GS0061: copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards
DS0000: "ELECTRONIC MATERIAL"
Case File Event Statements
12/1/2023 - a year ago
1 - NEW APPLICATION ENTEREDType:NWAP
2/26/2024 - a year ago
2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTEREDType:NWOS
6/26/2024 - 8 months ago
3 - ASSIGNED TO EXAMINERType:DOCK
6/28/2024 - 8 months ago
6 - NOTIFICATION OF NON-FINAL ACTION E-MAILEDType:GNRN
6/28/2024 - 8 months ago
5 - NON-FINAL ACTION E-MAILEDType:GNRT
8/1/2024 - 7 months ago
8 - CORRESPONDENCE RECEIVED IN LAW OFFICEType:CRFA
8/1/2024 - 7 months ago
9 - TEAS/EMAIL CORRESPONDENCE ENTEREDType:TEME
8/1/2024 - 7 months ago
7 - TEAS RESPONSE TO OFFICE ACTION RECEIVEDType:TROA
8/2/2024 - 7 months ago
10 - APPROVED FOR PUB - PRINCIPAL REGISTERType:CNSA
8/21/2024 - 6 months ago
11 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILEDType:NONP
9/10/2024 - 5 months ago
12 - PUBLISHED FOR OPPOSITIONType:PUBO
9/10/2024 - 5 months ago
13 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILEDType:NPUB
12/17/2024 - 2 months ago
14 - REGISTERED-PRINCIPAL REGISTERType:R.PR
12/17/2024 - 2 months ago
15 - NOTICE OF REGISTRATION CONFIRMATION EMAILEDType:NRCC