GS0071: Die bonders used in manufacturing electronic components; machines for mounting microchips, semiconductor chips, semiconductor components and electronic components; adhesive chemical dispensing machines; high precision dispense and assembly equipment for the semiconductor, advanced packaging and microelectronics industry; laser doping, laser scribing and laser disk texturing machines
Case File Event Statements
5/28/2014 - 11 years ago
5 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILEDType:NONP
4/2/2014 - 11 years ago
1 - NEW APPLICATION ENTEREDType:NWAP
4/2/2014 - 11 years ago
2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTEREDType:NWOS
5/12/2014 - 11 years ago
3 - ASSIGNED TO EXAMINERType:DOCK
5/13/2014 - 11 years ago
4 - APPROVED FOR PUB - PRINCIPAL REGISTERType:CNSA
6/17/2014 - 11 years ago
7 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILEDType:NPUB
9/2/2019 - 5 years ago
9 - COURTESY REMINDER - SEC. 8 (6-YR) E-MAILEDType:REM1
4/25/2020 - 5 years ago
11 - CASE ASSIGNED TO POST REGISTRATION PARALEGALType:APRE
6/17/2014 - 11 years ago
6 - PUBLISHED FOR OPPOSITIONType:PUBO
9/2/2014 - 10 years ago
8 - REGISTERED-PRINCIPAL REGISTERType:R.PR
3/27/2020 - 5 years ago
10 - TEAS SECTION 8 & 15 RECEIVEDType:E815
4/25/2020 - 5 years ago
12 - POST REGISTRATION ACTION MAILED - SEC. 8 & 15Type:PR23
4/25/2020 - 5 years ago
13 - POST REGISTRATION ACTION MAILED - SEC. 8 & 15Type:PR23
9/28/2020 - 4 years ago
14 - TEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVEDType:EROP
10/5/2020 - 4 years ago
15 - REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.Type:C15A
10/5/2020 - 4 years ago
16 - NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILEDType:NA85
9/2/2023 - a year ago
17 - COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILEDType:REM2
3/14/2025 - 4 months ago
18 - CANCELLED SEC. 8 (10-YR)/EXPIRED SECTION 9Type:CAEX