TREA

98269494 - TIPHARES

Follow

Information

  • Trademark
  • 98269494
  • Serial Number
    98269494
  • Filing Date
    November 14, 2023
    a year ago
  • Transaction Date
    October 22, 2024
    a month ago
  • Status Date
    October 22, 2024
    a month ago
  • Published for Opposition Date
    October 22, 2024
    a month ago
  • Location Date
    September 16, 2024
    2 months ago
  • Status Code
    686
  • Current Location
    PUBLICATION AND ISSUE SECTION
    Employee Name
    SNYDER, NELSON
  • Attorney Docket Number
    T69996
    Attorney Name
    Barry I. Hollander
    Law Office Assigned Location Code
    L70
  • Owners
Information
Mark Drawing Code
4
Mark Identification
TIPHARES
Case File Statements
  • PM0001: TIP HARES
  • GS0011: Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards
  • TR0000: The wording "TIPHARES" has no meaning in a foreign language.
Case File Event Statements
  • 11/17/2023 - a year ago
    1 - NEW APPLICATION ENTERED Type: NWAP
  • 12/19/2023 - 11 months ago
    2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS
  • 6/20/2024 - 5 months ago
    6 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN
  • 6/20/2024 - 5 months ago
    5 - NON-FINAL ACTION E-MAILED Type: GNRT
  • 6/20/2024 - 5 months ago
    4 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 6/20/2024 - 5 months ago
    3 - ASSIGNED TO EXAMINER Type: DOCK
  • 9/12/2024 - 2 months ago
    7 - EXAMINERS AMENDMENT -WRITTEN Type: CNEA
  • 9/12/2024 - 2 months ago
    8 - EXAMINERS AMENDMENT E-MAILED Type: GNEA
  • 9/12/2024 - 2 months ago
    9 - NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED Type: GNEN
  • 9/12/2024 - 2 months ago
    10 - EXAMINER'S AMENDMENT ENTERED Type: XAEC
  • 9/12/2024 - 2 months ago
    11 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA
  • 10/2/2024 - a month ago
    12 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP
  • 10/22/2024 - a month ago
    13 - PUBLISHED FOR OPPOSITION Type: PUBO
  • 10/22/2024 - a month ago
    14 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Type: NPUB