3880608

Information

• Patent Grant
• 3880608

• References
• Source

• Patent Number

  3,880,608

• Date Filed

  Not available

• Date Issued

  Tuesday, April 29, 1975
  49 years ago

• CPC

  • C22C32/0021 - Matrix based on noble metals, Cu or alloys thereof
  • H01H1/0231 - provided with a solder layer

• US Classifications

  • 228 - Metal fusion bonding