3734794

Information

• Patent Grant
• 3734794

• References
• Source

• Patent Number

  3,734,794

• Date Filed

  Not available

• Date Issued

  Tuesday, May 22, 1973
  51 years ago

• CPC

  • H01B9/023 - composed of helicoidally wound tape-conductors
  • H01B7/0241 - comprising one or more helical wrapped layers of insulation
  • H01B9/025 - composed of helicoidally wound wire-conductors
  • H01B9/027 - composed of semi-conducting layers
  • H01B13/0891 - After-treatment
  • H01B13/26 - by winding, braiding, or longitudinal lapping

• US Classifications

  • 156 - Adhesive bonding and miscellaneous chemical manufacture