Information
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Trademark
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90877083
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International Classifications
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Filing Date
August 11, 2021
3 years ago
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Transaction Date
April 26, 2025
24 days ago
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Status Date
April 24, 2025
26 days ago
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Published for Opposition Date
July 26, 2022
2 years ago
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Location Date
April 14, 2025
a month ago
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Status Code
734
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Current Location
INTENT TO USE SECTION
Employee Name
NGUYEN,NICOLE ASHLEY
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Attorney Docket Number
TM21-0391
Attorney Name
Kumiko Ide
Law Office Assigned Location Code
M50
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Owners
Mark Drawing Code
4
Mark Identification
HSP
Case File Statements
- GS0171: Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials
- GS0021: Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink
- GS0011: Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components
Case File Event Statements
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8/14/2021 - 3 years ago
1 - NEW APPLICATION ENTERED
Type: NWAP
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9/3/2021 - 3 years ago
3 - TEAS VOLUNTARY AMENDMENT RECEIVED
Type: PARI
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10/2/2021 - 3 years ago
2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Type: NWOS
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10/7/2021 - 3 years ago
4 - ASSIGNED TO LIE
Type: ALIE
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10/8/2021 - 3 years ago
5 - PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED
Type: AMPX
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11/9/2021 - 3 years ago
6 - TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Type: REAP
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11/9/2021 - 3 years ago
9 - TEAS CHANGE OF CORRESPONDENCE RECEIVED
Type: TCCA
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11/9/2021 - 3 years ago
7 - ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Type: ARAA
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11/9/2021 - 3 years ago
8 - TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
Type: ECDR
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5/11/2022 - 3 years ago
10 - ASSIGNED TO EXAMINER
Type: DOCK
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5/19/2022 - 3 years ago
12 - NON-FINAL ACTION E-MAILED
Type: GNRT
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5/19/2022 - 3 years ago
11 - NON-FINAL ACTION WRITTEN
Type: CNRT
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5/19/2022 - 3 years ago
13 - NOTIFICATION OF NON-FINAL ACTION E-MAILED
Type: GNRN
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6/9/2022 - 2 years ago
14 - TEAS RESPONSE TO OFFICE ACTION RECEIVED
Type: TROA
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6/9/2022 - 2 years ago
15 - CORRESPONDENCE RECEIVED IN LAW OFFICE
Type: CRFA
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6/9/2022 - 2 years ago
16 - TEAS/EMAIL CORRESPONDENCE ENTERED
Type: TEME
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6/17/2022 - 2 years ago
17 - APPROVED FOR PUB - PRINCIPAL REGISTER
Type: CNSA
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7/26/2022 - 2 years ago
19 - PUBLISHED FOR OPPOSITION
Type: PUBO
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7/6/2022 - 2 years ago
18 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Type: NONP
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7/26/2022 - 2 years ago
20 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Type: NPUB
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9/20/2022 - 2 years ago
21 - NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Type: NOAM
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10/7/2022 - 2 years ago
22 - SOU TEAS EXTENSION RECEIVED
Type: EEXT
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10/7/2022 - 2 years ago
23 - SOU EXTENSION 1 FILED
Type: EXT1
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10/7/2022 - 2 years ago
24 - SOU EXTENSION 1 GRANTED
Type: EX1G
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7/26/2023 - a year ago
27 - SOU EXTENSION 2 FILED
Type: EXT2
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7/26/2023 - a year ago
28 - SOU EXTENSION 2 GRANTED
Type: EX2G
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10/11/2022 - 2 years ago
25 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Type: EXRA
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7/26/2023 - a year ago
26 - SOU TEAS EXTENSION RECEIVED
Type: EEXT
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7/28/2023 - a year ago
29 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Type: EXRA
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2/1/2024 - a year ago
32 - SOU EXTENSION 3 FILED
Type: EXT3
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2/1/2024 - a year ago
33 - SOU EXTENSION 3 GRANTED
Type: EX3G
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1/2/2024 - a year ago
30 - ASSIGNED TO EXAMINER
Type: DOCK
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2/1/2024 - a year ago
31 - SOU TEAS EXTENSION RECEIVED
Type: EEXT
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2/3/2024 - a year ago
34 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Type: EXRA
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7/29/2024 - 9 months ago
38 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Type: EXRA
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7/29/2024 - 9 months ago
36 - SOU EXTENSION 4 FILED
Type: EXT4
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7/29/2024 - 9 months ago
37 - SOU EXTENSION 4 GRANTED
Type: EX4G
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7/29/2024 - 9 months ago
35 - SOU TEAS EXTENSION RECEIVED
Type: EEXT
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1/7/2025 - 4 months ago
41 - SOU EXTENSION 5 FILED
Type: EXT5
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1/7/2025 - 4 months ago
39 - SOU TEAS EXTENSION RECEIVED
Type: EEXT
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4/14/2025 - a month ago
40 - CASE ASSIGNED TO INTENT TO USE PARALEGAL
Type: AITU
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4/24/2025 - 26 days ago
42 - SOU EXTENSION 5 GRANTED
Type: EX5G
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4/25/2025 - 25 days ago
43 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Type: EXRA