3814640

Information

• Patent Grant
• 3814640

• References
• Source

• Patent Number

  3,814,640

• Date Filed

  Not available

• Date Issued

  Tuesday, June 4, 1974
  50 years ago

• CPC

  • H01H1/0231 - provided with a solder layer
  • Y10T29/49204 - Contact or terminal manufacturing
  • Y10T428/263 - Coating layer not in excess of 5 mils thick or equivalent

• US Classifications

  • 148 - Metal treatment
  • 029 - Metal working
  • 200 - Electricity: circuit makers and breakers
  • 257 - Active solid-state devices
  • 428 - Stock material or miscellaneous articles