3789167

Information

• Patent Grant
• 3789167

• References
• Source

• Patent Number

  3,789,167

• Date Filed

  Not available

• Date Issued

  Tuesday, January 29, 1974
  51 years ago

• CPC

  • H01H13/702 - with contacts carried by or formed from layers in a multilayer structure
  • H01H2207/012 - via underside of substrate
  • H01H2209/078 - Conductive rubber
  • H01H2223/034 - Bezel
  • H01H2229/026 - Riveting
  • H01H2229/044 - Injection moulding
  • H01H2239/044 - High voltage application

• US Classifications

  • 200 - Electricity: circuit makers and breakers