Patent Application
20240117855
The present disclosure relates generally to printed circuit board assemblies, and more particularly, to apparatuses, methods, and systems for damping shock impulses.
Memory devices are typically provided as internal, semiconductor, integrated circuits in computers or other electronic devices. There are many different types of memory including volatile and non-volatile memory. Volatile memory can require power to maintain its data and includes random-access memory (RAM), dynamic random access memory (DRAM), and synchronous dynamic random access memory (SDRAM), among others. Non-volatile memory can provide persistent data by retaining stored data when not powered and can include NAND flash memory, NOR flash memory, read only memory (ROM), Electrically Erasable Programmable ROM (EEPROM), Erasable Programmable ROM (EPROM), and resistance variable memory such as phase change random access memory (PCRAM), resistive random access memory (RRAM), and magnetoresistive random access memory (MRAM), among others. A memory device can be included on a printed circuit board assembly (PCBA).
Apparatuses, systems, and methods for damping shock impulses for a printed circuit board assembly (PCBA) are provided herein. In a number of embodiments of the present disclosure, an apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.
SSDs can fail when exposed to gravitational forces (g-forces). When an SSD is exposed to g-forces, shock impulses can be applied to components within the SSD including a PCBA. A printed circuit board (PCB) of the PCBA can be fastened with screws, for example, to an enclosure of the PCBA. Rigidly fastening the PCB to the enclosure can cause the PCBA to absorb shock impulses. The PCBA can deflect, which can cause stress to the PCBA.
A damper can absorb the shock impulses to prevent or reduce the amount of shock impulses received by the PCBA. This can reduce or prevent deflection of the PCB. Deflection of the PCB can break solder joints and/or the PCB leading to destruction of the SSD and/or the data stored thereon.
In some examples, a damper can allow for a single insertion of the PCBA without screws, which can make assembly of an SSD easier. For example, a pick and place automation tool can insert the PCBA into the enclosure of the SSD without needing additional automation tools, for example a screw driving robot, to fasten the PCBA to the enclosure.
Coupling the PCBA to the enclosure without the use of fasteners, such as screws, can increase the amount of space on the PCB. Often, a PCB includes a number of openings that receive screws to fasten the PCBA to the enclosure. The damper can couple the PCBA to the enclosure by applying a spring force to the sides and/or edges of the PCB. Accordingly, screws may no longer be needed, and the space consumed by the openings can be reallocated to components, which can improve performance of the SSD or the overall footprint of the PCB can be reduced, which can reduce the overall size and cost of the SSD.
In the following detailed description of the present disclosure, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration how a number of embodiments of the disclosure may be practiced. These embodiments are described in sufficient detail to enable those of ordinary skill in the art to practice the embodiments of this disclosure, and it is to be understood that other embodiments may be utilized and that process, electrical, and/or structural changes may be made without departing from the scope of the present disclosure.
As used herein, “a number of” something can refer to one or more of such things. For example, a number of dampers can refer to one or more dampers. Additionally, designators such as “X” and “Z”, as used herein, particularly with respect to reference numerals in the drawings, indicates that a number of the particular feature so designated can be included with a number of embodiments of the present disclosure.
The figures herein follow a numbering convention in which the first digit or digits correspond to the drawing figure number and the remaining digits identify an element or component in the drawing. Similar elements or components between different figures may be identified by the use of similar digits. As will be appreciated, elements shown in the various embodiments herein can be added, exchanged, and/or eliminated so as to provide a number of additional embodiments of the present disclosure. In addition, the proportion and the relative scale of the elements provided in the figures are intended to illustrate various embodiments of the present disclosure and are not to be used in a limiting sense.
The damper 204 can include a number of pre-loaded spring portions 203-1 and 203-2 to receive the PCBA 202 and prevent the PCBA 202 from being released from the damper 204. The pre-loaded spring portions 203-1 and 203-2 can also deform in response to shock impulses to damp shock impulses applied to the SSD and prevent the PCBA 202 from contacting an enclosure.
The damper 204 can further include a pedestal portion 206. The pedestal portion 206 can likewise deform in response to shock impulses to damp shock impulses applied to the SSD and prevent the PCBA 202 from contacting the enclosure. The pedestal portion 206 can also support the PCBA 202 to prevent the PCBA 202 from deforming. In a number of embodiments, the damper 204 can include a number of pedestal portions 206 supporting a number of different portions of the PCBA 202.
The number of dampers 404-1, . . . , 404-X can contact one or more sides of the PCBA 402. The number of dampers 404-1, . . . , 404-X can replace fasteners, such as screws, which are ordinarily used to maintain the PCBA 402 in place. Often, a PCBA 402 includes a number of openings 407-1 and 407-2 for these screws. If the number of dampers 401-1, . . . , 404-X replace the screws, the number of openings 407-1 and 407-2 are no longer needed and the space consumed by the openings can be reallocated to components. The space consumed by the openings can be reallocated to components that can improve performance of an SSD or the overall footprint of the PCBA 402 can be reduced, which can reduce the overall size and cost of the SSD.
The enclosed PCBA 500 can include a PCBA 502, a number of dampers 504-1, 504-2, 505-1, and 505-2, a first portion of an enclosure 508-1, and a second portion of an enclosure 508-2. The first portion of the enclosure 508-1 can include voids 512-1 and 512-2 configured to receive the insertion tabs 510-1 and 510-2 coupled to or included in the second portion of the enclosure 508-2. The voids 512-1 and 512-2 and insertion tabs 510-1 and 510-2 can be shaped to lock the first portion of the enclosure 508-1 to the second portion of the enclosure 508-2, as illustrated in
Damper 504-1 and damper 505-1 can receive each other and damper 504-2 and damper 505-2 can receive each other. In some examples, damper 504-1 and 505-1 can be formed to lock together and damper 504-2 and 505-2 can be formed to lock together, as illustrated in
In a number of embodiments, the dampers 504-1, 504-2, 504-3, 504-4, 505-1, 505-2, 505-3, and 505-4 can be staggered around the PCBA 502, as illustrated in
The PCBA 602 and the number of dampers 604-1 and 604-2 coupled to the PCBA 602 can then be placed into a first portion of an enclosure 608-1. A second portion of an enclosure 608-2 can then be placed on and coupled to the first portion of the enclosure 608-1 to enclose the PCBA 602 and the number of dampers 604-1 and 604-2. In a number of embodiments, the dampers 604-1 and 604-2 can be coupled to the first portion of the enclosure 608-1 and/or the second portion of the enclosure 608-2 mechanically or via an adhesive.
The PCBA 602 can be removably coupled to the first portion of the enclosure 608-1 and/or the second portion of the enclosure 608-2 via the number of dampers 604-1 and 604-2. The number of dampers 604-1 and 604-2 can damp a shock impulse between the first portion of the enclosure 608-1 and/or the second portion of the enclosure 608-2 and the PCBA 602.
In some examples, the dampers 604-1 and 604-2 can include a number of portions. For example a lower portion of damper 604-1 and a lower portion of damper 604-2 can be placed inside the first portion of the enclosure 608-1. The PCBA 602 can be placed on the lower portion of damper 604-1 and damper 604-2 then an upper portion of damper 604-1 can be placed on the lower portion of damper 604-1 and an upper portion of damper 604-2 can be placed on the lower portion of damper 604-2. The second portion of the enclosure 608-2 can then be placed on and coupled to the first portion of the enclosure 608-1.
In a number of embodiments, the dampers 604-1 and/or 604-2 and/or portions of the dampers 604-1 and/or 604-2 can be formed from the first portion of the enclosure 608-1 and/or the second portion of the enclosure 608-2. For example, the lower portions of dampers 604-1 and 604-2 can be a part of the first portion of the enclosure 608-1 and/or the upper portions of dampers 604-1 and 604-2 can be a part of the second portion of the enclosure 608-2.
In some examples, the dampers 604-1 and/or 604-2 and/or portions of the dampers 604-1 and/or 604-2 can be coupled to the first portion of the enclosure 608-1 and/or the second portion of the enclosure 608-2 prior to receiving the PCBA 602. For example, the lower portions of dampers 604-1 and 604-2 can be coupled to the first portion of the enclosure 608-1 and/or the upper portions of dampers 604-1 and 604-2 can be coupled to the second portion of the enclosure 608-2 prior to contacting the PCBA 602.
The SSD can include a controller 722 and a number of memory devices 724-1, . . . , 724-Z. The controller 722 (e.g., an SSD controller), such as a processing device, can be coupled to the number of memory devices 724-1, . . . , 724-Z. The controller 722 can receive a request to store data at the number of memory devices 724-1, . . . , 724-Z and/or retrieve data from the number of memory devices 724-1, . . . , 724-Z. The controller 722 can transmit a command to one or more of the number of memory devices 724-1, . . . , 724-Z to store or retrieve data.
The host 720 can utilize the SSD to store data at a number of memory devices 724-1, . . . , 724-Z and/or to retrieve data from the number of memory devices 724-1, . . . , 724-Z. The number of memory devices 724-1, . . . , 724-Z can include non-volatile memory and/or volatile memory.
Although specific embodiments have been illustrated and described herein, those of ordinary skill in the art will appreciate that an arrangement calculated to achieve the same results can be substituted for the specific embodiments shown. This disclosure is intended to cover adaptations or variations of various embodiments of the present disclosure. It is to be understood that the above description has been made in an illustrative fashion, and not a restrictive one. Combination of the above embodiments, and other embodiments not specifically described herein will be apparent to those of skill in the art upon reviewing the above description. The scope of the various embodiments of the present disclosure includes other applications in which the above structures and methods are used. Therefore, the scope of various embodiments of the present disclosure should be determined with reference to the appended claims, along with the full range of equivalents to which such claims are entitled.
In the foregoing Detailed Description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the disclosed embodiments of the present disclosure have to use more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.
