3-ELECTRODE SURGE PROTECTIVE DEVICE

Abstract

The 3-electrode surge protective device includes: a surge protective device body including: an earth electrode; a ceramic cylinder; and a pair of line electrodes; and a fail-safe spring including: an elastic mount portion; and a short-circuit portion, a conductive material that is sandwiched between the fail-safe spring and the body; and a pair of first lead pins provided on the pair of line electrodes; a second lead pin provided on the earth electrode. In a normal state, the conductive material support the short-circuit portion at a separation position where the short-circuit portion is separated from the outer peripheral face of the body and the first lead pins. In case where the body is overheated and the conductive material is melted, the short-circuit portion is moved to a contact position where the short-circuit portion comes into contact with the second lead pin and the first lead pins.

Description

This application claims priority from Japanese Patent Application No. 2009-060440, filed on Mar. 13, 2009, the entire contents of which are herein incorporated by reference.

BACKGROUND OF THE INVENTION

Technical Field

The present disclosure relates to a 3-electrode surge protective device provided with a fail-safe mechanism.

3-electrode surge protective devices are used as components for avoiding surges caused by lightning which enters telephone lines. In order to avoid the surges infiltrating telephone lines using the 3-electrode surge protective device, the 3-electrode surge protective device discharges the surges entering the telephone lines from the outside, and surge current is allowed to flow toward the earth so that the surge current does not flow into devices. In the 3-electrode surge protective device, a phenomenon may occur in which the discharge of the surge protective device continues by the infiltrating surge from the outside and the discharge does not stop. A fail-safe mechanism of the surge protective device is provided to stop the discharge of the surge protective device and to prevent the surge protective device from overheating when the discharge of the surge protective device continues and does not stop.

As a fail-safe mechanism of a surge protective device, there is a mechanism in which a fail-safe spring is provided on an outer face of a main body of the surge protective device to cover a space between an earth electrode and a line electrode, and a solder chip is interposed between the fail-safe spring and the earth electrode. According to the fail-safe mechanism, the solder chip is melted when the surge protective device overheats, and the earth electrode and the line electrode are electrically short-circuited through the fail-safe spring. Thus, the discharge can be stopped. In addition, there is a mechanism in which an insulating film is interposed between the outer face of the line electrode and the inner face of fail-safe spring, and thus the fail-safe spring is mounted on the outer face of a main body of the surge protective device. In this case, when the discharge from the surge protective device continues and thus the surge protective device overheats, the insulating film is melted and the earth electrode and the line electrode are electrically short-circuited through the fail-safe spring thereby stopping the discharge (see e.g., JP-A-2-070390, JP-A-6-251852 and JP-A-6-251855).

In the 3-electrode surge protective device, one telephone line is connected to a pair of line electrodes. When lightning acts on the telephone line, generally, surge current, which has substantially the same magnitude, enters each of the line electrodes of the 3-electrode surge protective device in the same phase and the surge current can be avoided by the discharge from the surge protective device. However, recently, lightning frequently occurs by abnormal atmospheric phenomena, and thus phenomena have frequently occurred in which surge currents with different phases enter the telephone lines connected to the line electrodes of the 3-electrode surge protective device, and the magnitudes of the surge currents entering the line electrodes are different from one another.

When the surge currents with different phases enter the line electrodes, the surge currents flow only between one line electrode and the earth electrode. In this case, a phenomenon occurs in which the discharge from the surge protective device is occurred only on one side, and only one line electrode on the overheated side is short-circuited to the earth electrode by the fail-safe mechanism.

The surge protective device in which the line electrode and the earth electrode are electrically short-circuited by the operation of the fail-safe mechanism has to be replaced by a new one, but it is mechanically detected whether the surge protective device is faulty or not by detecting whether both telephone lines connected to the line electrodes have been both earthed. Accordingly, even when only one of the line electrodes has been earthed, which surge protective device is faulty cannot be detected and the surge protective device to be replaced cannot be detected.

For this reason, there is a demand for surge protective devices provided with a fail-safe mechanism in which a safety mechanism surely operates and easily detects a faulty surge protective device by setting the line electrodes to be earthed even when the surge currents with different phases seem to enter the line electrode.

SUMMARY OF THE INVENTION

Exemplary embodiments of the present invention address the above disadvantages and other disadvantages not described above. However, the present invention is not required to overcome the disadvantages described above, and thus, an exemplary embodiment of the present invention may not overcome any disadvantages described above.

Accordingly, it is an illustrative aspect of the present invention to provide a 3-electrode surge protective device provided with a fail-safe mechanism capable of short-circuiting both of the line electrodes and the earth electrode and stopping the discharge of the surge protective device by surely operating the fail-safe mechanism even when the phases or magnitudes of the surge currents infiltrating the line electrodes are different.

According to one or more illustrative aspects of the present invention, there is provided a 3-electrode surge protective device. The surge protective device includes: a surge protective device body including: an earth electrode; a ceramic cylinder bonded to the earth electrode; and a pair of line electrodes bonded to both side faces of the ceramic cylinder, and a fail-safe spring with an electrical conductivity that is mounted on an outer face of the surge protective device body, the fail-safe spring including: an elastic mount portion provided along an outer peripheral face of the earth electrode to push an outer peripheral face of the surge protective device body; and a short-circuit portion provided to intersect with the elastic mount portion and electrically connecting the earth electrode to the pair of line electrodes, a conductive material that is sandwiched between an inner face of the fail-safe spring and the outer face of the surge protective device body, the conductive material being provided at an intersecting position of the elastic mount portion and the short-circuit portion; and a pair of first lead pins provided on the pair of line electrodes; a second lead pin provided on the earth electrode. In a normal state, the conductive material serves as a spacer to support the short-circuit portion at a separation position where the short-circuit portion is separated from the outer peripheral face of the surge protective device body and the first lead pins. In case where the surge protective device body is overheated and the conductive material is melted, the short-circuit portion is moved to a contact position where the short-circuit portion comes into contact with the second lead pin and the first lead pins, by a pushing force of the elastic mount portion.

Other aspects and advantages of the present invention will be apparent from the following description, the drawings and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a 3-electrode surge protective device according to a first embodiment of the invention;

FIG. 2 is a front view of the 3-electrode surge protective device;

FIG. 3 is a side view of the 3-electrode surge protective device;

FIG. 4 is a rear view of the 3-electrode surge protective device;

FIG. 5 is a development view of a fail-safe spring;

FIGS. 6A and 6B are diagrams illustrating a positional relation of the fail-safe spring and lead pins before and after a solder chip has melted;

FIG. 7 is a perspective view of a 3-electrode surge protective device according to a second embodiment of the invention;

FIG. 8 is a development view of a fail-safe spring according to the second embodiment;

FIG. 9 is a cross-sectional view of an inner structure of the surge protective device and a state where the fail-safe spring is mounted;

FIG. 10 is a graph illustrating a test result of a discharge characteristic of the surge protective device before the fail-safe spring is mounted; and

FIG. 11 is a graph illustrating a test result of a discharge characteristic of the surge protective device after the fail-safe spring is mounted.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

First Embodiment

Hereinafter, a 3-electrode surge protective device according to exemplary embodiments of the invention will be described with reference to the drawings.

FIG. 1 is a perspective view illustrating a 3-electrode surge protective device provided with a fail-safe mechanism according to a first embodiment. A 3-electrode surge protective device 10 according to the embodiment is provided with an earth electrode 12, and a pair of line electrodes 16a and 16b provided through ceramic cylinders 14a and 14b on both sides of the earth electrode 12. Lead pins 18a, 18b, and 18c are provided on the outer faces of the earth electrode 12 and the line electrodes 16a and 16b by welding. The earth electrode 12, the ceramic cylinders 14a and 14b, and the line electrodes 16a and 16b constitute a surge protective device body 10a.

The 3-electrode surge protective device 10 according to the embodiment is provided with a fail-safe spring 20 mounted on the outer face of the surge protective device body 10a as the fail-safe mechanism. The fail-safe spring 20 is provided with an elastic mount portion 22 mounted on the other periphery of the earth electrode 12 of the surge protective device body 10a, and a short-circuit portion 24 is provided to electrically short-circuit the earth electrode 12 and the line electrode 16a and 16b. The elastic mount portion 22 is provided to hold the surge protective device body 10a therein, and the short-circuit portion 24 is provided in a direction perpendicular to the elastic mount portion 22.

FIG. 2 is a front view of the 3-electrode surge protective device 10. The earth electrode 12, the line electrodes 16a and 16b, and the ceramic cylinders 14a and 14b are all formed with the same outer diameter, and the surge protective device body 10a has a cylindrical shape as a whole. The earth electrode 12 and the line electrode 16a and 16b are closely soldered to the end face of the ceramic cylinders 14a and 14b, and discharging gas is sealed in the surge protective device body 10a.

The lead pins 18a, 18b, and 18c are provided at the same circumferential positions on the outer faces of the earth electrode 12 and the line electrodes 16a and 16b, and the lead pins 18a, 18b, and 18c are arranged in a line (straight arrangement).

The elastic mount portion 22 of the fail-safe spring 20 is formed with a width larger than a thickness of the earth electrode 12, and both edges of the elastic mount portion 22 extend (but do not reach the line electrodes 16a and 16b) on the outer face of the ceramic cylinders 14a and 14b from the side edges of the earth electrode 12.

The both end portions of the elastic mount portion 22 are provided with a semispherical protrusion 21 protruding toward the outer face of the earth electrode 12.

FIG. 3 shows a side view of the 3-electrode surge protective device 10.

The elastic mount portion 22 is provided to surround about ¾ of a circumference of the surge protective device body 10a in a state where the elastic mount portion 22 is mounted on the surge protective device body 10a.

A recess 26 for housing a solder chip therein is formed at an intersecting part of the elastic mount portion 22 of the fail-safe spring 20 and the short-circuit portion 24 such that a lower portion of the recess 26 slightly protrudes from the outer face of the fail-safe spring 20. The fail-safe spring 20 is mounted on the surge protective device body 10a with a solder chip 30 accommodated in the recess 26. FIGS. 1, 2, and 3 show a state where the fail-safe spring 20 is mounted on the surge protective device body 10a while the solder chip 30 is housed in the recess 26.

In the state where the solder chip 30 is housed in the recess 26 of the fail-safe spring 20, a depth of the recess 26 and a thickness of the solder chip 30 are set so that the surface of the solder chip 30 protrudes from the surface (face opposed to the body) of the fail-safe spring 20. The fail-safe spring 20 is mounted on the surge protective device body 10a such that the solder chip 30 is in contact with the outer face of the surge protective device body 10a (specifically, the outer faces of the earth electrode 12 and the ceramic cylinders 14a and 14b). That is, the solder chip 30 serves as a spacer for separating the fail-safe spring 20 from the outer face of the surge protective device body 10a.

FIG. 3 shows that the solder chip 30 serves as the spacer and the fail-safe spring 20 is mounted on and separated from the outer face of the body of the 3-electrode surge protective device 10.

As described above, at the leading end of the elastic mount portion 22, the protrusion 21 is provided at a position opposed to the outer peripheral face of the earth electrode 12. In the state where the fail-safe spring 20 is mounted on the body, the protrusion 21 is in contact with the outer face of the earth electrode 12, and the fail-safe spring 20 is supported to be separated from the outer face of the surge protective device body 10a except for the protrusion 21 by the spacer function of the solder chip 30. Actually, the protrusion 21 (close to the lead pins) close to the lower end of two protrusions 21 is slightly separated from the outer peripheral face of the earth electrode 12. The solder chip 30 is constantly pressed toward the outer face (the outer faces of the earth electrode 12 and the ceramic cylinders 14a and 14b close to the earth electrode 12) of the surge protective device body 10a by the elastic force of the elastic mount portion 22.

FIG. 4 shows a rear view of the 3-electrode surge protective device 10.

The elastic mount portion 22 of the fail-safe spring 20 is mounted at the center of the surge protective device body 10a so as to hold the surge protective device body 10a, and the short-circuit portion 22 is provided to intersect with the elastic mount portion 24. The short-circuit portion 24 are provided near the base end portions of the lead pins 18a, 18b, and 18c provided on the earth electrode 12 and the line electrode 16a and 16b.

As shown in FIG. 4, the short-circuit portion 24 extends sideward from the position intersecting with the elastic mount portion 22, and the extending ends are provided over the parts where the line electrodes 16a and 16b are provided. Bending portions 24a and 24b are provided at both ends of the short-circuit portion 24 to be bent in a direction approaching the outer faces of the line electrodes 16a and 16b. The bending portions 24a and 24b are curved in a curved face shape according to the outer edges of the line electrodes 16a and 16b. A part of the short-circuit portion 24 opposed to the outer face of the surge protective device body 10a is curved according to the curved face of the outer face of the surge protective device body 10a.

FIG. 5 shows a plan development view of the fail-safe spring 20.

As described above, the fail-safe spring 20 includes the elastic mount portion 22 and the short-circuit portion 24. The short-circuit portion 24 is provided at a position deviating from the longitudinal center of the elastic mount portion 22 so as to intersect in a direction perpendicular to the longitudinal direction of the elastic mount portion 22. The protrusions 21 are provided in the vicinity of both ends of the elastic mount portion 22. The bending portions 24a and 24b are provided at both ends of the short-circuit portion 24.

The recess 26 for housing the solder chip 30 therein is formed at the intersecting position of the elastic mount portion 22 and the short-circuit portion 24. In the embodiment, the solder chip 30 which is rectangular in the plan view is used. For this reason, the recess 26 is formed in a rectangular shape according to the plan shape of the solder chip 30.

The recess 26 surely interposes the solder chip 30 between the outer face of the surge protective device body 10a and the fail-safe spring 20 by accommodating the solder chip 30 in the recess 26, and operates to mount the fail-safe spring 20. The recess 26 is formed with a depth smaller than a thickness of the solder chip 30.

The elastic mount portion 22 is provided with a hole 28 allowing the lead pin 18a to pass therethrough at a position intersecting with a side portion 26a of the recess 26 opposed to the short side of the elastic mount portion 22. The hole 28 is formed of a longitudinal hole which is longitudinally parallel to a longitudinal direction of the elastic mount portion 22. In the hole 28, the lead pin 18a can move in the longitudinal direction of the hole 28. The solder chip 30 which is formed in rectangular shape in the plan view is housed in the recess 26. The hole 28 is provided so that one longitudinal end side thereof enters the area where the solder chip 30 is housed.

The inner face of the short-circuit portion 24 opposed to the outer face of the surge protective device body 10a is provided with grooves 24c and 24d formed to contact with the side portions 26b and 26c (flat area of the recess 26) of the recess 26 opposed to the short-circuit portion 24. One end sides of the groove 24c and 24d are provided to contact with the side portions 26b and 26c of the recess 26 in parallel to the longitudinal direction of the short-circuit portion 24, and the other end sides of the grooves 24a and 24d are provided to extend to the end portions (position where the bending portions 24a and 24b are provided) of the short-circuit portion 24. In the cross-sectional view, the grooves 24c and 24d may be formed in a specific shape such as a V shape.

In the embodiment, the fail-safe spring 20 is formed using a stainless steel material. When using the metal material, it is easy to perform a press process, and it is easy for the elastic mount portion 22 or the short-circuit portion 24 to be formed in a specific shape. Also, it is easy to process the recess 26.

As described above, since the fail-safe spring 20 is elastically mounted on the body of the 3-electrode surge protective device 10, any materials having necessary elasticity other than the stainless steel material may be used. The short-circuit portion 24 operates to electrically connect the earth electrode 12 to the line electrodes 16a and 16b. Accordingly, a conductive material is used as a raw material of the fail-safe spring 20. The material is selected in consideration of weather resistance, and coating for corrosion resistance may be performed as necessary.

(Operation of 3-Electrode Surge Protective Device)

The 3-electrode surge protective device 10 shown in FIG. 1 is assembled as follows: the solder chip 30 is housed in the recess 26 of the fail-safe spring 20, the lead pin 18a is inserted into the hole 28, and the elastic mount portion 22 is fitted to the outer face of the surge protective device body 10a while opening the elastic mount portion 22 in the direction which separates both ends of the elastic mount portion 22.

As shown in FIG. 3, the fail-safe spring 20 is mounted such that the solder chip 30 is in contact with the outer face (part where the earth electrode 12 is provided) of the body and the protrusion 21 provided on the elastic mount portion 22 is in contact with the outer face of the earth electrode 12.

FIG. 6A shows a state where the fail-safe spring 20 and the solder chip 30 are mounted on the surge protective device body 10a, when viewed from the lower side where the lead pins 18a, 18b, and 18c are provided.

When the solder chip 30 is housed in the recess 26 and the lead pin 18a is inserted into the hole 28, the position of the lead pin 18a is restricted within the hole 28 by the side face of the solder chip 30. That is, the lead pin 18a is restricted to be positioned on the outside of the recess 26 in the hole 28 by the solder chip 30. Accordingly, the short-circuit portion 24 of the fail-safe spring 20 is supported at the separation position separated from the lead pins 18b and 18c. In other words, the positions and shapes of the recess 26 of the fail-safe spring 20 and the solder chip 30 are set to be at the separation positions in which the lead pins 18a, 18b, and 18c are not in contact with the short-circuit portion 24 in the state where the solder chip 30 is housed in the recess 26.

FIG. 6A shows a mounting state of the fail-safe spring 20 in a normal situation. In a normal situation, the fail-safe spring 20 is electrically connected to the earth electrode 12 and the lead pin 18a through the solder chip 30 and the protrusion 21. Meanwhile, the short-circuit portion 24 of the fail-safe spring 20 is separated from the outer faces of the line electrodes 16a and 16b, and is located at the separation position separated from the lead pins 18b and 18c. Accordingly, the earth electrode 12 is not electrically connected to the line electrodes 16a and 16b.

FIG. 6B shows a state where a surge current enters the 3-electrode surge protective device 10 and the fail-safe mechanism operates.

When the discharge of the 3-electrode surge protective device 10 continues without stopping and the body of the surge protective device 10 is overheated and the temperature of the body reaches a temperature which melts the solder chip 30, the solder chip 30 housed in the recess 26 is melted and the restriction imposed on the lead pin 18a by the solder chip 30 is released. Thus, the lead pin 18a moves into the hole 28 and enters the recess 26. That is, the short-circuit portion 24 moves toward the lead pins 18b and 18c by the elastic force of the fail-safe spring 20. In FIG. 6B, the moving direction of the short-circuit portion 24 is represented by arrows when the solder chip 30 has melted. The side edges of the short-circuit portion 24 move to a contact position coming into contact with the outer faces of the lead pins 18b and 18c, the lead pins 18a, 18b, and 18c are electrically connected to each other through the short-circuit portion 24, and the earth electrode 12 and the line electrodes 16a and 16b are electrically short-circuited.

The elastic force of the fail-safe spring 20 constantly operates in a direction of pressing the solder chip 30 toward the outer face of the surge protective device body 10a. In other words, the elastic force operates in a direction of allowing the fail-safe spring 20 to move toward the outer face of the surge protective device body 10a. Accordingly, when the solder chip 30 has melted, the elastic mount portion 22 and the short-circuit portion 24 of the fail-safe spring 20 move to be compressed (reduction of diameter) toward the outer face of the body of the 3-electrode surge protective device 10.

At this time, the molten solder chip 30a formed by the melting of the solder chip 30 housed in the recess 26 is compressed between the inner face of the fail-safe spring 20 and the outer face of the surge protective device body 10a, and spreads out between the inner face of the fail-safe spring 20 and the outer face of the surge protective device body 10a.

FIG. 6B shows a state where the molten solder chip 30a has spread out. First of all, the molten solder chip 30a spreads out in the vicinity of the recess 26, but a part of the molten solder chip 30a is guided toward the grooves 24c and 24d of the short-circuit portion 24 so as to spread out toward the end portions of the short-circuit portion 24. The short-circuit portion 24 is compressed toward (pressed in contact with) the outer face of the surge protective device body 10a, the inner face of the short-circuit portion 24 comes into contact with the outer face of the earth electrode 12 and the outer faces of the line electrode 16a and 16b, and the earth electrode 12 and the line electrodes 16a and 16b are electrically short-circuited to each other through the short-circuit portion 24. Since the molten solder chip 30a spreads out so as to fill a gap between the inner face of the short-circuit portion 24 and the outer face of the surge protective device body 10a, the short-circuit portion 24, the earth electrode 12, and the line electrodes 16a and 16b are surely electrically connected in close contact through the molten solder chip 30a.

In the embodiment, the inner face of the short-circuit portion 24 is formed of the curved face according to the curved face of the outer face of the surge protective device body 10a. Accordingly, when the diameter of the fail-safe spring 20 is reduced toward the outer face of the surge protective device body 10a, the inner face of the short-circuit portion 24 comes into contact with the outer face of the surge protective device body 10a according to the outer face of the surge protective device body 10a and it is possible to surely electrically short-circuit the earth electrode 12 and the line electrodes 16a and 16b through the short-circuit portion 24.

The bending portions 24a and 24b provided at both ends of the short-circuit portion 24 comes into contact with the outer peripheries of the line electrodes 16a and 16b when the diameter of the fail-safe spring 20 is reduced. Accordingly, the electrical connection of the short-circuit portion 24 and the line electrodes 16a and 16b is further surely secured.

The 3-electrode surge protective device 10 according to the embodiment complexly operates as follows. (1) The short-circuit portion 24 comes into press contact with the lead pins 18a, 18b, and 18c. (2) The short-circuit portion 24 comes into contact with the outer faces of the earth electrode 12 and the line electrodes 16a and 16b. (3) The molten solder chip 30a spreads out between the inner face of the short-circuit portion 24 and the outer face of the surge protective device body 10a. (4) The protrusion 21 provided on the elastic mount portion 22 to be close to the lead pins at the lower end comes into contact with the outer face of the earth electrode 12. (5) The bending portions 24a and 24b provided at both ends of the short-circuit portion 24 come into contact with the line electrodes 16a and 16b. Accordingly, when the discharge of the 3-electrode surge protective device 10 continues, the earth electrode 12 and the line electrodes 16a and 16b are electrically short-circuited to stop the discharge of the surge protective device 10.

As described above, according to the fail-safe mechanism of the embodiment, even when the surge currents having different phases enter the line electrodes 16a and 16b of the 3-electrode surge protective device 10 and are discharged by only one line electrode of the surge protective device 10, the earth electrode 12 and both the line electrodes 16a and 16b are earthed to stop the discharge of the surge protective device 10. Therefore, it is possible to surely detect which surge protective device is faulty (fail-safe mechanism operates) through the telephone line.

In the embodiment, the solder chip 30 interposed between the fail-safe spring 20 and the surge protective device body 10a is used as a conductive material, which is melted when the surge protective device body 10a overheats. The conductive material is not limited to the solder, and an appropriate material with conductivity may be used. In the embodiment, the rectangular solder chip 30 is used, but the shape of the conductive material also serving as a spacer interposing between the fail-safe spring 20 and the lightning arresting body 10a is not limited to the rectangular shape and a conductive material with an appropriate shape may be used.

Second Embodiment

FIG. 7 is a perspective view illustrating a 3-electrode surge protective device 10 provided with a fail-safe mechanism according to a second embodiment, and FIG. 8 is a development view of a fail-safe spring 20 provided on a surge protective device body 10a. The fail-safe mechanism according to the embodiment is assembled in the same manner as the fail-safe mechanism described in the first embodiment. Thus, the fail-safe spring 20 is provided with the elastic mount portion 22 and the short-circuit portion 24, and the fail-safe spring 20 is elastically mounted on the surge protective device body 10a through the solder chip 30.

The second embodiment is different from the first embodiment in that cross-sectional V-shaped protrusions 21a, which extends from the front end edges of the elastic mount portion 22 toward the inside in the longitudinal direction of the elastic mount portion 22, are formed instead of the semispherical protrusions 21 provided at both ends of the elastic mount portion 22 in the first embodiment.

The elastic mount portion 22 with the protrusions 21 and 21a is provided to secure electrical connection between the earth electrode 12 and the elastic mount portion 22, and also to secure the operation of reducing the diameter of the elastic mount portion 22 when the solder chip 30 has melted, by bringing the protrusions 21 and 21a into contact with the outer peripheral face of the earth electrode 12.

When the face of the elastic mount portion 22 is in contact with the earth electrode 12, friction resistance to the outer face of the earth electrode 12 becomes high when the diameter of the elastic mount portion 22 is reduced, and the reduction of the diameter (movement) of the elastic mount portion 22 may be disturbed. When the elastic mount portion 22 is provided with the protrusions 21 and 21a, the contact area between the protrusions 21 and 21a and the earth electrode 12 becomes small. Accordingly, the elastic mount portion 22 easily moves, and thus it is possible to reduce the diameter of the elastic mount portion 22. As described in the embodiment, when the protrusions 21a are formed in the V shape, it is possible to further easily perform the diameter reduction operation of the elastic mount portion 22 as compared with the protrusions 21 formed in the semispherical shape.

The semispherical or the V-shaped protrusions 21 and 21a can be easily formed on the elastic mount portion 22 by a pressing process.

(Width of Elastic Mount Portion)

FIG. 9 shows a cross-sectional view of the surge protective device body 10a of the 3-electrode surge protective device 10. As described above, the surge protective device body 10a is assembled by closely soldering the earth electrode 12 and the line electrodes 16a and 16b onto the end faces of the ceramic cylinders 14a and 14b. FIG. 9 shows a position of mounting the elastic mount portion 22 of the fail-safe spring 20 mounted on the surge protective device body 10a.

Trigger lines 15 are formed on the inner faces of the ceramic cylinders 14a and 14b in order to stabilize a response operation of discharge of the surge protective device 10. The trigger lines 15 are formed of carbon and extend from the end faces of the ceramic cylinders 14a and 14b, which are in contact with the line electrodes 16a and 16b, toward the earth electrode 12, in an axial direction. Also, the trigger lines 15 are formed in a line shape to have a predetermined length. When the ceramic cylinders 14a and 14b are bonded to the line electrode 16a and 16b, the end portions of the trigger lines 15 close to the line electrodes 16a and 16b is connected to metal faces on the line electrodes 16a and 16b.

A length of the trigger lines 15 is appropriately set to adjust discharge voltage of the surge protective device 10. In the 3-electrode surge protective device according to the embodiment, a width of the elastic mount portion 22 of the fail-safe spring 20 is set so that the trigger lines 15 overlap with the side edge positions of the elastic mount portion 22 in the state where the surge protective device body 10a is provided with the fail-safe spring 20. In FIG. 9, a range where the trigger lines 15 overlap with the elastic mount portion 22 is represented by the width d.

FIGS. 10 and 11 show test results of a discharge characteristic before and after the surge protective device body 10a is provided with the fail-safe spring 20. The discharge characteristics of ten samples were examined. L1(+) and L1(−) are test results in which the discharge characteristic between the line electrode 16a through the lead pin 18b and the earth electrode 12 through the lead pin 18a was examined in two directions, a plus direction (L1(+)) and a minus direction (L1(−)). L2(+) and L2(−) are test results in which the discharge characteristic between the line electrode 16b through the lead pin 18c and the earth electrode 12 through the lead pin 18a was examined in two directions, a plus direction (L2(+)) and a minus direction (L2(−)).

As shown in FIG. 10, before the mounting of the fail-safe spring 20, the discharge voltage on the minus side was higher than the discharge voltage on the plus side, that is, there is a difference in discharge voltage. On the contrary, as shown in FIG. 11, in the state where the fail-safe spring 20 is mounted, for all the line electrodes L1 and L2, the tendency where the discharge voltage on the minus side is higher than the discharge voltage on the plus side is suppressed, the difference in discharge voltage becomes small as a whole, and thus the discharge characteristic of the surge protective device 10 is stable.

The test results show that the fail-safe spring 20 acts on the discharge operation of the surge protective device 10. That is, as shown in FIG. 9, the elastic mount portion 22 overlaps with the trigger lines 15 which are in contact with the line electrodes 16a and 16b. Accordingly, when the elastic mount portion 22 is charged due to potential differences at the time of starting the discharge, there is an effect that electric charges are early caused on the trigger lines 15 and electron discharge is promoted. Thus, it is possible to improve the response time of the discharge start voltage. Particularly, the discharge start voltage on the L1(+) and L1(−) sides can be decreased to the range of L2(+) and L2(−), and thus the discharge characteristic of the surge protective device can be stabilized.

The 3-electrode surge protective device according to the present invention may be mounted on protective devices of telephone lines, and may be used as a protective component for protecting telephones from surges such as lightning which enters the telephone lines.

According to the 3-electrode surge protective device, when the surge protective device body is overheated, the conductive material is melted and loses its function as the spacer. The short-circuit portion comes into contact with the leads pins, which are provided on both the earth electrode and the line electrodes, and thus the earth electrode and the line electrodes are electrically short-circuited to each other. Therefore, it is possible to stop the discharge of the surge protective device, both of the line electrodes are electrically connected to the earth electrode, and thus it is possible to easily detect the faulty 3-electrode surge protective device.

While the present invention has been shown and described with reference to certain exemplary embodiments thereof, other implementations are within the scope of the claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A 3-electrode surge protective device comprising: a surge protective device body comprising: an earth electrode;a ceramic cylinder bonded to the earth electrode; anda pair of line electrodes bonded to both side faces of the ceramic cylinder, anda fail-safe spring with an electrical conductivity that is mounted on an outer face of the surge protective device body, the fail-safe spring comprising: an elastic mount portion provided along an outer peripheral face of the earth electrode to push an outer peripheral face of the surge protective device body; anda short-circuit portion provided to intersect with the elastic mount portion and electrically connecting the earth electrode to the pair of line electrodes,a conductive material that is sandwiched between an inner face of the fail-safe spring and the outer face of the surge protective device body, the conductive material being provided at an intersecting position of the elastic mount portion and the short-circuit portion; anda pair of first lead pins provided on the pair of line electrodes;a second lead pin provided on the earth electrode; andwherein, in a normal state, the conductive material serves as a spacer to support the short-circuit portion at a separation position where the short-circuit portion is separated from the outer peripheral face of the surge protective device body and the first lead pins, andwherein, in case where the surge protective device body is overheated and the conductive material is melted, the short-circuit portion is moved to a contact position where the short-circuit portion comes into contact with the second lead pin and the first lead pins, by a pushing force of the elastic mount portion.

2. The 3-electrode surge protective device according to claim 1, wherein the second lead pin is inserted into an insertion hole which is formed near the intersecting position, andwherein the insertion hole is formed of an elongate hole whose long axis is in a direction where the short-circuit portion is moved between the separation position and the contact position.

3. The 3-electrode surge protective device according to claim 2, wherein a recess for housing the conductive material therein is formed at the intersecting position, andwherein the conductive material is housed in the recess while covering a portion of the insertion hole.

4. The 3-electrode surge protective device according to claim 1, wherein a recess for housing the conductive material therein is formed at the intersecting position, andwherein a groove is provided on the inner face of the short-circuit portion opposed to the surge protective device body so as to extend from the recess to an end portion of the short-circuit portion.

5. The 3-electrode surge protective device according to claim 1, wherein the fail-safe spring further comprises: bending portions provided at both ends of the short-circuit portion and curved along curved faces of outer edges of the line electrodes.

6. The 3-electrode surge protective device according to claim 1, wherein a portion of the short-circuit portion opposed to the outer face of the surge protective device body is curved along a curved outer face of the surge protective device body.

7. The 3-electrode surge protective device according to claim 1, wherein the fail-safe spring further comprises: protrusions provided on the inner face of both end portions of the elastic mount portion opposed to the outer face of the surge protective device body so as to protrude toward the outer face of the earth electrode.

8. The 3-electrode surge protective device according to claim 1, wherein carbon trigger lines are provided on the inner face of the ceramic cylinder so as to overlap with the elastic mount portion when viewed from a top.