DM0000: The mark consists of the wording "MacDermid Alpha" above the wording "ELECTRONICS SOLUTIONS" to the right of a banner with an overall rectangular shape with an inverted "V" shape at the bottom and a plaid design in the middle. There is a detached rectangle at top. To the right of the wording is a stylized letter "A.".
GS0091: Brazed metal electrode
GS0061: metal wire; silver solder; gold solder; brazing alloy; hard solder; metal rod for brazing and welding, including steel titanium alloy; soft solder; solder preforms; Welding metal rod; tin wire
PM0001: MAC DERMID ALPHA ELECTRONICS SOLUTIONS
GS0031: Cleaning agents for metal and non-metal surfaces
CC0000: Color is not claimed as a feature of the mark.
GS0011: Chemicals for use in electroless plating and electroplating processes; chemical compositions for metal plating; pre-treatment preparations for plating, namely chemical composition for plating metals, non-metals and plastics; trivalent chromate finishing and coating preparations for plating; metal chlorides; chemicals for use in semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; electroplating chemicals; chemicals for wafer level semiconductor packaging processes; chemicals for panel level semiconductor packaging processes; chemicals for fan out wafer level semiconductor packaging processes; chemicals for fan out panel level semiconductor packaging processes; chemicals for use in the circuit board industry, namely, peroxide and sulfuric acid based etchants and oxidants for roughening or etching copper surfaces prior to multilayer lamination of printed wiring boards; chemicals used in industry; Adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; Chemicals, namely, soldering flux; industrial chemicals used for cleaning circuit boards and surface mount devices; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry
DS0000: "ELECTRONIC SOLUTIONS"
Case File Event Statements
8/4/2022 - 2 years ago
1 - NEW APPLICATION ENTEREDType:NWAP
8/22/2022 - 2 years ago
2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTEREDType:NWOS
8/23/2022 - 2 years ago
3 - NOTICE OF DESIGN SEARCH CODE E-MAILEDType:MDSM
8/23/2022 - 2 years ago
4 - TEAS VOLUNTARY AMENDMENT RECEIVEDType:PARI
8/23/2022 - 2 years ago
5 - TEAS AMENDMENT ENTERED BEFORE ATTORNEY ASSIGNEDType:TAEA
5/18/2023 - a year ago
6 - ASSIGNED TO EXAMINERType:DOCK
5/25/2023 - a year ago
7 - NON-FINAL ACTION WRITTENType:CNRT
5/25/2023 - a year ago
8 - NON-FINAL ACTION E-MAILEDType:GNRT
5/25/2023 - a year ago
9 - NOTIFICATION OF NON-FINAL ACTION E-MAILEDType:GNRN
8/8/2023 - a year ago
10 - TEAS RESPONSE TO OFFICE ACTION RECEIVEDType:TROA
8/8/2023 - a year ago
11 - CORRESPONDENCE RECEIVED IN LAW OFFICEType:CRFA
8/8/2023 - a year ago
12 - TEAS/EMAIL CORRESPONDENCE ENTEREDType:TEME
8/9/2023 - a year ago
13 - APPROVED FOR PUB - PRINCIPAL REGISTERType:CNSA
8/23/2023 - a year ago
14 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILEDType:NONP
9/12/2023 - a year ago
15 - PUBLISHED FOR OPPOSITIONType:PUBO
9/12/2023 - a year ago
16 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILEDType:NPUB
11/7/2023 - a year ago
17 - NOA E-MAILED - SOU REQUIRED FROM APPLICANTType:NOAM
5/7/2024 - 6 months ago
19 - SOU EXTENSION 1 FILEDType:EXT1
5/7/2024 - 6 months ago
20 - SOU EXTENSION 1 GRANTEDType:EX1G
5/7/2024 - 6 months ago
18 - SOU TEAS EXTENSION RECEIVEDType:EEXT
10/28/2024 - 19 days ago
22 - SOU TEAS EXTENSION RECEIVEDType:EEXT
10/28/2024 - 19 days ago
25 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILEDType:EXRA
10/28/2024 - 19 days ago
23 - SOU EXTENSION 2 FILEDType:EXT2
10/28/2024 - 19 days ago
24 - SOU EXTENSION 2 GRANTEDType:EX2G
5/8/2024 - 6 months ago
21 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILEDType:EXRA