GS0171: Microwave absorbers, namely, pastes, pads, gels, and molded and extruded shapes, comprised of foams, elastomers, and polymers loaded with magnetic particles; conductive materials, namely, fabric over foam contacts, foil over foam contacts, spring contacts, and surface mount device contacts for providing an electrical connection between two surfaces in electronic devices; dielectric materials, namely, conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives, and other computer hardware; conductive foam, namely, sheets, pads, strips, and die-cut shapes, for use in conducting heat and electricity; surface gasket in the nature of fabric over foam gaskets, synthetic elastomer gaskets; conductive tapes, namely, conductive tape for electromagnetic radiation shielding in electronic products; decorative electromagnetic interference (EMI) shielding metals, namely, conductive metal sheets having a decorative finish thereon, for EMI shielding in electronics; structural electromagnetic interference (EMI) shielding metals, namely, in the form of metal board level shields; electromagnetic interference (EMI) shielding products, namely, electromagnetic interference (EMI) shielding contacts, electromagnetic interference (EMI) spring contacts, electromagnetic interference (EMI) shielding user interface shields, electromagnetic interference (EMI) combination shields, electromagnetic interference (EMI) shielding gaskets, electromagnetic interference (EMI) board level shielding and customer designed electromagnetic interference (EMI) shielding; electromagnetic interference shielding gaskets, namely, electromagnetic interference (EMI) fabric over foam gaskets and electromagnetic interference (EMI) fingerstocks; electromagnetic interference (EMI) spring contacts; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics, and putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; form-in place gaskets, namely, form-in-place non-metal gaskets for electronic devices; electromagnetic interference (EMI) shielding wire mesh and knitted wire, namely, in the form of gaskets; electromagnetic interference (EMI) shielding knitted gaskets; combination electromagnetic interference (EMI) shielding products, namely, EMI shielding contacts, EMI spring contacts, EMI shielding user interface shields and EMI combination shields, EMI board level shielding and customer designed EMI shielding; electromagnetic interference (EMI) vent panels, namely, metal plated rigid structures that provide EMI shielding and permit air flow to electronic components; electromagnetic interference (EMI) microwave products in the nature of plastics, elastomers, epoxies and polyurethane materials for use in absorbing electromagnetic radiation in electronic devices; electromagnetic interference (EMI) metallized fabric, namely, nylon or polyester fabric impregnated with metal cut or shaped to form an EMI shield in electronic devices; electromagnetic interference (EMI) conductive tape, namely, adhesive shielding tape for electromagnetic radiation shielding in electronic products; thermal interface materials, thermally conductive silicone gap fillers for industrial and commercial use; thermal interface materials, namely, phase change thermal interface materials; thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; thermally conductive printed circuit board (PCB) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; thermally conductive thermoplastics, namely, semiprocesssed thermoplastics in molded, extruded, and sheet form; thermal and electrically conductive materials for use in electrical and electronic applications, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members
D10000: "PERFORMANCE MATERIALS"
Case File Event Statements
8/21/2023 - a year ago
40 - ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILEDType:MAB6
8/21/2023 - a year ago
39 - ABANDONMENT - NO USE STATEMENT FILEDType:ABN6
2/8/2023 - 2 years ago
38 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILEDType:EXRA
2/7/2023 - 2 years ago
37 - SOU EXTENSION 5 GRANTEDType:EX5G
1/19/2023 - 2 years ago
36 - SOU EXTENSION 5 FILEDType:EXT5
2/6/2023 - 2 years ago
35 - CASE ASSIGNED TO INTENT TO USE PARALEGALType:AITU
1/19/2023 - 2 years ago
34 - SOU TEAS EXTENSION RECEIVEDType:EEXT
7/23/2022 - 2 years ago
33 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILEDType:EXRA
7/21/2022 - 2 years ago
32 - SOU EXTENSION 4 GRANTEDType:EX4G
7/21/2022 - 2 years ago
31 - SOU EXTENSION 4 FILEDType:EXT4
7/21/2022 - 2 years ago
30 - SOU TEAS EXTENSION RECEIVEDType:EEXT
1/5/2022 - 3 years ago
29 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILEDType:EXRA
1/3/2022 - 3 years ago
28 - SOU EXTENSION 3 GRANTEDType:EX3G
1/3/2022 - 3 years ago
27 - SOU EXTENSION 3 FILEDType:EXT3
1/3/2022 - 3 years ago
26 - SOU TEAS EXTENSION RECEIVEDType:EEXT
7/22/2021 - 3 years ago
25 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILEDType:EXRA
7/20/2021 - 3 years ago
24 - SOU EXTENSION 2 GRANTEDType:EX2G
7/20/2021 - 3 years ago
23 - SOU EXTENSION 2 FILEDType:EXT2
7/20/2021 - 3 years ago
22 - SOU TEAS EXTENSION RECEIVEDType:EEXT
1/16/2021 - 4 years ago
21 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILEDType:EXRA
1/14/2021 - 4 years ago
20 - SOU EXTENSION 1 GRANTEDType:EX1G
1/14/2021 - 4 years ago
19 - SOU EXTENSION 1 FILEDType:EXT1
1/14/2021 - 4 years ago
18 - SOU TEAS EXTENSION RECEIVEDType:EEXT
7/21/2020 - 4 years ago
17 - NOA E-MAILED - SOU REQUIRED FROM APPLICANTType:NOAM
5/26/2020 - 4 years ago
16 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILEDType:NPUB
5/26/2020 - 4 years ago
15 - PUBLISHED FOR OPPOSITIONType:PUBO
5/6/2020 - 4 years ago
14 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILEDType:NONP
4/16/2020 - 4 years ago
13 - APPROVED FOR PUB - PRINCIPAL REGISTERType:CNSA
4/9/2020 - 5 years ago
12 - NOTIFICATION OF NON-FINAL ACTION E-MAILEDType:GNRN
4/9/2020 - 5 years ago
11 - NON-FINAL ACTION E-MAILEDType:GNRT
4/9/2020 - 5 years ago
10 - NON-FINAL ACTION WRITTENType:CNRT
3/18/2020 - 5 years ago
9 - TEAS/EMAIL CORRESPONDENCE ENTEREDType:TEME
3/18/2020 - 5 years ago
8 - CORRESPONDENCE RECEIVED IN LAW OFFICEType:CRFA
3/18/2020 - 5 years ago
7 - TEAS RESPONSE TO OFFICE ACTION RECEIVEDType:TROA
9/26/2019 - 5 years ago
6 - NOTIFICATION OF NON-FINAL ACTION E-MAILEDType:GNRN
9/26/2019 - 5 years ago
5 - NON-FINAL ACTION E-MAILEDType:GNRT
9/26/2019 - 5 years ago
4 - NON-FINAL ACTION WRITTENType:CNRT
9/5/2019 - 5 years ago
3 - ASSIGNED TO EXAMINERType:DOCK
6/26/2019 - 5 years ago
2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTEREDType:NWOS