TREA

97068631 - WELCO

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Information

  • Trademark
  • 97068631
  • Serial Number
    97068631
  • Registration Number
    7251588
  • Filing Date
    October 11, 2021
    3 years ago
  • Registration Date
    December 26, 2023
    a year ago
  • Transaction Date
    December 26, 2023
    a year ago
  • Status Date
    December 26, 2023
    a year ago
  • Published for Opposition Date
    October 10, 2023
    a year ago
  • Location Date
    December 26, 2023
    a year ago
  • Status Code
    700
  • Current Location
    PUBLICATION AND ISSUE SECTION
    Employee Name
    MAHONEY, KATHERINE AIL
  • Attorney Docket Number
    Bendele 806
    Attorney Name
    Nathaniel Kramer
    Law Office Assigned Location Code
    N90
  • Owners
Information
Mark Drawing Code
4000
Mark Identification
WELCO
Case File Statements
  • GS0091: Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC)
  • GS0061: soldering pastes; soft solder for use in the form of a printable paste for use in microelectronic applications, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; solder pastes for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the pastes comprise solder metal and its alloys and flux for use in printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronic industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes
  • GS0021: conductive inks for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the inks comprising solder metal and its alloys and flux for printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronics industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes
  • GS0011: Chemical agents for use in soldering in the microelectronics industry; electronic-grade chemical agents for use in soldering in the microelectronics industry; chemical agents for use in screen printing, dispensing and jetting in soldering in the microelectronics industry; chemical agents for use in soldering in the microelectronics industry, namely, in the semiconductor industry; chemical agents for use in soldering in the microelectronics industry, namely, chemical agents for use in clean room applications; all the aforementioned goods preferably for use in chip-production, namely, as soldering preparations comprising solder metal alloys and flux, conductive inks comprising solder metal and its alloys and flux for use in surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of the metals; all the above mentioned goods preferably for use in chip-production, namely, electronic-grade chemical agents for use in soldering in the microelectronics industry for surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of these metals; all of the above-mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and in the field of gas and water pipes
Case File Event Statements
  • 12/26/2023 - a year ago
    23 - NOTICE OF REGISTRATION CONFIRMATION EMAILED Type: NRCC
  • 12/26/2023 - a year ago
    22 - REGISTERED-PRINCIPAL REGISTER Type: R.PR
  • 10/10/2023 - a year ago
    21 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Type: NPUB
  • 10/10/2023 - a year ago
    20 - PUBLISHED FOR OPPOSITION Type: PUBO
  • 9/20/2023 - a year ago
    19 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP
  • 9/5/2023 - a year ago
    18 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA
  • 9/5/2023 - a year ago
    17 - EXAMINER'S AMENDMENT ENTERED Type: XAEC
  • 9/5/2023 - a year ago
    16 - NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED Type: GNEN
  • 9/5/2023 - a year ago
    15 - EXAMINERS AMENDMENT E-MAILED Type: GNEA
  • 9/5/2023 - a year ago
    14 - EXAMINERS AMENDMENT -WRITTEN Type: CNEA
  • 7/30/2023 - a year ago
    13 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN
  • 7/30/2023 - a year ago
    12 - NON-FINAL ACTION E-MAILED Type: GNRT
  • 7/30/2023 - a year ago
    11 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 4/17/2023 - a year ago
    10 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 4/17/2023 - a year ago
    9 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 4/17/2023 - a year ago
    8 - ASSIGNED TO LIE Type: ALIE
  • 1/19/2023 - 2 years ago
    7 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 7/25/2022 - 2 years ago
    6 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN
  • 7/25/2022 - 2 years ago
    5 - NON-FINAL ACTION E-MAILED Type: GNRT
  • 7/25/2022 - 2 years ago
    4 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 7/14/2022 - 2 years ago
    3 - ASSIGNED TO EXAMINER Type: DOCK
  • 11/2/2021 - 3 years ago
    2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS
  • 10/14/2021 - 3 years ago
    1 - NEW APPLICATION ENTERED Type: NWAP