85656675

Information

  • Trademark
  • 85656675
  • Serial Number
    85656675
  • Filing Date
    June 20, 2012
    12 years ago
  • Transaction Date
    April 22, 2015
    9 years ago
  • Status Date
    December 18, 2013
    10 years ago
  • Location Date
    December 18, 2013
    10 years ago
  • First Use Anywhere Date
    March 01, 2006
    18 years ago
  • First Use In Commerce Date
    March 01, 2006
    18 years ago
  • Status Code
    602
  • Current Location
    TMEG LAW OFFICE 105 - EXAMINING ATTORNEY ASSIGNED
    Employee Name
    CASE, LEIGH CAROLINE
  • Attorney Docket Number
    ENDICOTT INT
    Attorney Name
    Mark Levy
    Law Office Assigned Location Code
    L50
  • Owners
Mark Drawing Code
2000
Case File Statements
  • CC0000: Color is not claimed as a feature of the mark.
  • D10000: "INTERCONNECT"
  • DM0000: The mark consists of two adjacent "linking" shapes, one of a somewhat "E" configuration and the other of a somewhat "U" configuration.
  • GS0091: Printed circuit boards; organic printed circuit board substrate materials in the nature of multilayer IC boards for use in computer processors and the like; custom testing machines and inspection machines for manufacturing printed circuit boards and other microelectronics; current induced thermal cycling (CITC) testers; field programmable gate array (FPGA)-based high performance computing accelerator platforms; portable electron volt cadmium zinc telluride (eV-CZT) spectrometer engines in the nature of radiation and explosive detectors designed for handheld instruments; fully integrated electron volt cadmium zinc telluride (eV-CZT) detectors/MCA systems comprising sensors and detectors; lab probes for detecting radiation and/or explosive devices, single point extended area radiation detectors; 16-channel testing platforms for pixelated spectroscopy detector designs and geometries; 1-channel, high count rate, electron volt cadmium zinc telluride (eV-CZT) sensor systems comprising sensors and detectors for industrial imaging applications; ultra-low noise charge-sensitive preamplifiers; drilling machines, punching machines, routing machines, trimming machines, doweling machines, imaging machines, laminating machines, plating machines, etching machines, testing machines, and inspection machines for manufacturing printed circuit boards; electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; electrical connectors and parts therefor; artwork master films, namely, glass masters for defining circuit patterns on circuitized substrates, namely, printed circuit boards; and computer software for use in designing, developing and manufacturing printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual inline packages, and card-on-board assemblies; components for use with printed circuit boards, semiconductor substrate and packaging materials in the nature of multilayer IC boards for use in computer processors and the like, automated testing machines and inspection machines for manufacturing printed circuit boards and electronic components for use with printed circuit boards, medical imaging devices, gamma ray detectors and gamma ray spectroscopy systems, and wearable medical diagnostic and therapeutic devices
  • GS0421: Development and manufacture of printed circuit boards; assembly and testing of printed circuit boards and semiconductors; electronic computer systems integration for high performance computing (HPC), art and design (A and D), automated test equipment (ATE), medical, imaging, telecomm, microwave, and industrial markets; custom manufacturing of organic printed circuit board substrate materials; organic system-in-package and semiconductor substrate fabrication; custom manufacturing of cadmium zinc telluride (CZT) crystal detectors; semiconductor assembly and test services; advanced laboratory and engineering services, namely, reliability engineering, material science, and failure analysis, thermal and mechanical modeling, product qualifications testing, and mechanical and fragility testing; gamma-ray spectroscopy testing, special nuclear material identification, research in the field of health physics, geological research in the nature of site monitoring; gamma-ray spectroscopy testing, and industrial gauging in the nature of calibration of nuclear density gauges; lab spectroscopy testing, non-medical x-ray imaging, detector development activities, namely, detection of radiation and/or explosive devices; liquid level gauging, fill level gauging, and web/thickness gauging, namely, gauge calibration; x-ray inspection of physical features, case inspection of physical features; detector development activities, namely, sensors and detectors used in detecting radiation and/or explosive devices; developing, designing, and manufacturing services for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; developing, designing and testing for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; reliability engineering services, thermal and mechanical modeling services for printed circuit boards and components for use with printed circuit boards, semiconductor substrate and packaging materials, and wearable medical diagnostic and therapeutic devices
Case File Event Statements
  • 4/22/2015 - 9 years ago
    15 - AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Type: ASGN
  • 3/4/2015 - 9 years ago
    14 - ASSIGNMENT OF OWNERSHIP NOT UPDATED AUTOMATICALLY Type: ASCK
  • 12/18/2013 - 10 years ago
    13 - ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND Type: MAB2
  • 12/18/2013 - 10 years ago
    12 - ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE Type: ABN2
  • 5/17/2013 - 11 years ago
    11 - NON-FINAL ACTION MAILED Type: CNRT
  • 5/17/2013 - 11 years ago
    10 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 4/24/2013 - 11 years ago
    9 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 4/24/2013 - 11 years ago
    8 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 4/17/2013 - 11 years ago
    7 - ASSIGNED TO LIE Type: ALIE
  • 4/10/2013 - 11 years ago
    6 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 10/12/2012 - 11 years ago
    5 - NON-FINAL ACTION MAILED Type: CNRT
  • 10/11/2012 - 11 years ago
    4 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 10/5/2012 - 11 years ago
    3 - ASSIGNED TO EXAMINER Type: DOCK
  • 6/29/2012 - 12 years ago
    2 - NOTICE OF DESIGN SEARCH CODE MAILED Type: MDSC
  • 6/28/2012 - 12 years ago
    1 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM Type: NWOS