DM0000: The mark consists of the stylized wording "ECO + PLUS LEAD FREE SOLUTIONS YOU CAN TRUST" as well as the depiction of a plus sign comprised of five squares. The wording "ECO + PLUS" appears above the wording "LEAD FREE SOLUTIONS YOU CAN TRUST" with the deception of the plus sign appearing to the left of the wording. The color black appears in the wording "ECO + PLUS LEAD FREE SOLUTIONS YOU CAN TRUST". The color light blue appears in the square in the center of the plus sign. Starting clockwise from the top of the plus sign the color of squares located on the ends of the plus sign appear in the colors pink, orange, yellow and green.
GS0061: [ Hard or soft solder bars; ] solder wire; [ solder foil; solder powder; hard or soft solders in the form of washer, ring, pellet, disk, or ribbon; ] hard or soft solders for use in industrial welding; solder paste for use in industrial welding; [ hard or soft solder balls for use in industrial welding; gold ingot solder for use in industrial welding; ] hard or soft solder alloys for use in industrial welding; hard or soft solders containing resin; resin core wire, namely, filamentous solder in which resin flux is filled for use in industrial welding; all of which do not contain lead
CC0000: The color(s) green, pink, light blue, yellow, orange and black is/are claimed as a feature of the mark.
GS0011: Chemicals for use in industry and science other than for medical or veterinary use; chemicals for welding and soldering purposes; chemical preparations for welding; chemical preparations for soldering; [ metal tempering preparations; chemicals for cleaning printed circuit boards, namely, solvent type processing compositions for use in the electronics industry; chemicals used for anti-tarnishing, plating, soldering, etching, stripping, and deterging metal surfaces for use in the manufacturing of electronic circuit boards, namely, solder mask, etchants for use in the manufacture of printed circuit boards, masking compounds for use in the manufacture of printed circuit boards, doping compounds for use in the manufacture of printed circuit boards, chemical oxidants for use in the manufacture of printed circuits, chemical coatings used in the manufacture of printed circuit boards; surface active chemical agents for use in the manufacture of detergents; ] soldering chemicals; soldering paste; soldering cream; soldering fluxes; [ plastic adhesives not for stationery or household purposes; adhesives for use in industry; ] all of which do not contain lead
Case File Event Statements
12/2/2013 - 11 years ago
4 - ASSIGNED TO EXAMINERType:DOCK
11/14/2013 - 11 years ago
1 - SN ASSIGNED FOR SECT 66A APPL FROM IBType:REPR
11/15/2013 - 11 years ago
2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTEREDType:NWOS
11/19/2013 - 11 years ago
3 - APPLICATION FILING RECEIPT MAILEDType:MAFR
12/9/2013 - 11 years ago
5 - NON-FINAL ACTION WRITTENType:CNRT
12/10/2013 - 11 years ago
6 - NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEWType:RFCR
12/10/2013 - 11 years ago
7 - REFUSAL PROCESSED BY MPUType:RFRR
12/10/2013 - 11 years ago
8 - NON-FINAL ACTION MAILED - REFUSAL SENT TO IBType:RFCS
12/31/2013 - 11 years ago
9 - REFUSAL PROCESSED BY IBType:RFNT
6/18/2014 - 10 years ago
13 - ASSIGNED TO LIEType:ALIE
6/6/2014 - 10 years ago
10 - TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVEDType:REAP
Trademark
79138412
