DM0000: The mark consists of the stylized wording "DI PAK", the phrase "THE FUTURE OF CERAMIC PACKAGING", and the design of a sphere with a stylized letter "D" on the surface.
GS0091: Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof
LS0000: The lining and the stippling in the drawing indicate shading.
PM0000: DYE PACK
Case File Event Statements
11/17/2000 - 24 years ago
12 - ABANDONMENT - NO USE STATEMENT FILEDType:ABN6
2/22/2000 - 24 years ago
11 - NOA MAILED - SOU REQUIRED FROM APPLICANTType:NOAM
11/30/1999 - 25 years ago
10 - PUBLISHED FOR OPPOSITIONType:PUBO
10/29/1999 - 25 years ago
9 - NOTICE OF PUBLICATIONType:NPUB
8/4/1999 - 25 years ago
8 - APPROVED FOR PUB - PRINCIPAL REGISTERType:CNSA
7/14/1999 - 25 years ago
7 - EXAMINER'S AMENDMENT MAILEDType:CNEA
3/5/1999 - 25 years ago
6 - NON-FINAL ACTION MAILEDType:CNRT
1/25/1999 - 25 years ago
5 - NON-FINAL ACTION MAILEDType:CNRT
11/27/1998 - 26 years ago
4 - CORRESPONDENCE RECEIVED IN LAW OFFICEType:CRFA