98846302 - "HANMI"

Information

• Trademark
• 98846302

• Source

• Serial Number

  98846302

• International Classifications

  • 7 - Machines and machine tools

• Filing Date

  November 11, 2024
  3 months ago

• Transaction Date

  February 12, 2025
  25 days ago

• Status Date

  November 11, 2024
  3 months ago

• First Use Anywhere Date

  December 01, 2000
  24 years ago

• First Use In Commerce Date

  December 01, 2000
  24 years ago

• Status Code

  630

• Attorney Docket Number

  2360-032

  Attorney Name

  Sangwon Kim

• Owners

  • Hanmi Semiconductor, Inc.

Case File Statements

• DM0000: The mark consists of the word "HANMI" in blue surrounded by a red frame with straight and curved features, the white in the mark representing a transparent area..
• GS0071: Die attachment equipment for manufacturing semiconductor; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor; PICK PLACE equipment for manufacturing semiconductor; die bonding equipment for manufacturing semiconductor; electronic components placement machines and apparatus for manufacturing semiconductor; semiconductor chip mounting equipment; semiconductor package electromagnetic shielding equipment; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor
• CC0000: The color(s) blue and red is/are claimed as a feature of the mark.

Case File Event Statements

• 11/11/2024 - 3 months ago

  1 - NEW APPLICATION ENTERED Type: NWAP