76328762 - KS

Information

• Trademark
• 76328762

• Source

• Serial Number

  76328762

• Registration Number

  2788019

• International Classifications

  • 7 - Machines and machine tools
  • 8 - Hand tools and implements (hand-operated)
  • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
  • 35 - Advertising
  • 37 - Building construction
  • 40 - Treatment of materials
  • 41 - Education
  • 42 - Scientific and technological services and research and design relating thereto

• Filing Date

  October 24, 2001
  23 years ago

• Registration Date

  December 02, 2003
  21 years ago

• Transaction Date

  July 23, 2024
  9 months ago

• Status Date

  June 14, 2024
  10 months ago

• Published for Opposition Date

  September 09, 2003
  21 years ago

• Renewal Date

  December 02, 2023
  a year ago

• First Use Anywhere Date

  July 01, 2001
  23 years ago

• First Use In Commerce Date

  July 01, 2001
  23 years ago

• Status Code

  800

• Employee Name

  KAZAZIAN, MICHAEL H

• Attorney Docket Number

  TM-002US

  Attorney Name

  Christopher M. Spletzer, Sr.

• Owners

  • Kulicke & Soffa Investments, Inc.

Case File Statements

• GS0411: Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ]
• GS0401: [Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors;] [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ]
• GS0091: Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates ]
• GS0081: Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders
• GS0071: Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ]
• GS0371: Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment
• PM0000: KULICKE & SOFFA
• CC0000: Color is not claimed as a feature of the mark.
• GS0351: Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times
• GS0421: Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor

Case File Event Statements

• 4/11/2003 - 22 years ago

  11 - PAPER RECEIVED Type: MAIL

• 12/14/2001 - 23 years ago

  1 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA

• 12/14/2001 - 23 years ago

  2 - PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED Type: AMPX

• 2/22/2002 - 23 years ago

  3 - ASSIGNED TO EXAMINER Type: DOCK

• 2/25/2002 - 23 years ago

  4 - NON-FINAL ACTION MAILED Type: CNRT

• 8/26/2002 - 22 years ago

  5 - PAPER RECEIVED Type: MAIL

• 8/26/2002 - 22 years ago

  6 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA

• 9/27/2002 - 22 years ago

  7 - ASSIGNED TO EXAMINER Type: DOCK

• 10/9/2002 - 22 years ago

  8 - ASSIGNED TO EXAMINER Type: DOCK

• 10/10/2002 - 22 years ago

  9 - FINAL REFUSAL MAILED Type: CNFR

• 5/21/2003 - 21 years ago

  15 - CASE FILE IN TICRS Type: CFIT

• 6/30/2003 - 21 years ago

  17 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA

• 8/20/2003 - 21 years ago

  18 - NOTICE OF PUBLICATION Type: NPUB

• 12/2/2003 - 21 years ago

  20 - REGISTERED-PRINCIPAL REGISTER Type: R.PR

• 4/11/2003 - 22 years ago

  16 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA

• 4/25/2003 - 22 years ago

  10 - EXPARTE APPEAL RECEIVED AT TTAB Type: EXAF

• 4/29/2003 - 22 years ago

  12 - EX PARTE APPEAL-INSTITUTED Type: EXPI

• 5/13/2003 - 21 years ago

  13 - JURISDICTION RESTORED TO EXAMINING ATTORNEY Type: JURT

• 5/20/2003 - 21 years ago

  14 - CASE FILE IN TICRS Type: CFIT

• 9/9/2003 - 21 years ago

  19 - PUBLISHED FOR OPPOSITION Type: PUBO

• 12/2/2009 - 15 years ago

  23 - TEAS SECTION 8 & 15 RECEIVED Type: E815

• 12/11/2009 - 15 years ago

  25 - CASE ASSIGNED TO POST REGISTRATION PARALEGAL Type: APRE

• 12/16/2009 - 15 years ago

  26 - AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Type: ASGN

• 6/17/2014 - 10 years ago

  30 - REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED Type: 89AG

• 12/3/2003 - 21 years ago

  21 - EXPARTE APPEAL TERMINATED Type: EXPT

• 12/2/2009 - 15 years ago

  22 - FAX RECEIVED Type: FAXX

• 12/9/2009 - 15 years ago

  24 - AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Type: ASGN

• 1/4/2010 - 15 years ago

  27 - REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. Type: C15A

• 5/30/2014 - 10 years ago

  28 - TEAS SECTION 8 & 9 RECEIVED Type: E89R

• 6/17/2014 - 10 years ago

  29 - CASE ASSIGNED TO POST REGISTRATION PARALEGAL Type: APRE

• 6/17/2014 - 10 years ago

  31 - REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) Type: RNL1

• 6/17/2014 - 10 years ago

  32 - NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED Type: NA89

• 12/2/2022 - 2 years ago

  35 - COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED Type: REM2

• 6/14/2024 - 10 months ago

  37 - CASE ASSIGNED TO POST REGISTRATION PARALEGAL Type: APRE

• 6/14/2024 - 10 months ago

  38 - REGISTERED - PARTIAL SEC. 8 (10-YR) ACCEPTED Type: 8PRT

• 6/14/2024 - 10 months ago

  39 - REGISTERED - SEC. 9 GRANTED/CHECK RECORD FOR SEC. 8 Type: 9G8P

• 6/14/2024 - 10 months ago

  40 - REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS) Type: RNL2

• 6/14/2024 - 10 months ago

  41 - NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED Type: NAS8

• 1/29/2018 - 7 years ago

  33 - TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Type: REAP

• 1/29/2018 - 7 years ago

  34 - ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Type: ARAA

• 3/13/2024 - a year ago

  36 - TEAS SECTION 8 & 9 RECEIVED Type: E89R