3378914

Information

• Patent Grant
• 3378914

• References
• Source

• Patent Number

  3,378,914

• Date Filed

  Not available

• Date Issued

  Tuesday, April 23, 1968
  56 years ago

• CPC

  • B23K35/38 - Selection of media
  • B23K1/19 - taking account of the properties of the materials to be soldered
  • B23K35/284 - Mg as the principal constituent
  • B23K35/286 - Al as the principal constituent
  • B23K2201/02 - Honeycomb structures
  • B23K2201/14 - Heat exchangers
  • Y10S428/938 - Vapor deposition or gas diffusion
  • Y10S428/939 - Molten or fused coating
  • Y10T428/12764 - Next to Al-base component

• US Classifications

  • 228 - Metal fusion bonding
  • 428 - Stock material or miscellaneous articles