3734172

Information

• Patent Grant
• 3734172

• References
• Source

• Patent Number

  3,734,172

• Date Filed

  Not available

• Date Issued

  Tuesday, May 22, 1973
  51 years ago

• CPC

  • G05D23/192 - using a modification of the thermal impedance between a source and the load
  • F28F13/00 - Arrangements for modifying heat-transfer
  • Y10S165/134 - by varying thickness of conductive layer

• US Classifications

  • 165 - Heat exchange