3002864

Information

• Patent Grant
• 3002864

• References
• Source

• Patent Number

  3,002,864

• Date Filed

  Not available

• Date Issued

  Tuesday, October 3, 1961
  63 years ago

• CPC

  • B60M1/135 - composite
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 065 - Glass manufacturing
  • 228 - Metal fusion bonding