97528454 - MACDERMID ALPHA ELECTRONICS SOLUTIONS A

Information

  • Trademark
  • 97528454
  • Serial Number
    97528454
  • Filing Date
    August 01, 2022
    2 years ago
  • Transaction Date
    October 28, 2024
    19 days ago
  • Status Date
    October 28, 2024
    19 days ago
  • Published for Opposition Date
    September 12, 2023
    a year ago
  • Location Date
    November 07, 2023
    a year ago
  • Status Code
    731
  • Current Location
    INTENT TO USE SECTION
    Employee Name
    BEN, LINDSEY
  • Attorney Docket Number
    33223-T09-ES
    Attorney Name
    Fatima Lahnin
    Law Office Assigned Location Code
    L80
  • Owners
Mark Drawing Code
3
Mark Identification
MACDERMID ALPHA ELECTRONICS SOLUTIONS A
Case File Statements
  • DM0000: The mark consists of the wording "MacDermid Alpha" above the wording "ELECTRONICS SOLUTIONS" to the right of a banner with an overall rectangular shape with an inverted "V" shape at the bottom and a plaid design in the middle. There is a detached rectangle at top. To the right of the wording is a stylized letter "A.".
  • GS0091: Brazed metal electrode
  • GS0061: metal wire; silver solder; gold solder; brazing alloy; hard solder; metal rod for brazing and welding, including steel titanium alloy; soft solder; solder preforms; Welding metal rod; tin wire
  • PM0001: MAC DERMID ALPHA ELECTRONICS SOLUTIONS
  • GS0031: Cleaning agents for metal and non-metal surfaces
  • CC0000: Color is not claimed as a feature of the mark.
  • GS0011: Chemicals for use in electroless plating and electroplating processes; chemical compositions for metal plating; pre-treatment preparations for plating, namely chemical composition for plating metals, non-metals and plastics; trivalent chromate finishing and coating preparations for plating; metal chlorides; chemicals for use in semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; electroplating chemicals; chemicals for wafer level semiconductor packaging processes; chemicals for panel level semiconductor packaging processes; chemicals for fan out wafer level semiconductor packaging processes; chemicals for fan out panel level semiconductor packaging processes; chemicals for use in the circuit board industry, namely, peroxide and sulfuric acid based etchants and oxidants for roughening or etching copper surfaces prior to multilayer lamination of printed wiring boards; chemicals used in industry; Adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; Chemicals, namely, soldering flux; industrial chemicals used for cleaning circuit boards and surface mount devices; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry
  • DS0000: "ELECTRONIC SOLUTIONS"
Case File Event Statements
  • 8/4/2022 - 2 years ago
    1 - NEW APPLICATION ENTERED Type: NWAP
  • 8/22/2022 - 2 years ago
    2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS
  • 8/23/2022 - 2 years ago
    3 - NOTICE OF DESIGN SEARCH CODE E-MAILED Type: MDSM
  • 8/23/2022 - 2 years ago
    4 - TEAS VOLUNTARY AMENDMENT RECEIVED Type: PARI
  • 8/23/2022 - 2 years ago
    5 - TEAS AMENDMENT ENTERED BEFORE ATTORNEY ASSIGNED Type: TAEA
  • 5/18/2023 - a year ago
    6 - ASSIGNED TO EXAMINER Type: DOCK
  • 5/25/2023 - a year ago
    7 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 5/25/2023 - a year ago
    8 - NON-FINAL ACTION E-MAILED Type: GNRT
  • 5/25/2023 - a year ago
    9 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN
  • 8/8/2023 - a year ago
    10 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 8/8/2023 - a year ago
    11 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 8/8/2023 - a year ago
    12 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 8/9/2023 - a year ago
    13 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA
  • 8/23/2023 - a year ago
    14 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP
  • 9/12/2023 - a year ago
    15 - PUBLISHED FOR OPPOSITION Type: PUBO
  • 9/12/2023 - a year ago
    16 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Type: NPUB
  • 11/7/2023 - a year ago
    17 - NOA E-MAILED - SOU REQUIRED FROM APPLICANT Type: NOAM
  • 5/7/2024 - 6 months ago
    19 - SOU EXTENSION 1 FILED Type: EXT1
  • 5/7/2024 - 6 months ago
    20 - SOU EXTENSION 1 GRANTED Type: EX1G
  • 5/7/2024 - 6 months ago
    18 - SOU TEAS EXTENSION RECEIVED Type: EEXT
  • 10/28/2024 - 19 days ago
    22 - SOU TEAS EXTENSION RECEIVED Type: EEXT
  • 10/28/2024 - 19 days ago
    25 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA
  • 10/28/2024 - 19 days ago
    23 - SOU EXTENSION 2 FILED Type: EXT2
  • 10/28/2024 - 19 days ago
    24 - SOU EXTENSION 2 GRANTED Type: EX2G
  • 5/8/2024 - 6 months ago
    21 - NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED Type: EXRA