3131988

Information

• Patent Grant
• 3131988

• References
• Source

• Patent Number

  3,131,988

• Date Filed

  Not available

• Date Issued

  Tuesday, May 5, 1964
  60 years ago

• CPC

  • H01R33/7628 - the wires being connected using solder
  • H01R12/716 - Coupling device provided on the PCB
  • H01R13/415 - by permanent deformation of contact member
  • H01R31/02 - Intermediate parts for distributing energy to two or more circuits in parallel

• US Classifications

  • 439 - Electrical connectors