3186618

Information

• Patent Grant
• 3186618

• References
• Source

• Patent Number

  3,186,618

• Date Filed

  Not available

• Date Issued

  Tuesday, June 1, 1965
  59 years ago

• CPC

  • H01B13/2653 - Details of the soldering stage

• US Classifications

  • 228 - Metal fusion bonding