79387071 - IMEC. NETZERO

Information

  • Trademark
  • 79387071
  • Serial Number
    79387071
  • Filing Date
    November 03, 2023
    a year ago
  • Transaction Date
    July 24, 2025
    2 months ago
  • Status Date
    July 16, 2025
    3 months ago
  • Published for Opposition Date
    July 29, 2025
    2 months ago
  • Location Date
    July 10, 2025
    3 months ago
  • Status Code
    681
  • Current Location
    PUBLICATION AND ISSUE SECTION
    Employee Name
    KOPENSKI, CLAUDIA
  • Attorney Docket Number
    17309-200030
    Attorney Name
    Jessica S. Sachs
    Law Office Assigned Location Code
    O20
  • Owners
Mark Drawing Code
4
Mark Identification
IMEC. NETZERO
Case File Statements
  • GS0411: Training services in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; training services in the field of semiconductors, integrated circuits and application-specific integrated circuits; educational services, namely, conducting programs in the field of scientific modelling of the environmental impact of manufacturing; educational services, namely, the organization and conducting of workshops, conferences and seminars in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; publication of online and electronic books and periodicals; publication of learning materials in the nature of books and periodicals in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; developing learning materials, namely, educational materials for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; provision of non-downloadable, online electronic publications in the nature of books, magazines, and brochures in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; providing educational advising and information with respect to education in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips, also by electronic networks particularly the internet; training in the field of the design of integrated circuits; training in the field of the development of integrated circuits; training in the field of reducing the carbon footprint of lithography and etch process steps; educational services, namely, providing workshops, conferences and seminars in the field of reducing the carbon footprint of lithography and etch process steps
  • GS0401: Custom manufacture of integrated circuits, application-specific integrated circuits (asics), semiconductors, microprocessors, microcontrollers, and embedded systems; custom manufacture of semiconductor components, devices and circuits
  • GS0091: Downloadable computer-aided manufacturing (CAM) software for scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; downloadable computer software for scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; downloadable computer application software for measuring the environmental impact of manufacturing integrated circuit chips; downloadable computer application software for scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips to help reduce the carbon footprint of lithography and etch process steps; application-specific integrated circuits; electronic chips for the manufacture of integrated circuits; blank electronic chip cards; encoded electronic chip cards containing programming used for scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; downloadable computer software for environmental monitoring; semiconductor chips; integrated circuit chips; semiconductors; semiconductor apparatus; semiconductor testing apparatus; integrated circuits; downloadable mobile applications for scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips
  • GS0351: Business consulting services, namely, providing business information and advice concerning semiconductors, integrated circuits and application-specific integrated circuits (ASICs); business consulting services, namely, providing business information relating to reducing the carbon footprint of lithography and etch process steps
  • GS0421: Providing temporary use of online non-downloadable web-based applications for scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; environmental consulting services in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; scientific research in the field of environmental conservation; research in the reduction of carbon emissions; research in the area of semiconductor processing technology; technical project studies in the nature of technical research in the field of carbon offsetting; technical consultancy in the field of the production of semiconductors; providing scientific information, advice and consultancy relating to carbon offsetting; providing scientific information, advice and consultancy relating to net zero emissions; providing scientific information, advice and consultancy relating to reducing the carbon footprint of lithography and etch process steps; design, development, and testing in the field of integrated circuits, application-specific integrated circuits (ASICs), semiconductors, microprocessors, microcontrollers and embedded systems for others; product quality testing services; technological consultancy in the field of new semiconductor processing and manufacturing technologies; research and development services in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; quality control and authentication services for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; scientific and technological services, namely, scientific research, analysis, testing and modelling in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; industrial analysis and industrial research services in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; development of new technology for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips; design of integrated circuits; integrated circuit design services; technology consultancy in the field of new semiconductor processing and manufacturing technologies by experts; scientific advice, consultancy and information relating to the design and modelling in the field of scientific modelling of the environmental impact of manufacturing integrated circuits, semiconductor technologies, and electronic components in the nature of electronic chips also to be provided via electronic networks particularly the internet
Case File Event Statements
  • 1/4/2024 - a year ago
    1 - SN ASSIGNED FOR SECT 66A APPL FROM IB Type: REPR
  • 1/6/2024 - a year ago
    2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS
  • 1/10/2024 - a year ago
    3 - APPLICATION FILING RECEIPT MAILED Type: MAFR
  • 6/13/2024 - a year ago
    4 - ASSIGNED TO EXAMINER Type: DOCK
  • 6/26/2024 - a year ago
    6 - NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW Type: RFCR
  • 7/23/2024 - a year ago
    8 - NON-FINAL ACTION MAILED - REFUSAL SENT TO IB Type: RFCS
  • 7/23/2024 - a year ago
    7 - REFUSAL PROCESSED BY MPU Type: RFRR
  • 6/25/2024 - a year ago
    5 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 8/11/2024 - a year ago
    9 - REFUSAL PROCESSED BY IB Type: RFNT
  • 1/23/2025 - 9 months ago
    10 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 2/20/2025 - 8 months ago
    14 - FINAL REFUSAL E-MAILED Type: GNFR
  • 5/28/2025 - 4 months ago
    17 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 5/28/2025 - 4 months ago
    16 - TEAS REQUEST FOR RECONSIDERATION RECEIVED Type: ERFR
  • 5/28/2025 - 4 months ago
    18 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 6/3/2025 - 4 months ago
    19 - NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB Type: OPNR
  • 6/3/2025 - 4 months ago
    20 - NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB Type: OPNS
  • 1/23/2025 - 9 months ago
    11 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 1/23/2025 - 9 months ago
    12 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 2/20/2025 - 8 months ago
    15 - NOTIFICATION OF FINAL REFUSAL EMAILED Type: GNFN
  • 2/20/2025 - 8 months ago
    13 - FINAL REFUSAL WRITTEN Type: CNFR
  • 6/24/2025 - 3 months ago
    22 - EXAMINERS AMENDMENT -WRITTEN Type: CNEA
  • 6/24/2025 - 3 months ago
    24 - NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED Type: GNEN
  • 6/24/2025 - 3 months ago
    23 - EXAMINERS AMENDMENT E-MAILED Type: GNEA
  • 6/24/2025 - 3 months ago
    26 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA
  • 7/23/2025 - 2 months ago
    27 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP
  • 6/24/2025 - 3 months ago
    25 - EXAMINER'S AMENDMENT ENTERED Type: XAEC
  • 6/20/2025 - 4 months ago
    21 - NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB Type: OPNX