matsushita Electric Industries Co., Ltd.
- Yasuo Izumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Outer lead forming apparatus for semiconductor device
- Patent number 5,135,034
- Issue date Aug 4, 1992
- Kabushiki Kaisha Toshiba
- Mitsugu Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cropping mechanism for surface mount placement machine
- Patent number 5,125,307
- Issue date Jun 30, 1992
- Emhart Inc.
- Rodney P. Jackson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting electronic device on a printed circuit board
- Patent number 5,029,384
- Issue date Jul 9, 1991
- TDK Corporation
- Kotaro Harigane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radial lead component feeder having a narrow footprint
- Patent number 5,024,129
- Issue date Jun 18, 1991
- Holcomb; Gregory W.
- Gregory W. Holcomb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for sensing and forming objects such as leads of electronic...
- Patent number 4,821,157
- Issue date Apr 11, 1989
- Hewlett-Packard Co.
- John Birk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for sensing and forming objects such as leads of electronic...
- Patent number 4,813,255
- Issue date Mar 21, 1989
- Hewlett-Packard Company
- John Birk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONFIGURABLE PCBA COMPONENT PRESSING FIXTURE
- Publication number 20210153395
- Publication date May 20, 2021
- International Business Machines Corporation
- XiYuan Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD WORK MACHINE AND INSERTION METHOD
- Publication number 20190269051
- Publication date Aug 29, 2019
- FUJI CORPORATION
- Katsunori TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT FEEDER
- Publication number 20190029151
- Publication date Jan 24, 2019
- FUJI MACHINE MFG. CO., LTD.
- Shunji MORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip components feeding apparatus
- Publication number 20060070848
- Publication date Apr 6, 2006
- Koji Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with treatment of the terminal leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Configurable printed-circuit-board-assembly component pressing fixture

Tape feeder

Component supply device and component mounting device

Board work machine and insertion method

Component feeder

Method of manufacturing component-mounted substrate

Component supply device, component mounter, and component-mounted b...

Lead position detecting apparatus and component inserting machine

Chip components feeding apparatus

Apparatus for winding a carrier tape

Feeder for separating parts molded to a continuous carrier tape

Programmable lead conditioner

Splicing aid for connecting component belts

Semiconductor chip-supply method and apparatus

Electronic-component supplying cartridge

Tape carrier package mounting apparatus with heaters for bonding tools

Workpiece finishing and presentation machine

Mounting apparatus for mounting chip component on mounting portion...

Microchip storage tape and cover therefor

Assembling apparatus

Microchip storage tape and cover therefor

Apparatus and method of lubricating component leads

Tape carrier type electrical connector

Part mounting apparatus with single viewing camera viewing part fro...

Outer lead forming apparatus for semiconductor device

Cropping mechanism for surface mount placement machine

Apparatus for mounting electronic device on a printed circuit board

Radial lead component feeder having a narrow footprint

System for sensing and forming objects such as leads of electronic...

System for sensing and forming objects such as leads of electronic...

Patents Applicationslast 30 patents

CONFIGURABLE PCBA COMPONENT PRESSING FIXTURE

BOARD WORK MACHINE AND INSERTION METHOD

COMPONENT FEEDER

Chip components feeding apparatus