76057743 - ALPHA-FRY TECHNOLOGIES

Information

  • Trademark
  • 76057743
  • Serial Number
    76057743
  • Registration Number
    3029558
  • Filing Date
    May 25, 2000
    24 years ago
  • Registration Date
    December 13, 2005
    19 years ago
  • Transaction Date
    August 28, 2012
    12 years ago
  • Status Date
    July 20, 2012
    12 years ago
  • Published for Opposition Date
    June 04, 2002
    22 years ago
  • Location Date
    November 03, 2005
    19 years ago
  • First Use Anywhere Date
    January 01, 1998
    27 years ago
  • First Use In Commerce Date
    January 01, 1998
    27 years ago
  • Status Code
    710
  • Current Location
    PUBLICATION AND ISSUE SECTION
    Employee Name
    FRENCH, CURTIS W
  • Attorney Docket Number
    13130-01
    Attorney Name
    William M. Borchard
    Law Office Assigned Location Code
    M60
  • Owners
Mark Drawing Code
1000
Mark Identification
ALPHA-FRY TECHNOLOGIES
Case File Statements
  • D10000: "TECHNOLOGIES"
  • GS0011: CHEMICALS FOR USE IN THE MANUFACTURE AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRONIC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; THERMOPLASTIC PASTE ADHESIVES FOR USE IN THE MANUFACTURE OF ELECTRONIC ASSEMBLIES; SOLDERING CHEMICALS, NAMELY, AQUEOUS MACHINE DESCALERS FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; CHEMICAL PREPARATIONS IN THE NATURE OF RUST INHIBITORS; SOLDERING FLUX; WATER SOLUBLE SOLDERING FLUX; LOW SOLIDS SOLDER FLUX; SOLDERING FLUX, ZINC CHLORIDE TYPE; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; FLUXES USED FOR SOLDERING ELECTRONIC CIRCUITS, WHICH DO NOT REQUIRE CLEANING AFTER SAID USE; OXIDATION CHEMICALS FOR PROTECTING THE SURFACE TO WHICH THEY ARE APPLIED FOR USE IN CONNECTION WITH SOLDER; SILVER/GLASS DIE ATTACH MATERIAL ADHESIVES FOR USE IN SILICON CHIP BINDING; CHEMICAL PREPARATIONS FOR SOLDERING, NAMELY, SOLDERING INJECTION CHEMICALS TO REDUCE OXIDE FORMATION ON BRIDGE CONDUCTION LINES, SURFACE CONDITIONING CHEMICALS TO PREPARE SURFACES FOR SOLDERING; PROTECTIVE CHEMICAL COATINGS TO MAINTAIN SOLDERABILITY OF SURFACES; ULTRAVIOLET CURABLE POLYMERS FOR USE IN LEGEND INKS, SOLDER MASKS AND ETCHING/PLATING RESISTS; SOLDERING CHEMICALS, NAMELY, AQUEOUS RESIST STRIPPER FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY
  • GS0031: ORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS
  • GS0061: TIN AND LEAD EUTECTIC SOLDER; WATER SOLUBLE ORGANIC FLUX CORED SOLDER WIRE; COATED METAL STRIP; SOLDERS COMPOSED PRIMARILY OF LEAD AND TIN; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER; LASER CUT METAL STENCILS FOR USE IN THE ASSEMBLY OF ELECTRONIC COMPONENTS; SOLDER METAL ALLOY THAT IS TREATED TO INHIBIT DROSS FORMATION AND INCREASE FLUIDITY FOR USE IN SOLDERING APPLICATIONS; PASTES CONTAINING METAL POWDER FOR USE IN COPPER BRAZING; FLUX CORED WIRE SOLDER FOR USE IN THE ELECTRONICS INDUSTRY
Case File Event Statements
  • 7/20/2012 - 12 years ago
    34 - CANCELLED SEC. 8 (6-YR) Type: C8..
  • 12/13/2005 - 19 years ago
    33 - REGISTERED-PRINCIPAL REGISTER Type: R.PR
  • 11/1/2005 - 19 years ago
    32 - LAW OFFICE REGISTRATION REVIEW COMPLETED Type: REGV
  • 10/28/2005 - 19 years ago
    31 - ASSIGNED TO LIE Type: ALIE
  • 10/25/2005 - 19 years ago
    30 - ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED Type: CNPR
  • 9/13/2005 - 19 years ago
    29 - STATEMENT OF USE PROCESSING COMPLETE Type: SUPC
  • 8/26/2005 - 19 years ago
    28 - USE AMENDMENT FILED Type: IUAF
  • 8/30/2005 - 19 years ago
    27 - PAPER RECEIVED Type: MAIL
  • 1/24/2005 - 19 years ago
    26 - EXTENSION 5 GRANTED Type: EX5G
  • 1/6/2005 - 20 years ago
    25 - EXTENSION 5 FILED Type: EXT5
  • 1/6/2005 - 20 years ago
    24 - TEAS EXTENSION RECEIVED Type: EEXT
  • 10/28/2004 - 20 years ago
    23 - EXTENSION 4 GRANTED Type: EX4G
  • 8/22/2004 - 20 years ago
    22 - EXTENSION 4 FILED Type: EXT4
  • 7/29/2004 - 20 years ago
    21 - CASE FILE IN TICRS Type: CFIT
  • 7/22/2004 - 20 years ago
    20 - TEAS EXTENSION RECEIVED Type: EEXT
  • 3/2/2004 - 20 years ago
    19 - EXTENSION 3 GRANTED Type: EX3G
  • 2/23/2004 - 20 years ago
    18 - EXTENSION 3 FILED Type: EXT3
  • 2/23/2004 - 20 years ago
    17 - TEAS EXTENSION RECEIVED Type: EEXT
  • 8/11/2003 - 21 years ago
    16 - EXTENSION 2 GRANTED Type: EX2G
  • 8/11/2003 - 21 years ago
    15 - EXTENSION 2 FILED Type: EXT2
  • 8/11/2003 - 21 years ago
    14 - PAPER RECEIVED Type: MAIL
  • 2/20/2003 - 21 years ago
    13 - EXTENSION 1 GRANTED Type: EX1G
  • 2/20/2003 - 21 years ago
    12 - EXTENSION 1 FILED Type: EXT1
  • 2/25/2003 - 21 years ago
    11 - PAPER RECEIVED Type: MAIL
  • 8/27/2002 - 22 years ago
    10 - NOA MAILED - SOU REQUIRED FROM APPLICANT Type: NOAM
  • 6/4/2002 - 22 years ago
    9 - PUBLISHED FOR OPPOSITION Type: PUBO
  • 5/15/2002 - 22 years ago
    8 - NOTICE OF PUBLICATION Type: NPUB
  • 11/21/2001 - 23 years ago
    7 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA
  • 11/19/2001 - 23 years ago
    6 - EXAMINERS AMENDMENT MAILED Type: CNEA
  • 5/21/2001 - 23 years ago
    5 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 11/20/2000 - 24 years ago
    4 - NON-FINAL ACTION MAILED Type: CNRT
  • 11/15/2000 - 24 years ago
    3 - ASSIGNED TO EXAMINER Type: DOCK
  • 11/1/2000 - 24 years ago
    2 - ASSIGNED TO EXAMINER Type: DOCK
  • 10/20/2000 - 24 years ago
    1 - ASSIGNED TO EXAMINER Type: DOCK