3058209

Information

• Patent Grant
• 3058209

• References
• Source

• Patent Number

  3,058,209

• Date Filed

  Not available

• Date Issued

  Tuesday, October 16, 1962
  62 years ago

• CPC

  • H01L21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01J5/28 - between conductive parts of vessel
  • H01J2893/0044 - Direct connection between two metal elements, in particular via material a connecting material
  • Y10S220/29 - Welded seam

• US Classifications

  • 228 - Metal fusion bonding
  • 220 - Receptacles
  • 257 - Active solid-state devices