TREA

79349728 - SMARTSIC

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Information

  • Trademark
  • 79349728
  • Serial Number
    79349728
  • Filing Date
    March 31, 2022
    3 years ago
  • Transaction Date
    May 22, 2024
    10 months ago
  • Status Date
    October 11, 2023
    a year ago
  • Location Date
    April 11, 2024
    12 months ago
  • Status Code
    645
  • Current Location
    GENERIC WEB UPDATE
    Employee Name
    ONUOHA, UKACHUKWU FRED
  • Attorney Name
    Mari-Elise Paul
    Law Office Assigned Location Code
    O20
  • Owners
Information
Mark Drawing Code
4
Mark Identification
SMARTSIC
Case File Statements
  • GS0401: Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing and gluing of semiconductor material surfaces all of the above being part of custom manufacture; treatment of semiconductor substrates for microelectronics, optoelectronics, microsystems, radio frequency (RF) or power components, photonics; treatment of materials in the nature of semiconductor wafers and semiconductors; polishing semiconductor wafers; transferring a layer of materials, semiconductors or components to any media being part of custom manufacturing; treatment of materials, namely, ion implantation in materials; treatment of materials, namely, deposing layers of materials, especially Chemical Vapor Deposition or Physical Vapor Deposition of thin layers; treatment of materials, namely, custom manufacturing by sublimation, such as manufacturing by Physical Vapor Transport; treatment of materials, namely, growth of material layers, especially in epitaxy; treatment of materials, namely, manufacturing by powder sintering processes
  • GS0091: Multi-layer substrates being a layered semiconductor; multilayer substrates consisting of semiconductor being a layered semiconductor for optoelectronics, microelectronics, photonics, integrated circuits, radio frequency (RF) or power electronic components, for transistors, thyristors and diodes, for microsystems, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes
  • GS0421: Testing semiconductor materials; research and development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; research and development of new products in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; engineering and engineering services in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering electric radio frequency currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; engineering and engineering services in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; technical assistance and support services, namely, technical engineering advice for the development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; technical assistance and support services, namely, technical engineering advice for the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material layer transfer, semiconductors or components on all media, in the field of ion implantation in materials, in the field of layer deposition of materials, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as being Physical Vapor Transport, in the field of powder sintering process manufacturing
Case File Event Statements
  • 9/15/2022 - 2 years ago
    1 - SN ASSIGNED FOR SECT 66A APPL FROM IB Type: REPR
  • 9/16/2022 - 2 years ago
    2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS
  • 9/20/2022 - 2 years ago
    3 - APPLICATION FILING RECEIPT MAILED Type: MAFR
  • 1/18/2023 - 2 years ago
    4 - ASSIGNED TO EXAMINER Type: DOCK
  • 1/24/2023 - 2 years ago
    5 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 1/25/2023 - 2 years ago
    6 - NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW Type: RFCR
  • 3/19/2023 - 2 years ago
    7 - REFUSAL PROCESSED BY MPU Type: RFRR
  • 3/19/2023 - 2 years ago
    8 - NON-FINAL ACTION MAILED - REFUSAL SENT TO IB Type: RFCS
  • 4/13/2023 - a year ago
    9 - REFUSAL PROCESSED BY IB Type: RFNT
  • 9/18/2023 - a year ago
    10 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 9/18/2023 - a year ago
    11 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 9/19/2023 - a year ago
    12 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 10/11/2023 - a year ago
    13 - FINAL REFUSAL WRITTEN Type: CNFR
  • 10/11/2023 - a year ago
    14 - FINAL REFUSAL E-MAILED Type: GNFR
  • 10/11/2023 - a year ago
    15 - NOTIFICATION OF FINAL REFUSAL EMAILED Type: GNFN
  • 2/21/2024 - a year ago
    18 - NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB Type: OPNS
  • 12/6/2023 - a year ago
    16 - ASSIGNED TO EXAMINER Type: DOCK
  • 2/21/2024 - a year ago
    17 - NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB Type: OPNR
  • 4/11/2024 - 12 months ago
    24 - ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Type: ARAA
  • 3/11/2024 - a year ago
    19 - NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB Type: OPNX
  • 4/11/2024 - 12 months ago
    22 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 4/11/2024 - 12 months ago
    21 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 4/11/2024 - 12 months ago
    20 - TEAS REQUEST FOR RECONSIDERATION RECEIVED Type: ERFR
  • 4/11/2024 - 12 months ago
    23 - TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Type: REAP
  • 4/11/2024 - 12 months ago
    25 - TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS Type: ECDR
  • 4/11/2024 - 12 months ago
    26 - TEAS CHANGE OF CORRESPONDENCE RECEIVED Type: TCCA
  • 4/29/2024 - 11 months ago
    27 - CORRECTION TRANSACTION RECEIVED FROM IB Type: CRCV
  • 5/21/2024 - 10 months ago
    28 - CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED Type: CORR