90300115 - NANOS

Information

• Trademark
• 90300115

• Source

• Serial Number

  90300115

• International Classifications

  • 40 - Treatment of materials

• Filing Date

  November 05, 2020
  4 years ago

• Transaction Date

  November 16, 2021
  3 years ago

• Status Date

  November 16, 2021
  3 years ago

• Location Date

  November 16, 2021
  3 years ago

• First Use Anywhere Date

  April 20, 2020
  5 years ago

• First Use In Commerce Date

  April 20, 2020
  5 years ago

• Status Code

  602

• Current Location

  TMEG LAW OFFICE 106 - EXAMINING ATTORNEY ASSIGNED

  Employee Name

  PATEL, SAMIR RAMESH

• Attorney Docket Number

  NND1002TM_US

  Attorney Name

  Guy Levi

  Law Office Assigned Location Code

  L60

• Owners

  • Nano Dimension Technologies LTD

Case File Statements

• GS0401: Custom additive manufacturing for others, Manufacture of hi-performance electronic devices for others, namely, custom-designed printed circuit boards, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), interposers - fabricated using 3D printers; Manufacturing services for others in the field of hi-performance electronic devices (HI-PED), namely,; system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), and interposers

Case File Event Statements

• 11/16/2021 - 3 years ago

  8 - ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND Type: MAB2

• 11/16/2021 - 3 years ago

  7 - ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE Type: ABN2

• 5/5/2021 - 4 years ago

  6 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN

• 5/5/2021 - 4 years ago

  5 - NON-FINAL ACTION E-MAILED Type: GNRT

• 5/5/2021 - 4 years ago

  4 - NON-FINAL ACTION WRITTEN Type: CNRT

• 4/13/2021 - 4 years ago

  3 - ASSIGNED TO EXAMINER Type: DOCK

• 1/5/2021 - 4 years ago

  2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM Type: NWOS

• 11/9/2020 - 4 years ago

  1 - NEW APPLICATION ENTERED IN TRAM Type: NWAP