Claims
- 1. A method of manufacturing a thermo-sensitive resistor comprising:
- providing a cylindrical or plate shape electrically insulating substrate;
- forming an initial thin-film heating resistor on a surface of said substrate;
- adjusting the resistance of said initial thin-film heating resistor to form a final thin-film heating resistor, said adjusting being performed by increasing or decreasing a film thickness of said initial thin-film heating resistor by means of an electroplating method or an electroless plating method without changing a width of said initial thin-film heating resistor; and
- electrically connecting lead wires to said thin-film heating resistor, said lead wires being used to electrically connect said resistor with external elements and to mechanically support said thermo-sensitive rsistor.
- 2. A method according to claim 1, further comprising forming a glass coat layer on said final thin-film heating resistor.
- 3. A method according to claim 1, wherein said initial thin-film heating resistor is formed on said substrate by at least one method selected from the group consisting of sputtering, evaporation or plating.
- 4. A method according to claim 1, wherein said initial thin-film resistor is formed from at least one material selected from the group consisting of Pt, Au, Cr, Mo, W, Ni and combinations thereof.
- 5. A method of manufacturing a thermo-sensitive resistor comprising:
- providing a cylindrical or plate shape electrically insulating substrate;
- forming a photoresist on an outer surface of said insulating substrate;
- depositing a thin-film heating resistor layer on the outer surface of said insulating substrate and on a surface of said photoresist;
- burning out said photoresist to form an initial thin-film heating resistor having a desired shape;
- connecting lead wires electrically to said initial thin-film heating resistor and mechanically to said insulating substrate via a conductive paste to form an assembly;
- heating said assembly;
- adjusting the resistance of said initial thin-film heating resistor to form a final thin-film heating resistor, said adjusting being performed by increasing or decreasing a film thickness of said initial thin-film heating resistor by means of an electroplating method or an electroless plating method without changing a width of said initial thin-film heating resistor; and
- reheating said assembly.
- 6. A method according to claim 5, further comprising forming a glass coat layer on said final thin-film heating resistor.
- 7. A method according to claim 5, wherein said initial thin-film heating resistor is formed on said substrate by at least one method selected from the group consisting of sputtering, evaporation or plating.
- 8. A method according to claim 5, wherein said initial thin-film resistor is formed from at least one material selected from the group consisting of Pt, Au, Cr, Mo, W, Ni and combinations thereof.
- 9. A method of manufacturing a thermo-sensitive resistor comprising:
- providing a cylindrical or plate shape electrically insulating substrate;
- forming an initial thin-film heating resistor on a surface of said substrate;
- electrically connecting lead wires to said thin-film heating resistor, said lead wires being used to electrically connect said resistor with external elements and to mechanically support said thermo-sensitive resistor; and
- adjusting the resistance of said initial thin-film heating resistor, while said resistance is continuously monitored through said lead wires, to form a final thin-film heating resistor, said adjusting being performed by increasing or decreasing a film thickness of said initial thin-film heating resistor by means of an electroplating method or an electroless plating method without changing a width of said initial thin-film heating resistor.
- 10. A method according to claim 9, further comprising forming a glass coat layer on said final thin-film heating resistor.
- 11. A method according to claim 9, wherein said initial thin-film heating resistor is formed on said substrate by at least one method selected from the group consisting of sputtering, evaporation or plating.
- 12. A method according to claim 9, wherein said initial thin-film resistor is formed from at least one material selected from the group consisting of Pt, Au, Cr, Mo, W, Ni and combinations thereof.
- 13. A method of manufacturing a thermo-sensitive resistor comprising:
- providing a cylindrical or plate shape electrically insulating substrate;
- forming a photoresist on an outer surface of said insulating substrate;
- depositing a thin-film heating resistor layer on the outer surface of said insulating substrate and on a surface of said photoresist;
- burning out said photoresist to form an initial thin-film heating resistor having a desired shape;
- connecting lead wires electrically to said initial thin-film heating resistor and mechanically to said insulating substrate via a conductive paste to form an assembly;
- heating said assembly;
- adjusting the resistance of said initial thin-film heating resistor, while said resistance is continuously monitored through said lead wires, to form a final thin-film heating resistor, said adjusting being performed by increasing or decreasing a film thickness of said initial thin-film heating resistor by means of an electroplating method or an electroless plating method without changing a width of said initial thin-film heating resistor; and
- reheating said assembly.
- 14. A method according to claim 13, further comprising forming a glass coat layer on said final thin-film heating resistor.
- 15. A method according to claim 13, wherein said initial thin-film heating resistor is formed on said substrate by at least one method selected from the group consisting of sputtering, evaporation or plating.
- 16. A method according to claim 13, wherein said initial thin-film resistor is formed from at least one material selected from the group consisting of Pt, Au, Cr, Mo, W, Ni and combinations thereof.
Priority Claims (1)
Number |
Date |
Country |
Kind |
61-103178 |
May 1986 |
JPX |
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Parent Case Info
This application is a continuation-in-part of U.S. application Ser. No. 07/035,433 filed Apr. 7, 1987, which is now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (3)
Number |
Date |
Country |
207835 |
Dec 1982 |
JPX |
62-62041 |
Dec 1987 |
JPX |
1250202 |
Oct 1971 |
GBX |
Non-Patent Literature Citations (1)
Entry |
Chemical Abstracts, vol. 79, No. 24, 12/17/73, p. 241. |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
035433 |
Apr 1987 |
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