99082749 - PCBL

Information

• Trademark
• 99082749

• Source

• Serial Number

  99082749

• International Classifications

  • 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
  • 7 - Machines and machine tools
  • 17 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes
  • 40 - Treatment of materials

• Filing Date

  March 13, 2025
  16 days ago

• Transaction Date

  March 14, 2025
  15 days ago

• Status Date

  March 13, 2025
  16 days ago

• Status Code

  630

• Attorney Docket Number

  1015-0282

  Attorney Name

  Tomoko Nakajima

• Owners

  • LINTEC CORPORATION

Case File Statements

• GS0401: laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastc films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer
• GS0071: semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors
• GS0171: Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets fo use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips
• GS0011: Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin

Case File Event Statements

• 3/13/2025 - 16 days ago

  1 - NEW APPLICATION ENTERED Type: NWAP

• 3/13/2025 - 16 days ago

  2 - APPLICATION FILING RECEIPT MAILED Type: MAFR