3175893

Information

• Patent Grant
• 3175893

• References
• Source

• Patent Number

  3,175,893

• Date Filed

  Not available

• Date Issued

  Tuesday, March 30, 1965
  59 years ago

• CPC

  • B23K20/2333 - one layer being aluminium, magnesium or beryllium
  • B21J1/003 - Selecting material
  • B23K20/233 - without ferrous layer
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • Y10S29/032 - Rolling with other step
  • Y10S428/929 - Electrical contact feature
  • Y10T29/49908 - Joining by deforming
  • Y10T428/12243 - Disk
  • Y10T428/12347 - Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
  • Y10T428/12451 - Macroscopically anomalous interface between layers
  • Y10T428/12493 - Composite i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
  • Y10T428/12528 - Semiconductor component
  • Y10T428/12639 - Adjacent, identical composition, components
  • Y10T428/12681 - Ga-, In-, Tl- or Group VA metal-base component
  • Y10T428/12736 - Al-base component

• US Classifications

  • 428 - Stock material or miscellaneous articles
  • 029 - Metal working
  • 148 - Metal treatment
  • 228 - Metal fusion bonding
  • 438 - Semiconductor device manufacturing: process