88806340

Information

• Trademark
• 88806340

• Source

• Serial Number

  88806340

• International Classifications

  • 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
  • 3 - Bleaching preparations and other substances for laundry use
  • 7 - Machines and machine tools

• Filing Date

  February 21, 2020
  4 years ago

• Transaction Date

  February 05, 2024
  11 months ago

• Status Date

  October 10, 2022
  2 years ago

• Published for Opposition Date

  July 14, 2020
  4 years ago

• Location Date

  March 17, 2022
  2 years ago

• Status Code

  606

• Current Location

  INTENT TO USE SECTION

  Employee Name

  MICHOS, JOHN E

• Attorney Docket Number

  086370.0155

  Attorney Name

  Julie B. Albert

  Law Office Assigned Location Code

  M90

• Owners

  • Cabot Microelectronics Corporation

Case File Statements

• DM0000: The mark consists of a horizontal wavy line with a horizontal straight line bisecting the wavy line equally.
• GS0071: Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
• GS0031: Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
• CC0000: Color is not claimed as a feature of the mark.
• GS0011: Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA), and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (CMP) slurry and chemical mechanical planarization (CMP) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries

Case File Event Statements

• 10/11/2022 - 2 years ago

  42 - ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED Type: MAB6

• 10/10/2022 - 2 years ago

  41 - ABANDONMENT - NO USE STATEMENT FILED Type: ABN6

• 7/12/2022 - 2 years ago

  40 - TEAS CHANGE OF CORRESPONDENCE RECEIVED Type: TCCA

• 7/12/2022 - 2 years ago

  39 - TEAS WITHDRAWAL OF ATTORNEY RECEIVED-FIRM RETAINS Type: EWAF

• 7/12/2022 - 2 years ago

  38 - ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED Type: ARAA

• 7/12/2022 - 2 years ago

  37 - TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED Type: REAP

• 3/18/2022 - 2 years ago

  36 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA

• 3/17/2022 - 2 years ago

  35 - SOU EXTENSION 3 GRANTED Type: EX3G

• 3/7/2022 - 2 years ago

  34 - SOU EXTENSION 3 FILED Type: EXT3

• 3/17/2022 - 2 years ago

  33 - CASE ASSIGNED TO INTENT TO USE PARALEGAL Type: AITU

• 3/7/2022 - 2 years ago

  32 - SOU TEAS EXTENSION RECEIVED Type: EEXT

• 9/9/2021 - 3 years ago

  31 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA

• 9/7/2021 - 3 years ago

  30 - SOU EXTENSION 2 GRANTED Type: EX2G

• 9/7/2021 - 3 years ago

  29 - SOU EXTENSION 2 FILED Type: EXT2

• 9/7/2021 - 3 years ago

  28 - SOU TEAS EXTENSION RECEIVED Type: EEXT

• 5/12/2021 - 3 years ago

  27 - AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP Type: ASGN

• 4/13/2021 - 3 years ago

  26 - PETITION TO DIRECTOR GRANTED Type: PCGR

• 4/13/2021 - 3 years ago

  25 - ASSIGNED TO PETITION STAFF Type: APET

• 4/13/2021 - 3 years ago

  24 - ASSIGNED TO PETITION STAFF Type: APET

• 3/5/2021 - 3 years ago

  23 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA

• 3/3/2021 - 3 years ago

  22 - SOU EXTENSION 1 GRANTED Type: EX1G

• 3/3/2021 - 3 years ago

  21 - SOU EXTENSION 1 FILED Type: EXT1

• 3/3/2021 - 3 years ago

  20 - SOU TEAS EXTENSION RECEIVED Type: EEXT

• 1/26/2021 - 3 years ago

  19 - TEAS PETITION TO DIRECTOR RECEIVED Type: TPDR

• 9/8/2020 - 4 years ago

  18 - NOA E-MAILED - SOU REQUIRED FROM APPLICANT Type: NOAM

• 7/14/2020 - 4 years ago

  17 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Type: NPUB

• 7/14/2020 - 4 years ago

  16 - PUBLISHED FOR OPPOSITION Type: PUBO

• 6/24/2020 - 4 years ago

  15 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP

• 6/8/2020 - 4 years ago

  14 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA

• 5/28/2020 - 4 years ago

  13 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME

• 5/28/2020 - 4 years ago

  12 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA

• 5/28/2020 - 4 years ago

  11 - ASSIGNED TO LIE Type: ALIE

• 5/21/2020 - 4 years ago

  10 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA

• 5/19/2020 - 4 years ago

  9 - COMBINED EXAMINER'S AMENDMENT/PRIORITY ACTION ENTERED Type: CEPE

• 5/19/2020 - 4 years ago

  8 - ASSIGNED TO LIE Type: ALIE

• 5/19/2020 - 4 years ago

  7 - NOTIFICATION OF EXAMINER'S AMENDMENT/PRIORITY ACTION E-MAILED Type: GEAN

• 5/19/2020 - 4 years ago

  6 - EXAMINER'S AMENDMENT/PRIORITY ACTION E-MAILED Type: GEAP

• 5/19/2020 - 4 years ago

  5 - EXAMINERS AMENDMENT AND/OR PRIORITY ACTION - COMPLETED Type: CPEA

• 5/11/2020 - 4 years ago

  4 - ASSIGNED TO EXAMINER Type: DOCK

• 2/27/2020 - 4 years ago

  3 - NOTICE OF DESIGN SEARCH CODE E-MAILED Type: MDSC

• 2/26/2020 - 4 years ago

  2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS

• 2/25/2020 - 4 years ago

  1 - NEW APPLICATION ENTERED Type: NWAP