99218575 - HBMFLEX

Information

• Trademark
• 99218575

• Source

• Serial Number

  99218575

• International Classifications

  • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
  • 40 - Treatment of materials
  • 42 - Scientific and technological services and research and design relating thereto

• Filing Date

  June 04, 2025
  4 months ago

• Transaction Date

  July 15, 2025
  3 months ago

• Status Date

  July 14, 2025
  3 months ago

• Location Date

  July 14, 2025
  3 months ago

• Status Code

  641

• Current Location

  TMEG LAW OFFICE 103

  Employee Name

  MCBRIDE, THEODORE

• Attorney Docket Number

  273729

  Attorney Name

  Michael J. MacDermott

  Law Office Assigned Location Code

  L30

• Owners

  • Samsung Corporation

Case File Statements

• GS0401: DESIGN AND CUSTOMIZATION OF MEMORY AND COMPUTER ARCHITECTURES, COMPUTER MEMORY HARDWARE, FLASH MEMORY, DIGITAL STORAGE MEDIA, SEMICONDUCTOR MEMORY DEVICES, MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY, COMPUTER CIRCUITRY; SEMICONDUCTORS, WAFERS, SEMICONDUCTOR DIES, CHIPLETS, BASE-DIES, SEMICONDUCTOR MEMORIES, SEMICONDUCTOR MEMORY UNITS, COMPUTER MEMORY DEVICES, APPLICATION-SPECIFIC INTEGRATED CIRCUITS, COMPUTER HARDWARE, ELECTRONIC COMPONENTS FOR COMPUTERS, AND COMPUTER DEVICES; AND CUSTOM DESIGN AND MANUFACTURE OF SEMICONDUCTORS, MEMORY CHIPS, WAFERS and INTEGRATED CIRCUITS
• GS0091: MEMORY AND COMPUTER ARCHITECTURES; COMPUTER MEMORY HARDWARE; FLASH MEMORY; DIGITAL STORAGE MEDIA; SEMICONDUCTOR MEMORY DEVICES; MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY; COMPUTER CIRCUITRY; SEMICONDUCTORS; SEMICONDUCTOR WAFERS; SEMICONDUCTOR DIES; CHIPLETS; BASE-DIES; SEMICONDUCTOR MEMORIES; SEMICONDUCTOR MEMORY UNITS; COMPUTER MEMORY DEVICES; APPLICATION-SPECIFIC INTEGRATED CIRCUITS; COMPUTER HARDWARE; ELECTRONIC COMPONENTS FOR COMPUTERS; AND COMPUTER DEVICES
• GS0421: DESIGN AND CUSTOMIZATION OF MEMORY AND COMPUTER ARCHITECTURES, COMPUTER MEMORY HARDWARE, FLASH MEMORY, DIGITAL STORAGE MEDIA, SEMICONDUCTOR MEMORY DEVICES, MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY, COMPUTER CIRCUITRY; SEMICONDUCTORS, WAFERS, SEMICONDUCTOR DIES, CHIPLETS, BASE-DIES, SEMICONDUCTOR MEMORIES, SEMICONDUCTOR MEMORY UNITS, COMPUTER MEMORY DEVICES, APPLICATION-SPECIFIC INTEGRATED CIRCUITS, COMPUTER HARDWARE, ELECTRONIC COMPONENTS FOR COMPUTERS, AND COMPUTER DEVICES; AND CUSTOM DESIGN AND MANUFACTURE OF SEMICONDUCTORS, MEMORY CHIPS, WAFERS and INTEGRATED CIRCUITS

Case File Event Statements

• 6/4/2025 - 4 months ago

  1 - NEW APPLICATION ENTERED Type: NWAP

• 6/4/2025 - 4 months ago

  2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS

• 6/4/2025 - 4 months ago

  3 - APPLICATION FILING RECEIPT MAILED Type: MAFR

• 7/14/2025 - 3 months ago

  4 - ASSIGNED TO EXAMINER Type: DOCK

• 7/14/2025 - 3 months ago

  7 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN

• 7/14/2025 - 3 months ago

  5 - NON-FINAL ACTION WRITTEN Type: CNRT

• 7/14/2025 - 3 months ago

  6 - NON-FINAL ACTION E-MAILED Type: GNRT